Circuits Micro Lectroniques

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Analyse Et Caract Risation Des Couplages Substrat Et De La Connectique Dans Les Circuits 3d

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Author : Fengyuan Sun
language : en
Publisher: Editions Publibook
Release Date : 2016

Analyse Et Caract Risation Des Couplages Substrat Et De La Connectique Dans Les Circuits 3d written by Fengyuan Sun and has been published by Editions Publibook this book supported file pdf, txt, epub, kindle and other format this book has been release on 2016 with categories.

The proposal of doubling the number of transistors on an IC chip (with minimum costs and subtle innovations) every 24 months by Gordon Moore in 1965 (the so-called called Moore's law) has been the most powerful driver for the emphasis of the microelectronics industry in the past 50 years. This law enhances lithography scaling and integration, in 2D, of all functions on a single chip, increasingly through system-on-chip (SOC). On the other hand, the integration of all these functions can be achieved through 3D integrations . Generally speaking, 3D integration consists of 3D IC packaging, 3D IC integration, and 3D Si integration. They are different and mostly the TSV (through-silicon via) separates 3D IC packaging from 3D IC/Si integrations since the latter two uses TSVs, but 3D IC packaging does not. TSV (with a new concept that every chip or interposer could have two surfaces with circuits) is the heart of 3D IC/Si integrations. Continued technology scaling together with the integration of disparate technologies in a single chip means that device performance continues to outstrip interconnect and packaging capabilities, and hence there exist many difficult engineering challenges, most notably in power management, noise isolation, and intra and inter-chip communication. 3D Si integration is the right way to go and compete with Moore's law (more than Moore versus more Moore). However, it is still a long way to go. In this book, Fengyuan SUN proposes new substrate network extraction techniques. Using this latter, the substrate coupling and loss in IC's can be analyzed. He implements some Green/TLM (Transmission Line Matrix) algorithms in MATLAB. It permits to extract impedances between any number of embedded contacts or/and TSVS. He does investigate models of high aspect ratio TSV, on both analytical and numerical methods electromagnetic simulations. This model enables to extract substrate and TSV impedance, S parameters and parasitic elements, considering the variable resistivity of the substrate. It is full compatible with SPICE-like solvers and should allow an investigation in depth of TSV impact on circuit performance.

Working Documents

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Author : European Parliament
language : en
Publisher:
Release Date : 1980

Working Documents written by European Parliament and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1980 with Europe categories.

Trade Marks Journal

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Author :
language : en
Publisher:
Release Date : 2000

Trade Marks Journal written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2000 with Trademarks categories.

International Journal Of Electrical Engineering Education

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Author :
language : en
Publisher:
Release Date : 1971

International Journal Of Electrical Engineering Education written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1971 with Electric engineering categories.

Micromachined Thin Film Sensors For Soi Cmos Co Integration

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Author : Jean Laconte
language : en
Publisher: Springer Science & Business Media
Release Date : 2006-10-11

Micromachined Thin Film Sensors For Soi Cmos Co Integration written by Jean Laconte and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2006-10-11 with Technology & Engineering categories.

Co-integration of sensors with their associated electronics on a single silicon chip may provide many significant benefits regarding performance, reliability, miniaturization and process simplicity without significantly increasing the total cost. Micromachined Thin-Film Sensors for SOI-CMOS Co-integration covers the challenges and interests and demonstrates the successful co-integration of gas-flow sensors on dielectric membrane, with their associated electronics, in CMOS-SOI technology. We firstly investigate the extraction of residual stress in thin layers and in their stacking and the release, in post-processing, of a 1 μm-thick robust and flat dielectric multilayered membrane using Tetramethyl Ammonium Hydroxide (TMAH) silicon micromachining solution. The optimization of its selectivity towards aluminum is largely demonstrated. The second part focuses on sensors design and characteristics. A novel loop-shape polysilicon microheater is designed and built in a CMOS-SOI standard process. High thermal uniformity, low power consumption and high working temperature are confirmed by extensive measurements. The additional gas flow sensing layers are judiciously chosen and implemented. Measurements in the presence of a nitrogen flow and gas reveal fair sensitivity on a large flow velocity range as well as good response to many gases. Finally, MOS transistors suspended on released dielectric membranes are presented and fully characterized as a concluding demonstrator of the co-integration in SOI technology.

Reports

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Author : European Parliament
language : en
Publisher:
Release Date : 1980

Reports written by European Parliament and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1980 with European communities categories.

Electronics Manufacturers Directory

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Author :
language : en
Publisher:
Release Date : 1993

Electronics Manufacturers Directory written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1993 with Electronic industries categories.

Ma Triser Les Mutations Techniques L Humanit Face Aux Changements

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Author : Charles Maccio
language : fr
Publisher: FeniXX
Release Date : 1989-12-31T23:00:00+01:00

Ma Triser Les Mutations Techniques L Humanit Face Aux Changements written by Charles Maccio and has been published by FeniXX this book supported file pdf, txt, epub, kindle and other format this book has been release on 1989-12-31T23:00:00+01:00 with Social Science categories.

Nous vivons une période d'accélération de l'Histoire. Les événements nous bousculent, le progrès technique modifie nos habitudes de vie. Devant cette situation, nous avons à choisir entre plusieurs attitudes : fuir, pour ne plus voir la réalité ; nous adapter, en nous coulant dans le moule de ce monde en changement, mais alors nous subissons notre destin ; anticiper, c'est-à-dire prévoir à court terme les évolutions, à partir des données que nous possédons, afin que ce soit l'Homme qui donne un sens aux mutations en cours. Pour nous aider à apprendre à anticiper, il nous faut, d'abord, prendre conscience des enjeux de tout ce qui bouge autour de nous, et en quoi nous sommes interpellés personnellement. Des points de repère sont proposés, pour aider dans cette démarche. Une grille d'analyse complète, détaillée, progressive, est fournie grâce aux cinq cercles des mutations techniques, afin de mieux situer, d'une part notre place dans les changements en cours et, d'autre part, où se trouvent les changements globaux dans la société. Le premier cercle situe les sciences et les techniques : elles sont au cœur des mutations depuis l'origine du monde. Le deuxième cercle nous fait découvrir la téléinformatique, qui est le résultat de l'interaction de l'informatique, de la télématique, et de l'audiovisuel. Elle est la base de la troisième révolution industrielle. Le troisième cercle montre l'environnement informatique qui en découle : robotique, bureautique, CAO, PAO, etc. Le quatrième cercle nous conduit à percevoir l'impact de ces cercles sur les autres branches, que l'on appelle souvent les nouvelles technologies : biotechnologie, nouveaux matériaux, laser, etc. Le cinquième cercle nous aide à prendre conscience de l'importance de l'intégration des nouvelles technologies dans les anciennes, c'est-à-dire celles de la première révolution industrielle : chemin de fer, et de la deuxième : automobile, aviation, etc. Après ce panorama, nous voyons que la technique n'est rien sans la personne, et que nous devons œuvrer pour rester maîtres de notre destin, pour continuer la création du monde.

Kompass

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Author :
language : en
Publisher:
Release Date : 1994

Kompass written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1994 with Business enterprises categories.

Canadian Almanac And Legal And Court Directory

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Author :
language : en
Publisher:
Release Date : 1998

Canadian Almanac And Legal And Court Directory written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1998 with categories.