C U
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Cu In1 Xgax Se2 Based Thin Film Solar Cells
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Author : Subba Ramaiah Kodigala
language : en
Publisher: Academic Press
Release Date : 2011-01-03
Cu In1 Xgax Se2 Based Thin Film Solar Cells written by Subba Ramaiah Kodigala and has been published by Academic Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011-01-03 with Science categories.
Cu(In1-xGax)Se2 Based Thin Film Solar Cells provides valuable contents about the fabrication and characterization of chalcopyrite Cu(In1-xGax)Se2 based thin film solar cells and modules. The growth of chalcopyrite Cu(In1-xGax)(S1-ySey)2 absorbers, buffers, window layers, antireflection coatings, and finally metallic grids, which are the sole components of solar cells, is clearly illustrated. The absorber, which contains multiple elements, segregates secondary phases if the growth conditions are not well optimized i.e., the main drawback in the fabrication of solar cells. More importantly the solutions for the growth of thin films are given in detail. The properties of all the individual layers and single crystals including solar cells analyzed by different characterization techniques such as SEM, AFM, XPS, AES, TEM, XRD, optical, photoluminescence, and Raman spectroscopy are explicitly demonstrated. The electrical analyses such as conductivities, Hall mobilities, deep level transient spectroscopy measurements etc., provide a broad picture to understand thin films or single crystals and their solar cells. The book clearly explains the working principle of energy conversion from solar to electrical with basic sciences for the chalcopyrite based thin film solar cells. Also, it demonstrates important criteria on how to enhance efficiency of the solar cells and modules. The effect of environmental factors such as temperature, humidity, aging etc., on the devices is mentioned by citing several examples. Illustrates a number of growth techniques to prepare thin film layers for solar cells Discusses characterization techniques such as XRD, TEM, XPS, AFM, SEM, PL, CL, Optical measurements, and Electrical measurements Includes I-V, C-V measurements illustrations Provides analysis of solar cell efficiency Presents current trends in thin film solar cells research and marketing
Cu Organocopper Compounds
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Author :
language : en
Publisher: Springer Science & Business Media
Release Date : 2013-06-29
Cu Organocopper Compounds written by and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-06-29 with Science categories.
Organocopper reagents have found wide use in synthetic organic chemistry during the past few decades. Structural elucidation has not yet received much attention in organocopper chemistry and the aggregation of most products is unknown. This last volume brings to an end the series of organocopper compounds and contains an Empirical Formula and Ligand Formula Index for about 3000 organocopper compounds and reagents described in Parts 1 to 4.
Cu Organocopper Compounds
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Author : Helmut Bauer
language : en
Publisher: Springer Science & Business Media
Release Date : 2013-06-29
Cu Organocopper Compounds written by Helmut Bauer and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-06-29 with Science categories.
The present volume finalizes the coverage of organocopper compounds. A complete formula and ligand index for the Gmelin organocopper series will appear shortly as" Organa copper Compounds" 5. The volume describes mononuclear compounds with ligands bonded by two or more carbon atoms as well as all di- to octanuclear and polymeric compounds. Mononuclear compounds with ligands bonded by one carbon atom have already been described in Vol umes 1 (published in 1985), 2 (published in 1983), and 3 (published in 1986). As structural elucidation in organocopper chemistry gained more attention only in the last few years, the terms "mononuclear", "dinuclear" etc. have been used as explained in "Organocopper Compounds" 1, 1985, pp. 3/4: all compounds are treated with their small est formula unit unless a higher nuclearity has been proved. As a consequence, most of the species treated in volumes 1 to 3 are described there because of insufficient structural information although they are alleged not to be monomeric. This way, many of the better characterized compounds appear in the present volume which is reflected by the more than eighty X-ray structure figures. Generally, nuclearity and structure are not only deter mined by the coordination properties of the ligands, but also by steric requirements, and may therefore widely differ for analogous compounds. For abbreviations and dimensions used throughout this volume, see p. X. Frankfurt am Main, July 1987 Johannes Fussel Remarks on Abbreviations and Dimensions Most compounds and reagents in this volume are presented in tables.
A Review Of The Alumina Ag Cu Ti Active Metal Brazing Process
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Author : Tahsin Ali Kassam
language : en
Publisher: CRC Press
Release Date : 2018-10-30
A Review Of The Alumina Ag Cu Ti Active Metal Brazing Process written by Tahsin Ali Kassam and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-10-30 with Technology & Engineering categories.
A Review of the Alumina/Ag-Cu-Ti Active Metal Brazing Process is based on the PhD thesis entitled "The Effects of Alumina Purity, Ticusil® Braze Preform Thickness and Post-grinding Heat Treatment, on the Microstructure, Mechanical and Nanomechanical Properties of Alumina-to-Alumina Brazed Joints" which was awarded by Imperial College London’s CASC Steering Group as the 2017 recipient of the Professor Sir Richard Brook Prize (sponsored by Morgan Advanced Materials plc) for Best Ceramics PhD Thesis in the UK. It focusses on the alumina/Ag-Cu-Ti system to cover the active metal brazing of ceramics, variables involved in the process, and the effects of these variables on wetting, interfacial reaction layer formation, and joint strength. The comprehensive review brings together findings from the literature into one place, and presents key concepts in a concise and easy- to-read manner.
Superconducting Glass Ceramics In Bi Sr Ca Cu 0 Fabrication And Its Application
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Author : Yoshihiro Abe
language : en
Publisher: World Scientific
Release Date : 1997-12-04
Superconducting Glass Ceramics In Bi Sr Ca Cu 0 Fabrication And Its Application written by Yoshihiro Abe and has been published by World Scientific this book supported file pdf, txt, epub, kindle and other format this book has been release on 1997-12-04 with Science categories.
High Tc oxide superconductors such as Bi(Pb)-Sr-Ca-Cu-O (BSCCO) and Y-Ba-Cu-O (YBCO) systems are usually fabricated by sintering given mixtures of raw materials. Generally, sintering processing takes a longer heating time and the products are mechanically low strength and cannot be formed into complex shapes such as a coil, a curved fine tube or a fine rod. Another way to produce the ceramics is a glass-ceramic process in which the glasses prepared by melt-quenching are reheated for crystallization. A given mixture of raw materials in BSCCO is easily melted and quenched to form a given shape of glass, while that in YBCO is not glassified.This invaluable book has been written by authors from five countries. It presents a unique way to fabricate superconducting ceramics in BSCCO by glass-ceramic processing.
Nanostructure Formation And Thermal Stability Of Cu And Cu Based Alloys
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Author : Mohsen Samadi Khoshkhoo
language : en
Publisher: Cuvillier Verlag
Release Date : 2015-01-12
Nanostructure Formation And Thermal Stability Of Cu And Cu Based Alloys written by Mohsen Samadi Khoshkhoo and has been published by Cuvillier Verlag this book supported file pdf, txt, epub, kindle and other format this book has been release on 2015-01-12 with Science categories.
Nanostructured materials are materials with grain size smaller than 100 nm. Due to the very small grain size, a large fraction of atoms belong to the grain-boundaries. As a result, their properties are significantly different compared to their coarse-grained counterparts. Generally, a considerable improvement in the properties is observed when the size is reduced to nanometer dimensions. These include high strength and hardness, improved ductility and toughness, as well as enhanced diffusivity, which make this category of materials of particular interest for a wide range of applications. The properties of nanocrystalline materials are strongly affected by their structure and defects density, which in turn are determined by the method of production. As a result, the knowledge of the mechanism of nanostructure formation is a prerequisite for the structure/property optimization.
High Cycle Fatigue Of Al And Cu Thin Films By A Novel High Throughput Method
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Author : Sofie Burger
language : en
Publisher: KIT Scientific Publishing
Release Date : 2014-05-19
High Cycle Fatigue Of Al And Cu Thin Films By A Novel High Throughput Method written by Sofie Burger and has been published by KIT Scientific Publishing this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-05-19 with Technology & Engineering categories.
In the last two decades, the reliability of small electronic devices used in automotive or consumer electronics gained researchers attention. Thus, there is the need to understand the fatigue properties and damage mechanisms of thin films. In this thesis a novel high-throughput testing method for thin films on Si substrate is presented. The specialty of this method is to test one sample at different strain amplitudes at the same time and measure an entire lifetime curve with only one experiment.
Vanillin Aminoquinoline Schiff Bases And Their Co Ii Ni Ii And Cu Ii Complexes
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Author : Dr. S. N. Battin
language : en
Publisher: Lulu.com
Release Date :
Vanillin Aminoquinoline Schiff Bases And Their Co Ii Ni Ii And Cu Ii Complexes written by Dr. S. N. Battin and has been published by Lulu.com this book supported file pdf, txt, epub, kindle and other format this book has been release on with categories.
Investigations On Microstructure And Mechanical Properties Of The Cu Pb Free Solder Joint Interfaces
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Author : Qingke Zhang
language : en
Publisher: Springer
Release Date : 2015-10-31
Investigations On Microstructure And Mechanical Properties Of The Cu Pb Free Solder Joint Interfaces written by Qingke Zhang and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2015-10-31 with Science categories.
This thesis presents a series of mechanical test methods and comprehensively investigates the deformation and damage behavior of Cu/Pb-free solder joints under different loading conditions. The fracture behavior of Pb-free joint interfaces induced by stress, deformation of solder and substrate are shown, the shear fracture strength of the Cu6Sn5 IMC is measured experimentally for the first time, and the dynamic damage process and microstructure evolution behavior of Pb-free solder joints are revealed intuitively. The thesis puts forward the argument that the local cumulative damage is the major cause of failure in solder joints. The research results provide the experimental and theoretical basis for improving the reliability of solder joints.
Tensile Strength Of Simulated And Welded Butt Joints In W Cu Composite Sheet
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Author : Thomas J. Moore
language : en
Publisher:
Release Date : 1994
Tensile Strength Of Simulated And Welded Butt Joints In W Cu Composite Sheet written by Thomas J. Moore and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1994 with Composite materials categories.