Advanced Processing Of Semiconductor Devices Ii

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Advanced Processing And Manufacturing Technologies For Nanostructured And Multifunctional Materials Ii Volume 36 Issue 6

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Author : Tatsuki Ohji
language : en
Publisher: John Wiley & Sons
Release Date : 2016-01-05

Advanced Processing And Manufacturing Technologies For Nanostructured And Multifunctional Materials Ii Volume 36 Issue 6 written by Tatsuki Ohji and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2016-01-05 with Technology & Engineering categories.

The Ceramic Engineering and Science Proceeding has been published by The American Ceramic Society since 1980. This series contains a collection of papers dealing with issues in both traditional ceramics (i.e., glass, whitewares, refractories, and porcelain enamel) and advanced ceramics. Topics covered in the area of advanced ceramic include bioceramics, nanomaterials, composites, solid oxide fuel cells, mechanical properties and structural design, advanced ceramic coatings, ceramic armor, porous ceramics, and more.

Advanced Metallization And Processing For Semiconductor Devices And Circuits Ii Volume 260

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Author : Avishay Katz
language : en
Publisher:
Release Date : 1992-10-28

Advanced Metallization And Processing For Semiconductor Devices And Circuits Ii Volume 260 written by Avishay Katz and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1992-10-28 with Technology & Engineering categories.

The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.

Advanced Mechatronics And Mems Devices Ii

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Author : Dan Zhang
language : en
Publisher: Springer
Release Date : 2016-10-18

Advanced Mechatronics And Mems Devices Ii written by Dan Zhang and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2016-10-18 with Technology & Engineering categories.

This book introduces the state-of-the-art technologies in mechatronics, robotics, and MEMS devices in order to improve their methodologies. It provides a follow-up to "Advanced Mechatronics and MEMS Devices" (2013) with an exploration of the most up-to-date technologies and their applications, shown through examples that give readers insights and lessons learned from actual projects. Researchers on mechatronics, robotics, and MEMS as well as graduate students in mechanical engineering will find chapters on: Fundamental design and working principles on MEMS accelerometers Innovative mobile technologies Force/tactile sensors development Control schemes for reconfigurable robotic systems Inertial microfluidics Piezoelectric force sensors and dynamic calibration techniques ...And more. Authors explore applications in the areas of agriculture, biomedicine, advanced manufacturing, and space. Micro-assembly for current and future industries is also considered, as well as the design and development of micro and intelligent manufacturing.

Gan And Related Materials Ii

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Author : Stephen J. Pearton
language : en
Publisher: CRC Press
Release Date : 2000-10-31

Gan And Related Materials Ii written by Stephen J. Pearton and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2000-10-31 with Science categories.

The first GaN and Related Materials covered topics such as a historical survey of past research, optical electrical and microstructural characterization, theory of defects, bulk crystal growth, and performance of electronic and photonic devices. This new volume updates old research where warranted and explores new areas such as UV detectors, microwave electronics, and Er-doping. This unique follow-up features contributions from leading experts that cover the full spectrum of growth.

Guidebook For Managing Silicon Chip Reliability

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Author : Michael Pecht
language : en
Publisher: CRC Press
Release Date : 2017-11-22

Guidebook For Managing Silicon Chip Reliability written by Michael Pecht and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-11-22 with Technology & Engineering categories.

Achieving cost-effective performance over time requires an organized, disciplined, and time-phased approach to product design, development, qualification, manufacture, and in-service management. Guidebook for Managing Silicon Chip Reliability examines the principal failure mechanisms associated with modern integrated circuits and describes common practices used to resolve them. This quick reference on semiconductor reliability addresses the key question: How will the understanding of failure mechanisms affect the future? Chapters discuss: failure sites, operational loads, and failure mechanism intrinsic device sensitivities electromigration hot carrier aging time dependent dielectric breakdown mechanical stress induced migration alpha particle sensitivity electrostatic discharge (ESD) and electrical overstress latch-up qualification screening guidelines for designing reliability Guidebook for Managing Silicon Chip Reliability focuses on device failure and causes throughout - providing a thorough framework on how to model the mechanism, test for defects, and avoid and manage damage. It will serve as an exceptional resource for electrical engineers as well as mechanical engineers working in the field of electronic packaging.

Advanced Processing And Manufacturing Technologies For Structural And Multifunctional Materials Ii

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Author : Tatsuki Ohji
language : en
Publisher: John Wiley & Sons
Release Date : 2009-02-11

Advanced Processing And Manufacturing Technologies For Structural And Multifunctional Materials Ii written by Tatsuki Ohji and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2009-02-11 with Technology & Engineering categories.

This volume provides a one-stop resource, compiling current research on advanced processing and manufacturing technologies for structural and multifunctional materials. It is a collection of papers from The American Ceramic Society s 32nd International Conference on Advanced Ceramics and Composites, January 27-February 1, 2008. Topics include advanced processing and manufacturing technologies for a wide variety of non-oxide and oxide based structural ceramics, ultra-high temperature ceramics and composites, particulate and fiber reinforced composites, and multifunctional materials. This is a valuable, up-to-date resource for researchers in the field.

Simulation Of Semiconductor Devices And Processes

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Author : Siegfried Selberherr
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-12-06

Simulation Of Semiconductor Devices And Processes written by Siegfried Selberherr and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-06 with Computers categories.

The "Fifth International Conference on Simulation of Semiconductor Devices and Processes" (SISDEP 93) continues a series of conferences which was initiated in 1984 by K. Board and D. R. J. Owen at the University College of Wales, Swansea, where it took place a second time in 1986. Its organization was succeeded by G. Baccarani and M. Rudan at the University of Bologna in 1988, and W. Fichtner and D. Aemmer at the Federal Institute of Technology in Zurich in 1991. This year the conference is held at the Technical University of Vienna, Austria, September 7 - 9, 1993. This conference shall provide an international forum for the presentation of out standing research and development results in the area of numerical process and de vice simulation. The miniaturization of today's semiconductor devices, the usage of new materials and advanced process steps in the development of new semiconduc tor technologies suggests the design of new computer programs. This trend towards more complex structures and increasingly sophisticated processes demands advanced simulators, such as fully three-dimensional tools for almost arbitrarily complicated geometries. With the increasing need for better models and improved understand ing of physical effects, the Conference on Simulation of Semiconductor Devices and Processes brings together the simulation community and the process- and device en gineers who need reliable numerical simulation tools for characterization, prediction, and development.

Handbook Of Semiconductor Manufacturing Technology

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Author : Yoshio Nishi
language : en
Publisher: CRC Press
Release Date : 2017-12-19

Handbook Of Semiconductor Manufacturing Technology written by Yoshio Nishi and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-12-19 with Technology & Engineering categories.

Retaining the comprehensive and in-depth approach that cemented the bestselling first edition's place as a standard reference in the field, the Handbook of Semiconductor Manufacturing Technology, Second Edition features new and updated material that keeps it at the vanguard of today's most dynamic and rapidly growing field. Iconic experts Robert Doering and Yoshio Nishi have again assembled a team of the world's leading specialists in every area of semiconductor manufacturing to provide the most reliable, authoritative, and industry-leading information available. Stay Current with the Latest Technologies In addition to updates to nearly every existing chapter, this edition features five entirely new contributions on... Silicon-on-insulator (SOI) materials and devices Supercritical CO2 in semiconductor cleaning Low-κ dielectrics Atomic-layer deposition Damascene copper electroplating Effects of terrestrial radiation on integrated circuits (ICs) Reflecting rapid progress in many areas, several chapters were heavily revised and updated, and in some cases, rewritten to reflect rapid advances in such areas as interconnect technologies, gate dielectrics, photomask fabrication, IC packaging, and 300 mm wafer fabrication. While no book can be up-to-the-minute with the advances in the semiconductor field, the Handbook of Semiconductor Manufacturing Technology keeps the most important data, methods, tools, and techniques close at hand.

Advanced Power Electronics Converters

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Author : Euzeli dos Santos
language : en
Publisher: John Wiley & Sons
Release Date : 2014-11-24

Advanced Power Electronics Converters written by Euzeli dos Santos and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-11-24 with Technology & Engineering categories.

This book covers power electronics, in depth, by presenting the basic principles and application details, which can be used both as a textbook and reference book. Introduces a new method to present power electronics converters called Power Blocks Geometry (PBG) Applicable for courses focusing on power electronics, power electronics converters, and advanced power converters Offers a comprehensive set of simulation results to help understand the circuits presented throughout the book

Springer Handbook Of Semiconductor Devices

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Author : Massimo Rudan
language : en
Publisher: Springer Nature
Release Date : 2022-11-10

Springer Handbook Of Semiconductor Devices written by Massimo Rudan and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2022-11-10 with Technology & Engineering categories.

This Springer Handbook comprehensively covers the topic of semiconductor devices, embracing all aspects from theoretical background to fabrication, modeling, and applications. Nearly 100 leading scientists from industry and academia were selected to write the handbook's chapters, which were conceived for professionals and practitioners, material scientists, physicists and electrical engineers working at universities, industrial R&D, and manufacturers. Starting from the description of the relevant technological aspects and fabrication steps, the handbook proceeds with a section fully devoted to the main conventional semiconductor devices like, e.g., bipolar transistors and MOS capacitors and transistors, used in the production of the standard integrated circuits, and the corresponding physical models. In the subsequent chapters, the scaling issues of the semiconductor-device technology are addressed, followed by the description of novel concept-based semiconductor devices. The last section illustrates the numerical simulation methods ranging from the fabrication processes to the device performances. Each chapter is self-contained, and refers to related topics treated in other chapters when necessary, so that the reader interested in a specific subject can easily identify a personal reading path through the vast contents of the handbook.