Electromagnetic Compatibility Modeling For Integrated Circuits
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Electromagnetic Compatibility Modeling For Integrated Circuits
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Author : 黃冠翔
language : en
Publisher:
Release Date : 2014
Electromagnetic Compatibility Modeling For Integrated Circuits written by 黃冠翔 and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014 with Integrated circuits categories.
Electromagnetic Compatibility Modeling For Integrated Circuits
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Author : Kuan Hsiang Nick Huang
language : en
Publisher: Open Dissertation Press
Release Date : 2017-01-27
Electromagnetic Compatibility Modeling For Integrated Circuits written by Kuan Hsiang Nick Huang and has been published by Open Dissertation Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-01-27 with categories.
This dissertation, "Electromagnetic Compatibility Modeling for Integrated Circuits" by Kuan Hsiang, Nick, Huang, 黃冠翔, was obtained from The University of Hong Kong (Pokfulam, Hong Kong) and is being sold pursuant to Creative Commons: Attribution 3.0 Hong Kong License. The content of this dissertation has not been altered in any way. We have altered the formatting in order to facilitate the ease of printing and reading of the dissertation. All rights not granted by the above license are retained by the author. Abstract: The integrated circuit (IC) packaging electromagnetic compatibility (EMC)/signal integrity (SI)/power integrity (PI) problems have been broadly attested. But IC packaging electromagnetic interference (EMI) was seldom addressed. Because the electromagnetic emission from IC packagings becomes more critical as the data rate of digital system continues increasing. Its working mechanism and modeling technology are very important. In this thesis, EM emission behaviors of IC packaging are systematically studied for the first time. It was never seen from other literatures. The fundamental principles and properties of electromagnetic radiations caused by heat sinks, vias, traces, and pin maps in IC packaging structures are carefully investigated and modeled. Both theoretical analysis based on first principles and simulated results based on numerical full wave solvers are provided to find out critical impact factors to IC packaging EMI. This work establishes basic modeling components for comprehensive radiation studies. It directly benefits fundamental understandings and guideline development for the optimization of the packaging EMI reduction. Some measurement results are also included to support concluded characterizations and analysis. A summary for IC packaging EMI design rules is discussed in details to conclude the derived design guidelines. Second, a novel data pattern based electromagnetic superposition method is developed to model the IC packaging electromagnetic emission. It employs the equivalence principle to obtain the electromagnetic field response over a broad spectrum. Then it uses the linear property of the passive parasitic system to superimpose the contribution of different signals on the packaging. As a result, with certain pre-calculations, it is convenient to compute the electromagnetic emission efficiently from different signals with various signal pattern combinations, which benefits identifying the worst case scenario. The proposed method can be implemented between different tools for specific purposes. In addition, data reconstruction can be evaluated through the phase shift, and it benefits identifying the EMI of any pulse bit pattern. This work offers great convenience for the post-processing, and allows the flexibility of real digital pulse signals. It provides a basic modeling framework for comprehensive radiation studies for IC packaging and PCB EMI reductions. Third, the performance of IC interconnects has been stretched tremendously in recently years by high speed IC systems. Their EM emission and SI modelings have to consider the existence of I/O active devices, such as buffers and drivers. The I/O model is difficult to obtain due to the IP protection and limited information. We proposed to use the X-parameter to model the IC interconnect system. Based on the PHD formalism, X-parameter models provide an accurate frequency-domain method under large-signal operating points to characterize their nonlinear behaviors. Starting from modeling the CMOS inverter, the whole link modeling primarily based on X-parameter for the pulse digital signals was presented. I/O modeling can also be investigated by the proposed new method to understand the impedance effects at high speed serial links. It is the first complete examination of the X-parameter to IC interconnect SI analysis. The nonlinear I/O property represented by IBIS models is also investigated to model
Basis Of Electromagnetic Compatibility Of Integrated Circuits
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Author : Alexandre Boyer
language : en
Publisher:
Release Date : 2017-09-07
Basis Of Electromagnetic Compatibility Of Integrated Circuits written by Alexandre Boyer and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-09-07 with categories.
Electromagnetic Compatibility Of Integrated Circuits
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Author : Sonia Ben Dhia
language : en
Publisher: Springer Science & Business Media
Release Date : 2006-06-04
Electromagnetic Compatibility Of Integrated Circuits written by Sonia Ben Dhia and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2006-06-04 with Technology & Engineering categories.
Electromagnetic Compatibility of Integrated Circuits: Techniques for Low Emission and Susceptibility focuses on the electromagnetic compatibility of integrated circuits. The basic concepts, theory, and an extensive historical review of integrated circuit emission and susceptibility are provided. Standardized measurement methods are detailed through various case studies. EMC models for the core, I/Os, supply network, and packaging are described with applications to conducted switching noise, signal integrity, near-field and radiated noise. Case studies from different companies and research laboratories are presented with in-depth descriptions of the ICs, test set-ups, and comparisons between measurements and simulations. Specific guidelines for achieving low emission and susceptibility derived from the experience of EMC experts are presented.
2017 11th International Workshop On The Electromagnetic Compatibility Of Integrated Circuits Emccompo
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Author : IEEE Staff
language : en
Publisher:
Release Date : 2017-07-04
2017 11th International Workshop On The Electromagnetic Compatibility Of Integrated Circuits Emccompo written by IEEE Staff and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-07-04 with categories.
Measurement and modeling of IC emissions and susceptibility, Signal Integrity and Power Integrity at IC and PCB level EMC aware IC Design and Guidelines, Tools to handle EMC at IC level Computational Electromagnetics for IC level EMC EMC issues in System on chip (SoC), System inPackage (SiP), and 3D ICs, EMC issues in smart power ICs EMC of ICs in wireless communications, EMC of ICs for biomedical applications, Materials for improved EMC of ICs, Harsh environment effects on IC level EMC, Long term electromagnetic robustness of ICs, Standards and regulations up to 6 GHz, Modern EMC education on IC level EMC, Influence of IC EMC on system design, Intentional Electromagnetic Interference
Electrical Modeling And Design For 3d System Integration
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Author : Er-Ping Li
language : en
Publisher: John Wiley & Sons
Release Date : 2012-03-19
Electrical Modeling And Design For 3d System Integration written by Er-Ping Li and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-03-19 with Technology & Engineering categories.
New advanced modeling methods for simulating the electromagnetic properties of complex three-dimensional electronic systems Based on the author's extensive research, this book sets forth tested and proven electromagnetic modeling and simulation methods for analyzing signal and power integrity as well as electromagnetic interference in large complex electronic interconnects, multilayered package structures, integrated circuits, and printed circuit boards. Readers will discover the state of the technology in electronic package integration and printed circuit board simulation and modeling. In addition to popular full-wave electromagnetic computational methods, the book presents new, more sophisticated modeling methods, offering readers the most advanced tools for analyzing and designing large complex electronic structures. Electrical Modeling and Design for 3D System Integration begins with a comprehensive review of current modeling and simulation methods for signal integrity, power integrity, and electromagnetic compatibility. Next, the book guides readers through: The macromodeling technique used in the electrical and electromagnetic modeling and simulation of complex interconnects in three-dimensional integrated systems The semi-analytical scattering matrix method based on the N-body scattering theory for modeling of three-dimensional electronic package and multilayered printed circuit boards with multiple vias Two- and three-dimensional integral equation methods for the analysis of power distribution networks in three-dimensional package integrations The physics-based algorithm for extracting the equivalent circuit of a complex power distribution network in three-dimensional integrated systems and printed circuit boards An equivalent circuit model of through-silicon vias Metal-oxide-semiconductor capacitance effects of through-silicon vias Engineers, researchers, and students can turn to this book for the latest techniques and methods for the electrical modeling and design of electronic packaging, three-dimensional electronic integration, integrated circuits, and printed circuit boards.
Emc Ic Modelling Models Of Integrated Circuits For Emi Behavioural Simulation Conducted Emissions Modelling Icem Ce
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Author : British Standards Institute Staff
language : en
Publisher:
Release Date : 1910-02-28
Emc Ic Modelling Models Of Integrated Circuits For Emi Behavioural Simulation Conducted Emissions Modelling Icem Ce written by British Standards Institute Staff and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1910-02-28 with categories.
Integrated circuits, Printed-circuit boards, Electromagnetic compatibility, Noise (spurious signals), Electronic equipment and components, Mathematical models, Simulation, Emission, Electromagnetic fields, Electrical conductance, Electric terminals
2019 12th International Workshop On The Electromagnetic Compatibility Of Integrated Circuits Emc Compo
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Author : IEEE Staff
language : en
Publisher:
Release Date : 2019-10-21
2019 12th International Workshop On The Electromagnetic Compatibility Of Integrated Circuits Emc Compo written by IEEE Staff and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-10-21 with categories.
The workshop will presents the state ofarts on IC electromagnetic compatibility related issues, not only fundamental improvements in modeling and measurement, but also novel design methodologies and standards
2015 10th International Workshop On The Electromagnetic Compatibility Of Integrated Circuits Emc Compo
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Author : IEEE Staff
language : en
Publisher:
Release Date : 2015-11-10
2015 10th International Workshop On The Electromagnetic Compatibility Of Integrated Circuits Emc Compo written by IEEE Staff and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2015-11-10 with categories.
The achievements in terms of operating frequency and integration of semiconductor technology are constantly creating new challenges in EMC, which must necessarily be addressed at both the integrated circuit and system level Keeping up to date is of paramount importance to be successful in this field The 10th International Workshop EMC Compo 2015 is intended to be a place for exchange of the latest research achievements and experience in IC level EMC and it is addressed to researchers and Engineers from industry and from academia The workshop is focused on emission and susceptibility issues in digital, analogue and mixed signal integrated circuits The most recent advances in simulation and measurement techniques, models, standards, tools and design methodologies will be discussed A Technical Exhibition will also be held James Clerk Maxwell was born in Edinburgh and there will be an opportunity for delegates to visit his birthplace, in recognition of 150 years of his equations
Modeling And Design Of Electromagnetic Compatibility For High Speed Printed Circuit Boards And Packaging
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Author : Xing-Chang Wei
language : en
Publisher: CRC Press
Release Date : 2017-09-19
Modeling And Design Of Electromagnetic Compatibility For High Speed Printed Circuit Boards And Packaging written by Xing-Chang Wei and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-09-19 with Computers categories.
Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging presents the electromagnetic modelling and design of three major electromagnetic compatibility (EMC) issues related to the high-speed printed circuit board (PCB) and electronic packages: signal integrity (SI), power integrity (PI), and electromagnetic interference (EMI). The emphasis is put on two essential passive components of PCBs and packages: the power distribution network and the signal distribution network. This book includes two parts. Part one talks about the field-circuit hybrid methods used for the EMC modeling, including the modal method, the integral equation method, the cylindrical wave expansion method and the de-embedding method. Part two illustrates EMC design methods and explores the applications of novel metamaterials and two-dimensional materials on traditional EMC problems. This book is designed to enhance worthwhile electromagnetic theory and mathematical methods for practical engineers and to train students with advanced EMC applications.