Cracking Assemblies
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Cracking Assemblies
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Author : Margaret Cooling
language : en
Publisher:
Release Date : 1998-05-01
Cracking Assemblies written by Margaret Cooling and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1998-05-01 with categories.
Cracking Assemblies 2
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Author : Margaret Cooling
language : en
Publisher:
Release Date : 2000-01-01
Cracking Assemblies 2 written by Margaret Cooling and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2000-01-01 with Bible categories.
Cracking Assemblies
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Author : Margaret Cooling
language : en
Publisher:
Release Date : 1998-01-01
Cracking Assemblies written by Margaret Cooling and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1998-01-01 with Bible categories.
X86 Software Reverse Engineering Cracking And Counter Measures
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Author : Stephanie Domas
language : en
Publisher: John Wiley & Sons
Release Date : 2024-01-02
X86 Software Reverse Engineering Cracking And Counter Measures written by Stephanie Domas and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2024-01-02 with Computers categories.
A crystal-clear and practical blueprint to software disassembly x86 Software Reverse-Engineering, Cracking, and Counter-Measures is centered around the world of disassembling software. It will start with the basics of the x86 assembly language, and progress to how that knowledge empowers you to reverse-engineer and circumvent software protections. No knowledge of assembly, reverse engineering, or software cracking is required. The book begins with a bootcamp on x86, learning how to read, write, and build in the assembly that powers a massive amount of the world’s computers. Then the book will shift to reverse engineering applications using a handful of industry favorites such as IDA, Ghidra, Olly, and more. Next, we move to cracking with techniques such as patching and key generation, all harnessing the power of assembly and reverse engineering. Lastly, we’ll examine cracking from a defensive perspective. Providing learners with techniques to be a better defender of their own software, or knowledge to crack these techniques more effectively. Assembly: computer Architecture, x86, system calls, building and linking, ASCII, condition codes, GDB, control flow, stack, calling conventions Reverse Engineering: reconnaissance, strings, RE strategy, stripping, linking, optimizations, compilers, industry tools Cracking: patching, key checkers, key generators, resource hacking, dependency walking Defense: anti-debugging, anti-tamper, packing, cryptors/decryptors, whitelist, blacklist, RASP, code signing, obfuscation A practical and hands-on resource for security professionals to hobbyists, this book is for anyone who wants to learn to take apart, understand, and modify black-box software. x86 Software Reverse-Engineering, Cracking, and Counter-Measures is a vital resource for security researchers, reverse engineers and defenders who analyze, research, crack or defend software applications.
Assembly Cracks In A Hybrid Nylon And Steel Planter Wheel
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Author : C. Wilson
language : en
Publisher:
Release Date : 2000
Assembly Cracks In A Hybrid Nylon And Steel Planter Wheel written by C. Wilson and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2000 with Assembly cracks categories.
In a typical bolted joint, cracks can exist in the fastener, the nut, and either of the two members included in the grip of the fastener. In this paper, the assembly of a hybrid nylon and steel agricultural wheel is studied. Three different cracking problems in the nylon wheel half occurred in the current assembly process. A case study is presented in which the cracking problems arising during the manufacturing and assembly of the hybrid nylon and steel agricultural wheels are addressed. Initially, the cause was thought to be a material processing or fracture mechanics problems. A combination of testing and analysis showed that the root cause was inadequate machine design. After a redesign, cracking problems were eliminated.
Monitoring Crack Growth In Experimental Pickering Rolled Joint Assemblies By The Potential Drop Technique
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Author : H. Licht
language : en
Publisher:
Release Date : 1977
Monitoring Crack Growth In Experimental Pickering Rolled Joint Assemblies By The Potential Drop Technique written by H. Licht and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1977 with categories.
Identification Of Flaws Responsible For Crack Initiation And Micromechanisms Of Slow Crack Growth In The Delayed Fracture Of Alumina
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Author : George Sines
language : en
Publisher:
Release Date : 1982
Identification Of Flaws Responsible For Crack Initiation And Micromechanisms Of Slow Crack Growth In The Delayed Fracture Of Alumina written by George Sines and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1982 with categories.
An eccentricially loaded column testing system was developed to produce a number of crack initiations on the surface of an alumina specimen. Using a specially developed fluorescent dye penetration technique, direct observations of early stages of crack extension from inherent flaws were made in the testing system. It was found that a larger number of inherent flaws exist on the surface of a ceramic and can, by themselves or as assemblies, become potential crack origins. Cracking sites were found to be multiple in delayed fracture. The initial stage of delayed fracture was shown to involve the interaction and coalescence of near-by flaws with extensive intergranular cracking. A model for the delayed fracture, the microscopic slow crack growth and crack interaction and coalescence was proposed. The model gives much better prediction of fracture times than does the conventional single-worst-crack approach. It was found that an assembly of microscopic cracks, which may not be observable, can be much more dangerous than a single macroscopic crack in delayed fracture and that the coalescence of the microscopic cracks may occur in a very short time without being identified because a critical amount of slow crack growth from the individual inherent flaws can be very small. (Author).
Cracking The Codes
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Author : Barry D. Yatt
language : en
Publisher: John Wiley & Sons
Release Date : 1998-07-27
Cracking The Codes written by Barry D. Yatt and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 1998-07-27 with Architecture categories.
Unleash the design potential in codes Building codes and standards are often seen as obstacles to design excellence. Not any more! With the help of this down-to-earth guide, architecture professionals and students can stop dreading these rules and start using them to their advantage. Cracking the Codes makes codes and standards accessible by promoting a sound understanding of regulatory issues --without getting caught up in the minutiae. The book works the way projects do, moving through each stage of the planning process to identify and consolidate the basic regulatory requirements that must be addressed at every step along the way. It equips readers not only to recognize issues that call for regulatory research and to work effectively with appropriate consultants, but also to suggest strategic directions that are compatible with regulatory requirements and to make informed decisions in response to consultants' advice. In addition to the model building codes, including the forthcoming International Building Code, this book covers zoning ordinances and covenants, as well as rules related to accessibility, historic preservation, environmental quality, consumer protection, and a host of other critical issues. Information is extensively cross-referenced to make topics simple to find, and the uniform methodology applied to each regulatory issue makes the book both easy to follow and design-friendly. No project team should ever be held hostage by lack of familiarity with codes and standards. Cracking the Codes gives architects the freedom they need to break the rules without breaking the regulations.
Study Of Interfacial Crack Propagation In Flip Chip Assemblies With Nano Filled Underfill Materials
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Author : Sakethraman Mahalingam
language : en
Publisher:
Release Date : 2005
Study Of Interfacial Crack Propagation In Flip Chip Assemblies With Nano Filled Underfill Materials written by Sakethraman Mahalingam and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2005 with Composite materials categories.
No-flow underfill materials that cure during the solder reflow process is a relatively new technology. Although there are several advantages in terms of cost, time and processing ease, there are several reliability challenges associated with no-flow underfills. When micron-sized filler particles are introduced in no-flow underfills to enhance the solder bump reliability, such filler particles could prevent the solder bumps making reliable electrical contacts with the substrate pads during solder reflow, and therefore, the assembly yield would be adversely affected. The use of nano-sized filler particles can potentially improve assembly yield while offering the advantages associated with filled underfill materials. The objective of this thesis is to study the thermo-mechanical reliability of nano-filled epoxy underfills (NFU) through experiments and theoretical modeling. In this work, the thermo-mechanical properties of NFUs with 20-nm filler particles have been measured. An innovative residual stress test method has been developed to measure the interfacial fracture toughness. Using the developed residual stress method and the single-leg bending test, the mode-mixity-dependent fracture toughness for NFU-SiN interface has been determined. In addition to such monotonic interfacial fracture characterization, the interface crack propagation under thermo-mechanical fatigue loading has been experimentally characterized, and a model for fatigue interface crack propagation has been developed. A test vehicle comprising of several flip chips was assembled using the NFU material and the reliability of the flip-chip assemblies was assessed under thermal shock cycles between -40oC and 125oC. The NFU-SiN interfacial delamination propagation and the solder bump reliability were monitored. In parallel, numerical models were developed to study the interfacial delamination propagation in the flip chip assembly using conventional interfacial fracture mechanics as well as cohesive zone modeling. Predictions for interfacial delamination propagation using the two approaches have been compared. Based on the theoretical models and the experimental data, guidelines for design of NFUs against interfacial delamination have been developed.
Cracking And Damage
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Author : Z.P. Bazant
language : en
Publisher: CRC Press
Release Date : 1989-05-30
Cracking And Damage written by Z.P. Bazant and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 1989-05-30 with Architecture categories.
Proceedings of the France-US Workshop on Strain Localization and Size Effect due to Cracking and Damage, Laboratorie de Mecanique et Technologie, Cachan, France, 6-9 September 1988.