Electronic Packaging Strategies For The 80s
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Electronic Packaging Strategies For The 80s
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Author :
language : en
Publisher:
Release Date : 1982
Electronic Packaging Strategies For The 80s written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1982 with Microelectronic packaging categories.
Digital Design
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Author :
language : en
Publisher:
Release Date : 1982
Digital Design written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1982 with Digital electronics categories.
Cooling Of Electronic Systems
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Author : Sadik Kakaç
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-12-06
Cooling Of Electronic Systems written by Sadik Kakaç and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-06 with Technology & Engineering categories.
Electronic technology is developing rapidly and, with it, the problems associated with the cooling of microelectronic equipment are becoming increasingly complex. So much so that it is necessary for experts in the fluid and thermal sciences to become involved with the cooling problem. Such thoughts as these led to an approach to leading specialists with a request to contribute to the present book. Cooling of Electronic Systems presents the technical progress achieved in the fundamentals of the thermal management of electronic systems and thermal strategies for the design of microelectronic equipment. The book starts with an introduction to the cooling of electronic systems, involving such topics as trends in computer system cooling, the cooling of high performance computers, thermal design of microelectronic components, natural and forced convection cooling, cooling by impinging air and liquid jets, thermal control systems for high speed computers, together with a detailed review of advances in manufacturing and assembly technology. Following this, practical methods for the determination of the parameters required for the thermal analysis of electronic systems and the accurate prediction of temperature in consumer electronics. Cooling of Electronic Systems is currently the most up-to-date book on the thermal management of electronic and microelectronic equipment, and the subject is presented by eminent scientists and experts in the field. Vital reading for all designers of modern, high-speed computers.
Semiconductor Packaging
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Author : Andrea Chen
language : en
Publisher: CRC Press
Release Date : 2016-04-19
Semiconductor Packaging written by Andrea Chen and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2016-04-19 with Technology & Engineering categories.
In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages.
Advanced Electronic Packaging
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Author : Richard K. Ulrich
language : en
Publisher: John Wiley & Sons
Release Date : 2006-02-24
Advanced Electronic Packaging written by Richard K. Ulrich and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2006-02-24 with Technology & Engineering categories.
As in the First Edition, each chapter in this new Second Edition is authored by one or more acknowledged experts and then carefully edited to ensure a consistent level of quality and approach throughout. There are new chapters on passive devices, RF and microwave packaging, electronic package assembly, and cost evaluation and assembly, while organic and ceramic substrates are now covered in separate chapters. All the hallmarks of the First Edition, which became an industry standard and a popular graduate-level textbook, have been retained. An Instructor's Manual presenting detailed solutions to all the problems in the book is available upon request from the Wiley Makerting Department.
Failure Modes And Mechanisms In Electronic Packages
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Author : P. Singh
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-12-06
Failure Modes And Mechanisms In Electronic Packages written by P. Singh and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-06 with Technology & Engineering categories.
With the proliferation of packaging technology, failure and reliability have become serious concerns. This invaluable reference details processes that enable detection, analysis and prevention of failures. It provides a comprehensive account of the failures of device packages, discrete component connectors, PCB carriers and PCB assemblies.
Conquering The Electron
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Author : Derek Cheung
language : en
Publisher: Rowman & Littlefield
Release Date : 2020-02-24
Conquering The Electron written by Derek Cheung and has been published by Rowman & Littlefield this book supported file pdf, txt, epub, kindle and other format this book has been release on 2020-02-24 with History categories.
Conquering the Electron offers readers a true and engaging history of the world of electronics, beginning with the discoveries of static electricity and magnetism and ending with the creation of the smartphone and the iPad. This book shows the interconnection of each advance to the next on the long journey to our modern-day technologies. Exploring the combination of genius, infighting, and luck that powered the creation of today's electronic age, Conquering the Electron debunks the hero worship so often plaguing the stories of great advances. Want to know how AT&T’s Bell Labs developed semiconductor technology—and how its leading scientists almost came to blows in the process? Want to understand how radio and television work—and why RCA drove their inventors to financial ruin and early graves? Conquering the Electron offers these stories and more, presenting each revolutionary technological advance right alongside blow-by-blow personal battles that all too often took place.
Electronic Packaging And Production
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Author :
language : en
Publisher:
Release Date : 1994
Electronic Packaging And Production written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1994 with Electronic apparatus and appliances categories.
Journal Of Electronic Packaging
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Author :
language : en
Publisher:
Release Date : 1992
Journal Of Electronic Packaging written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1992 with Electronic packaging categories.
National Union Catalog
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Author :
language : en
Publisher:
Release Date : 1982
National Union Catalog written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1982 with Catalogs, Union categories.
Includes entries for maps and atlases.