Solder Joint Rework Simulation Analysis
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Solder Joint Rework Simulation Analysis
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Author :
language : en
Publisher:
Release Date : 1990
Solder Joint Rework Simulation Analysis written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1990 with Solder and soldering categories.
Solder Joint Reliability Assessment
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Author : Mohd N. Tamin
language : en
Publisher: Springer Science & Business
Release Date : 2014-04-26
Solder Joint Reliability Assessment written by Mohd N. Tamin and has been published by Springer Science & Business this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-04-26 with Technology & Engineering categories.
This book presents a systematic approach in performing reliability assessment of solder joints using Finite Element (FE) simulation. Essential requirements for FE modelling of an electronic package or a single reflowed solder joint subjected to reliability test conditions are elaborated. These cover assumptions considered for a simplified physical model, FE model geometry development, constitutive models for solder joints and aspects of FE model validation. Fundamentals of the mechanics of solder material are adequately reviewed in relation to FE formulations. Concept of damage is introduced along with deliberation of cohesive zone model and continuum damage model for simulation of solder/IMC interface and bulk solder joint failure, respectively. Applications of the deliberated methodology to selected problems in assessing reliability of solder joints are demonstrated. These industry-defined research-based problems include solder reflow cooling, temperature cycling and mechanical fatigue of a BGA package, JEDEC board-level drop test and mechanisms of solder joint fatigue. Emphasis is placed on accurate quantitative assessment of solder joint reliability through basic understanding of the mechanics of materials as interpreted from results of FE simulations. The FE simulation methodology is readily applicable to numerous other problems in mechanics of materials and structures.
Fatigue Life Prediction Of Solder Joints In Electronic Packages With Ansys
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Author : Erdogan Madenci
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-12-06
Fatigue Life Prediction Of Solder Joints In Electronic Packages With Ansys written by Erdogan Madenci and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-06 with Technology & Engineering categories.
Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® describes the method in great detail starting from the theoretical basis. The reader is supplied with an add-on software package to ANSYS® that is designed for solder joint fatigue reliability analysis of electronic packages. Specific steps of the analysis method are discussed through examples without leaving any room for confusion. The add-on package along with the examples make it possible for an engineer with a working knowledge of ANSYS® to perform solder joint reliability analysis. Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® allows the engineers to conduct fatigue reliability analysis of solder joints in electronic packages.
Monthly Catalogue United States Public Documents
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Author :
language : en
Publisher:
Release Date : 1991-05
Monthly Catalogue United States Public Documents written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1991-05 with Government publications categories.
Monthly Catalog Of United States Government Publications
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Author :
language : en
Publisher:
Release Date :
Monthly Catalog Of United States Government Publications written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on with Government publications categories.
Principles Of Reliable Soldering Techniques
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Author : R. Sengupta
language : en
Publisher: New Age International
Release Date : 1997
Principles Of Reliable Soldering Techniques written by R. Sengupta and has been published by New Age International this book supported file pdf, txt, epub, kindle and other format this book has been release on 1997 with categories.
Soldering, Though Being An Age Old Phenomenon, Is Still Perhaps A Difficult Subject To Understand, Due To Its Interdisciplinary Nature. In This Book, Efforts Have Been Made To Describe The Physical Theories Responsible For Making A Good Joint, The Chemical Actions During Its Formation And The Electrical, Thermal And Mechanical Requirements Essential To Ensure Its Reliability. The Four M'S; Material, Machine, Method And Man, Necessary For Designing A Solder Joint Have Been Described In Detail. Further, Process Control, Solder Joint Inspection Criteria, Solder Joint Defect Analysis And Its Repair/Rework Are Also Discussed.Additionally, Brief Introductions To Surface Mount Devices (Smd) And Surface Mount Technology (Smt) Have Been Included A Annexures. The Book Will Be Useful In Industry, And To Design Production, Process Planning And Quality Control Engineers, As Well As In Engineering/Technical Colleges To Students As A Reference Book For The Present And, Hopefully, Future Modified Courses. The Academicians May Find This Book Useful For Redesigning The Present Diploma (Electronics), B.Sc. (Electronics), B.Sc. (Instrumentation), B.E. And M.E. / M.Tech (Electrical, Electronic, Instrumentation) Syllabus.
Proceedings Of The Green Materials And Electronic Packaging Interconnect Technology Symposium
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Author : Mohd Arif Anuar Mohd Salleh
language : en
Publisher: Springer Nature
Release Date : 2023-07-02
Proceedings Of The Green Materials And Electronic Packaging Interconnect Technology Symposium written by Mohd Arif Anuar Mohd Salleh and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2023-07-02 with Science categories.
This book presents peer reviewed articles from the Green Materials and Electronic Packaging Interconnect Technology Symposium, (EPITS 2022), held in Langkawi, Malaysia on 14th and 15th of Sept, 2022. It brings together packaging experts to share and exchange ideas in electronics technology. Topics covered in this volume include, but are not limited to; (1) Green materials and technology, (2) Emerging interconnect materials and technologies,(3) Non-solder interconnect materials at chip and package levels, (4) Fundamental materials behavior for electronic packaging materials, (5) Advanced characterization methods as applied to electronic packaging technology, (6) Developments in high temperature Pb-free solders and associated interconnects for automotive and power electronics, (7) Surface coating materials & (8) Advanced materials.
Solder Joint Reliability Prediction For Multiple Environments
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Author : Andrew E. Perkins
language : en
Publisher: Springer Science & Business Media
Release Date : 2008-12-16
Solder Joint Reliability Prediction For Multiple Environments written by Andrew E. Perkins and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2008-12-16 with Technology & Engineering categories.
Solder Joint Reliability Prediction for Multiple Environments will provide industry engineers, graduate students and academic researchers, and reliability experts with insights and useful tools for evaluating solder joint reliability of ceramic area array electronic packages under multiple environments. The material presented here is not limited to ceramic area array packages only, it can also be used as a methodology for relating numerical simulations and experimental data into an easy-to-use equation that captures the essential information needed to predict solder joint reliability. Such a methodology is often needed to relate complex information in a simple manner to managers and non-experts in solder joint who work with computer server applications as well as for harsh environments such as those found in the defense, space, and automotive industries.
Mechanics Of Solder Alloy Interconnects
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Author : Darrel R. Frear
language : en
Publisher: Springer Science & Business Media
Release Date : 1994-01-31
Mechanics Of Solder Alloy Interconnects written by Darrel R. Frear and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 1994-01-31 with Computers categories.
The Mechanics of Solder Alloy Interconnects is a resource to be used in developing a solder joint reliability assessment. Each chapter is written to be used as a stand-alone resource for a particular aspect of materials and modeling issues. With this gained understanding, the reader in search of a solution to a solder joint reliability problem knows where in the materials and modeling communities to go for the appropriate answer.
Advanced Reliability Modeling
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Author : Tadashi Dohi
language : en
Publisher: World Scientific
Release Date : 2004
Advanced Reliability Modeling written by Tadashi Dohi and has been published by World Scientific this book supported file pdf, txt, epub, kindle and other format this book has been release on 2004 with Technology & Engineering categories.
The 2004 Asian International Workshop on Advanced Reliability Modeling is a symposium for the dissemination of state-of-the-art research and the presentation of practice in reliability engineering and related issues in Asia. It brings together researchers, scientists and practitioners from Asian countries to discuss the state of research and practice in dealing with reliability issues at the system design (modeling) level, and to jointly formulate an agenda for future research in this engineering area. The proceedings cover all the key topics in reliability, maintainability and safety engineering, providing an in-depth presentation of theory and practice.The proceedings have been selected for coverage in: ? Index to Scientific & Technical Proceedings? (ISTP? / ISI Proceedings)? Index to Scientific & Technical Proceedings (ISTP CDROM version / ISI Proceedings)? CC Proceedings ? Engineering & Physical Sciences