Imc 1990 Tokyo
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Imc 1990 Tokyo
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Author : ハイブリッドマイクロエレクトロニクス協会
language : en
Publisher:
Release Date : 1990
Imc 1990 Tokyo written by ハイブリッドマイクロエレクトロニクス協会 and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1990 with Microelectronics categories.
Microelectronics Packaging Handbook
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Author : Rao Tummala
language : en
Publisher: Springer Science & Business Media
Release Date : 1997-01-31
Microelectronics Packaging Handbook written by Rao Tummala and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 1997-01-31 with Computers categories.
This thoroughly revised and updated three volume set continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. Unlike reference books that focus only on a few aspects of microelectronics packaging, these outstanding volumes discuss state-of-the-art packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry. Providing an excellent balance of theory and practical applications, this dynamic compilation features step-by-step examples and vital technical data, simplifying each phase of package design and production. In addition, the volumes contain over 2000 references, 900 figures, and 250 tables. Part I: Technology Drivers covers the driving force of microelectronics packaging - electrical, thermal, and reliability. It introduces the technology developer to aspects of manufacturing that must be considered during product development. Part II: Semiconductor Packaging discusses the interconnection of the IC chip to the first level of packaging and all first level packages. Electrical test, sealing, and encapsulation technologies are also covered in detail. Part III: Subsystem Packaging explores board level packaging as well as connectors, cables, and optical packaging.
Scientific Information Bulletin
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Author :
language : en
Publisher:
Release Date : 1990
Scientific Information Bulletin written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1990 with Research categories.
Adhesion International 1993
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Author : Louis H. Sharpe
language : en
Publisher: CRC Press
Release Date : 2020-01-29
Adhesion International 1993 written by Louis H. Sharpe and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2020-01-29 with Technology & Engineering categories.
First published in 1996. ADHESION INTERNATIONAL 1993 is a volume of the Proceedings of the 16th Annual Meeting of The Adhesion Society, Inc. Williamsburg, Virginia, USA February 21-26,1993. This meeting featured an International Symposium on The Interphase. Interphases are extremely important in many areas of technology. They are formed when dissimilar materials are joined and they control the properties of adhesive joints, composites, coatings, and microelectronics devices. Considering the importance and scope of phenomena associated with the interphase, it was appropriate to convene such a symposium at the meeting.
Ceramic Microstructures
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Author : Antoni P. Tomsia
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-12-06
Ceramic Microstructures written by Antoni P. Tomsia and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-06 with Technology & Engineering categories.
This volume, titled Proceedings of the International Materials Symposium on Ce ramic Microstructures: Control at the Atomic Level summarizes the progress that has been achieved during the past decade in understanding and controlling microstructures in ceram ics. A particular emphasis of the symposium, and therefore of this volume, is advances in the characterization, understanding, and control of micro structures at the atomic or near-atomic level. This symposium is the fourth in a series of meetings, held every ten years, devoted to ceramic microstructures. The inaugural meeting took place in 1966, and focussed on the analysis, significance, and production of microstructure; the symposium emphasized the need for, and importance of characterization in achieving a more complete understanding of the physical and chemical characteristics of ceramics. A consensus emerged at that meeting on the critical importance of characterization in achieving a more complete understanding of ceramic properties. That point of view became widely accepted in the ensuing decade. The second meeting took place in 1976 at a time of world-wide energy shortages and thus emphasized energy-related applications of ceramics, and more specifically, microstructure-property relationships of those materials. The third meeting, held in 1986, was devoted to the role that interfaces played both during processing, and in influencing the ultimate properties of single and polyphase ceramics, and ceramic-metal systems.
8th Iemt 1990 International Electronic Manufacturing Technology Symposium
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Author :
language : en
Publisher:
Release Date : 1990
8th Iemt 1990 International Electronic Manufacturing Technology Symposium written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1990 with Electronic apparatus and appliances categories.
Photosensitive Polyimides
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Author : Takashi Yamashita
language : en
Publisher: Routledge
Release Date : 2017-10-19
Photosensitive Polyimides written by Takashi Yamashita and has been published by Routledge this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-10-19 with Technology & Engineering categories.
This is the first book to provide an in-depth presentation of photosensitive polyimides for electronic and photonic applications. The authors are leading specialists in this field from Japan, Europe and the U.S. From the Preface Aromatic polyimides were developed originally as thermostable flexible polymer films for space applications. Now polyimides have found widespread use in the manufacture of electronic devices and have been employed in increasingly diverse areas of electronics and information technology. In addition to their excellent thermal stability and high processability, a wide range of chemical and physical properties provided by molecular engineering makes polyimides highly versatile in the electronics and information industries. Lithography of polyimides is an inevitable process in using polyimides for microelectronic fields, and hence increasing research has been devoted to developing photosensitive polyimides, which make it unnecessary to use photoresists for patterning polyimides and diminishing markedly the number of steps in fabrication of various electronic devices. In addition, the development of technology of photosensitive polyimides is expected to play a great role in manufacturing photonic devices in the near future, when the design and control of hyper fine structures . . . including higher thermal stability and better processability would be essential.
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Author : 国立国会図書館 (Japan)
language : en
Publisher:
Release Date : 1900
written by 国立国会図書館 (Japan) and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1900 with Science categories.
Proceedings
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Author :
language : en
Publisher:
Release Date : 1995
Proceedings written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1995 with Electronic apparatus and appliances categories.
Proceedings Of The 6th International Microelectronics Conference
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Author :
language : en
Publisher:
Release Date : 1990
Proceedings Of The 6th International Microelectronics Conference written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1990 with Microelectronics categories.