Advances In Electronic Circuit Packaging Volume 1
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Advances In Electronic Circuit Packaging Volume 1
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Author : University of Colorado (Boulder campus)
language : en
Publisher:
Release Date : 1962
Advances In Electronic Circuit Packaging Volume 1 written by University of Colorado (Boulder campus) and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1962 with categories.
Advances In Electronic Circuit Packaging
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Author : Lawrence L. Rosine
language : en
Publisher: Springer
Release Date : 1963-01-01
Advances In Electronic Circuit Packaging written by Lawrence L. Rosine and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 1963-01-01 with Technology & Engineering categories.
Advances In Electronic Circuit Packaging 1
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Author :
language : en
Publisher:
Release Date : 1960
Advances In Electronic Circuit Packaging 1 written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1960 with categories.
Advances In Electronic Circuit Packaging
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Author : Lawrence L. Rosine
language : en
Publisher: Springer
Release Date : 2013-12-01
Advances In Electronic Circuit Packaging written by Lawrence L. Rosine and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-12-01 with Technology & Engineering categories.
Advances In Electronic Circuit Packaging
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Author : Gerald A. Walker
language : en
Publisher: Springer
Release Date : 2013-12-11
Advances In Electronic Circuit Packaging written by Gerald A. Walker and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-12-11 with Technology & Engineering categories.
Advances In Electronic Circuit Packaging
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Author : Lawrence L. Rosine
language : en
Publisher:
Release Date : 1965
Advances In Electronic Circuit Packaging written by Lawrence L. Rosine and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1965 with Electronic packaging categories.
Electronic Materials Handbook
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Author :
language : en
Publisher: ASM International
Release Date : 1989-11-01
Electronic Materials Handbook written by and has been published by ASM International this book supported file pdf, txt, epub, kindle and other format this book has been release on 1989-11-01 with Technology & Engineering categories.
Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.
Advances In Electronic Packaging
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Author :
language : en
Publisher:
Release Date : 2005
Advances In Electronic Packaging written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2005 with Electronic packaging categories.
Advances In Electronic Circuit Packaging
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Author :
language : en
Publisher:
Release Date : 1963
Advances In Electronic Circuit Packaging written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1963 with categories.
Advances In Electronic Circuit Packaging Volume 2
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Author : University of Colorado (Boulder campus)
language : en
Publisher:
Release Date : 1962
Advances In Electronic Circuit Packaging Volume 2 written by University of Colorado (Boulder campus) and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1962 with categories.