High Performance Computing For The Electromagnetic Modeling And Simulation Of Interconnects
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High Performance Computing For The Electromagnetic Modeling And Simulation Of Interconnects
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Author : National Aeronautics and Space Administration (NASA)
language : en
Publisher: Createspace Independent Publishing Platform
Release Date : 2018-07-08
High Performance Computing For The Electromagnetic Modeling And Simulation Of Interconnects written by National Aeronautics and Space Administration (NASA) and has been published by Createspace Independent Publishing Platform this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-07-08 with categories.
The electromagnetic modeling of packages and interconnects plays a very important role in the design of high-speed digital circuits, and is most efficiently performed by using computer-aided design algorithms. In recent years, packaging has become a critical area in the design of high-speed communication systems and fast computers, and the importance of the software support for their development has increased accordingly. Throughout this project, our efforts have focused on the development of modeling and simulation techniques and algorithms that permit the fast computation of the electrical parameters of interconnects and the efficient simulation of their electrical performance. Schutt-Aine, Jose E. Ames Research Center...
Electrical Modeling And Design For 3d System Integration
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Author : Er-Ping Li
language : en
Publisher: John Wiley & Sons
Release Date : 2012-03-19
Electrical Modeling And Design For 3d System Integration written by Er-Ping Li and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-03-19 with Technology & Engineering categories.
New advanced modeling methods for simulating the electromagnetic properties of complex three-dimensional electronic systems Based on the author's extensive research, this book sets forth tested and proven electromagnetic modeling and simulation methods for analyzing signal and power integrity as well as electromagnetic interference in large complex electronic interconnects, multilayered package structures, integrated circuits, and printed circuit boards. Readers will discover the state of the technology in electronic package integration and printed circuit board simulation and modeling. In addition to popular full-wave electromagnetic computational methods, the book presents new, more sophisticated modeling methods, offering readers the most advanced tools for analyzing and designing large complex electronic structures. Electrical Modeling and Design for 3D System Integration begins with a comprehensive review of current modeling and simulation methods for signal integrity, power integrity, and electromagnetic compatibility. Next, the book guides readers through: The macromodeling technique used in the electrical and electromagnetic modeling and simulation of complex interconnects in three-dimensional integrated systems The semi-analytical scattering matrix method based on the N-body scattering theory for modeling of three-dimensional electronic package and multilayered printed circuit boards with multiple vias Two- and three-dimensional integral equation methods for the analysis of power distribution networks in three-dimensional package integrations The physics-based algorithm for extracting the equivalent circuit of a complex power distribution network in three-dimensional integrated systems and printed circuit boards An equivalent circuit model of through-silicon vias Metal-oxide-semiconductor capacitance effects of through-silicon vias Engineers, researchers, and students can turn to this book for the latest techniques and methods for the electrical modeling and design of electronic packaging, three-dimensional electronic integration, integrated circuits, and printed circuit boards.
Modeling And Design Of Electromagnetic Compatibility For High Speed Printed Circuit Boards And Packaging
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Author : Xing-Chang Wei
language : en
Publisher: CRC Press
Release Date : 2017-09-19
Modeling And Design Of Electromagnetic Compatibility For High Speed Printed Circuit Boards And Packaging written by Xing-Chang Wei and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-09-19 with Computers categories.
Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging presents the electromagnetic modelling and design of three major electromagnetic compatibility (EMC) issues related to the high-speed printed circuit board (PCB) and electronic packages: signal integrity (SI), power integrity (PI), and electromagnetic interference (EMI). The emphasis is put on two essential passive components of PCBs and packages: the power distribution network and the signal distribution network. This book includes two parts. Part one talks about the field-circuit hybrid methods used for the EMC modeling, including the modal method, the integral equation method, the cylindrical wave expansion method and the de-embedding method. Part two illustrates EMC design methods and explores the applications of novel metamaterials and two-dimensional materials on traditional EMC problems. This book is designed to enhance worthwhile electromagnetic theory and mathematical methods for practical engineers and to train students with advanced EMC applications.
Modeling And Simulation Of High Speed Vlsi Interconnects
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Author : Michel S. Nakhla
language : en
Publisher: Springer Science & Business Media
Release Date : 2011-06-28
Modeling And Simulation Of High Speed Vlsi Interconnects written by Michel S. Nakhla and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011-06-28 with Technology & Engineering categories.
Modeling and Simulation of High Speed VLSI Interconnects brings together in one place important contributions and state-of-the-art research results in this rapidly advancing area. Modeling and Simulation of High Speed VLSI Interconnects serves as an excellent reference, providing insight into some of the most important issues in the field.
Computational Methods In Large Scale Simulation
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Author : Heow-pueh Lee
language : en
Publisher: World Scientific
Release Date : 2005-10-26
Computational Methods In Large Scale Simulation written by Heow-pueh Lee and has been published by World Scientific this book supported file pdf, txt, epub, kindle and other format this book has been release on 2005-10-26 with Mathematics categories.
This volume documents the research carried out by visiting scientists attached to the Institute for Mathematical Sciences (IMS) at the National University of Singapore and the Institute of High Performance Computing (IHPC) under the program “Advances and Mathematical Issues in Large Scale Simulation.” From 2002 to 2003, researchers from various countries gathered to initiate interesting and innovative work on various themes related to multiscale simulation and fast algorithms.Today, modeling and simulation are used extensively to solve complex problems and to reduce the use of experimentation during the design and analysis stage. It is important to know the various issues that have to be considered in the successful development of computational methodologies for such work.This volume is a compilation of the research by various visiting scientists in the area of modeling and multiscale simulation. Each article covers a major project and documents how computational methodology, mathematical modeling, high performance computing and simulation are combined in a multiscale scheme to solve a variety of complex problems. Some of these include the design, synthesis, processing, characterization and manufacture of nanomaterials and nanostructures, new algorithms for computational work, and grid computing.Through the included examples, readers can realize the vast potential of computational modeling and large scale simulation for the solution of problems in a variety of disciplines and applications.
Advances In Electromagnetic Modelling Through High Performance Computing
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Author : L. Lee
language : en
Publisher:
Release Date : 2006
Advances In Electromagnetic Modelling Through High Performance Computing written by L. Lee and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2006 with categories.
Under the DOE SciDAC project on Accelerator Science and Technology, a suite of electromagnetic codes has been under development at SLAC that are based on unstructured grids for higher accuracy, and use parallel processing to enable large-scale simulation. The new modeling capability is supported by SciDAC collaborations on meshing, solvers, refinement, optimization and visualization. These advances in computational science are described and the application of the parallel eigensolver Omega3P to the cavity design for the International Linear Collider is discussed.
Timing Analysis And Simulation For Signal Integrity Engineers
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Author : Greg Edlund
language : en
Publisher: Pearson Education
Release Date : 2007-10-22
Timing Analysis And Simulation For Signal Integrity Engineers written by Greg Edlund and has been published by Pearson Education this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007-10-22 with Technology & Engineering categories.
Every day, companies call upon their signal integrity engineers to make difficult decisions about design constraints and timing margins. Can I move these wires closer together? How many holes can I drill in this net? How far apart can I place these chips? Each design is unique: there’s no single recipe that answers all the questions. Today’s designs require ever greater precision, but design guides for specific digital interfaces are by nature conservative. Now, for the first time, there’s a complete guide to timing analysis and simulation that will help you manage the tradeoffs between signal integrity, performance, and cost. Writing from the perspective of a practicing SI engineer and team lead, Greg Edlund of IBM presents deep knowledge and quantitative techniques for making better decisions about digital interface design. Edlund shares his insights into how and why digital interfaces fail, revealing how fundamental sources of pathological effects can combine to create fault conditions. You won’t just learn Edlund’s expert techniques for avoiding failures: you’ll learn how to develop the right approach for your own projects and environment. Coverage includes • Systematically ensure that interfaces will operate with positive timing margin over the product’s lifetime–without incurring excess cost • Understand essential chip-to-chip timing concepts in the context of signal integrity • Collect the right information upfront, so you can analyze new designs more effectively • Review the circuits that store information in CMOS state machines–and how they fail • Learn how to time common-clock, source synchronous, and high-speed serial transfers • Thoroughly understand how interconnect electrical characteristics affect timing: propagation delay, impedance profile, crosstalk, resonances, and frequency-dependent loss • Model 3D discontinuities using electromagnetic field solvers • Walk through four case studies: coupled differential vias, land grid array connector, DDR2 memory data transfer, and PCI Express channel • Appendices present a refresher on SPICE modeling and a high-level conceptual framework for electromagnetic field behavior Objective, realistic, and practical, this is the signal integrity resource engineers have been searching for. Preface xiii Acknowledgments xvi About the Author xix About the Cover xx Chapter 1: Engineering Reliable Digital Interfaces 1 Chapter 2: Chip-to-Chip Timing 13 Chapter 3: Inside IO Circuits 39 Chapter 4: Modeling 3D Discontinuities 73 Chapter 5: Practical 3D Examples 101 Chapter 6: DDR2 Case Study 133 Chapter 7: PCI Express Case Study 175 Appendix A: A Short CMOS and SPICE Primer 209 Appendix B: A Stroll Through 3D Fields 219 Endnotes 233 Index 235
Electromagnetism And Interconnections
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Author : Stephane Charruau
language : en
Publisher: John Wiley & Sons
Release Date : 2013-03-01
Electromagnetism And Interconnections written by Stephane Charruau and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-03-01 with Science categories.
This book covers the theoretical problems of modeling electrical behavior of the interconnections encountered in everyday electronic products. The coverage shows the theoretical tools of waveform prediction at work in the design of a complex and high-speed digital electronic system. Scientists, research engineers, and postgraduate students interested in electromagnetism, microwave theory, electrical engineering, or the development of simulation tools software for high speed electronic system design automation will find this book an illuminating resource.
High Performance Scientific And Engineering Computing
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Author : Michael Breuer
language : en
Publisher: Springer Science & Business Media
Release Date : 2002-01-22
High Performance Scientific And Engineering Computing written by Michael Breuer and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2002-01-22 with Computers categories.
In Douglas Adams' book 'Hitchhiker's Guide to the Galaxy', hyper-intelligent beings reached a point in their existence where they wanted to understand the purpose of their own existence and the universe. They built a supercomputer, called Deep Thought, and upon completion, they asked it for the answer to the ultimate question of life, the universe and everything else. The computer worked for several millennia on the answers to all these questions. When the day arrived for hyper-intelligent beings the to receive the answer, they were stunned, shocked and disappointed to hear that the answer was simply 42. The still open questions to scientists and engineers are typically much sim pler and consequently the answers are more reasonable. Furthermore, because human beings are too impatient and not ready to wait for such a long pe riod, high-performance computing techniques have been developed, leading to much faster answers. Based on these developments in the last two decades, scientific and engineering computing has evolved to a key technology which plays an important role in determining, or at least shaping, future research and development activities in many branches of industry. Development work has been going on all over the world resulting in numerical methods that are now available for simulations that were not foreseeable some years ago. However, these days the availability of supercomputers with Teraflop perfor mance supports extensive computations with technical relevance. A new age of engineering has started.
Physics Based High Performance Computing Using Higher Order Methods For Broadband Applications In Computational Electromagnetics Cem
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Author :
language : en
Publisher:
Release Date : 2004
Physics Based High Performance Computing Using Higher Order Methods For Broadband Applications In Computational Electromagnetics Cem written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2004 with categories.
Under sponsorship from various Department of Defense (DoD) organizations and a cooperative Research and Development Agreement (CRADA) with the U.S. Research Development and Engineering Command, Army Research Laboratory (RDECOM-ARL) HyPerComp has significantly advanced the state of the art of time-domain, and broad band electromagnetic simulations. The TEMPUS (Time-Domain ElectroMagnetic Parallel Unstructured Simulator) environment is a complete self contained code suite that includes computer aided design (CAD) geometry creation and repair unstructured gridding for fell-scale targets with general materials scalable parallel code architecture higher-order accurate discontinuous Galerkin solvers for Maxwell's equations and post processing utilities for solution visualization and exaction of final results like bistatic and monostatic radar cross section (RCS) synthetic aperture radar (SAR) images and high-range-resolution (HRR) profiles. The high-performance TEMPUS environment is well suited for modeling a variety of targets and electromagnetic problems of interest to the U.S. Army such as: 1) high- speed projectiles with subtle surface discontinuities ridges and/or fins 2) ground-based targets such as tanks and scud missile launchers and 3) foliage penetration and ground interaction for target under trees (TUT). Some of the physics-based phenomenological features that govern the electromagnetic response of general targets are: a) specular reflection b) creeping waves c) traveling waves) slow moving surface waves e) edge diffraction f) singular currents at surface discontinuities g) resonating gaps and cavities and h) general material response.
