Implementing Lead Free Electronics
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Lead Free Electronic Solders
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Author : KV Subramanian
language : en
Publisher: Springer Science & Business Media
Release Date : 2007-06-28
Lead Free Electronic Solders written by KV Subramanian and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007-06-28 with Technology & Engineering categories.
Even though the effect of lead contamination on human health has been known for decades, very little attention has been paid to lead-based solders used in electronics until recently. This comprehensive book examines all the important issues associated with lead-free electronic solder. It collects the work of researchers recognized for their significant scientific contributions in the area.
Lead Free Electronics
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Author : Sanka Ganesan
language : en
Publisher: John Wiley & Sons
Release Date : 2006-03-31
Lead Free Electronics written by Sanka Ganesan and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2006-03-31 with Technology & Engineering categories.
Lead-free Electronics provides guidance on the design and use of lead-free electronics as well as technical and legislative perspectives. All the complex challenges confronting the elec-tronics industry are skillfully addressed: * Complying with state legislation * Implementing the transition to lead-free electronics, including anticipating associated costs and potential supply chain issues * Understanding intellectual property issues in lead-free alloys and their applications, including licensing and infringement * Implementing cost effective manufacturing and testing * Reducing risks due to tin whiskers * Finding lead-free solutions in harsh environments such as in the automotive and telecommunications industries * Understanding the capabilities and limitations of conductive adhesives in lead-free interconnects * Devising solutions for lead-free, flip-chip interconnects in high-performance integrated circuit products Each chapter is written by leading experts in the field and carefully edited to ensure a consistent approach. Readers will find all the latest information, including the most recent data on cyclic thermomechanical deformation properties of lead-free SnAgCu alloys and a comparison of the properties of standard Sn-Pb versus lead-free alloys, using the energy partitioning approach. With legislative and market pressure to eliminate the use of lead in electronics manufacturing, this timely publication is essential reading for all engineers and professionals in the electronics industry.
Green Electronics Design And Manufacturing
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Author : Sammy G. Shina
language : en
Publisher: McGraw Hill Professional
Release Date : 2008-05-18
Green Electronics Design And Manufacturing written by Sammy G. Shina and has been published by McGraw Hill Professional this book supported file pdf, txt, epub, kindle and other format this book has been release on 2008-05-18 with Technology & Engineering categories.
Successfully Design and Manufacture Reliable Environmentally-Friendly Electronic Products This state-of-the-art resource brings together contributions by a team of experts from the total electronics supply chain who show how to master the strategy, design, test and implementation issues of meeting global environmental regulations. Edited by the founder of the New England Lead-Free Consortium and filled with over 130 detailed illustrations, Green Electronics Design and Manufacturing features: Guidance for lead-free conversions while maintaining quality and reliability for printed circuit board production and rework of surface mount technology and palted through holes Restriction of hazardous substances (RoHS) compliance for hex-chrome and future halogen free issues Detailed coverage of global environmental regulations and their impact on manufacturing and design processes Techniques for managing corporate strategy and project design teams for green products Proven methods for testing and analyzing green products Proven methods for dealing with the adverse results of green production such as tin whiskers and finish interactions Inside this Cutting-Edge Guide to Creating Green Electronic Products • Basics, Test Methods, and Experimental Techniques for Green Quality and Reliability • Electronics Industry Global Environmental Regulations • Managing Corporate Strategy, Design Projects, and Teams for Green Products • Converting to Lead-Free Electronics Manufacturing, Including Rework, for SMT, BGA, and PTH • Conversion Issues with Design Changes, Laminates, IC Packages, and Printed Circuit Boards • Adverse Consequences of Lead-Free, Including Tin Whiskers and Finish Interactions • Nanotechnology and Its Future in Electronics Applications
Fundamentals Of Lead Free Solder Interconnect Technology
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Author : Tae-Kyu Lee
language : en
Publisher: Springer
Release Date : 2014-11-05
Fundamentals Of Lead Free Solder Interconnect Technology written by Tae-Kyu Lee and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-11-05 with Technology & Engineering categories.
This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliability of lead-free soldering, tin whiskering and electromigration, in addition to emerging technologies and research.
Lead Free Electronics
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Author : Edwin Bradley
language : en
Publisher: John Wiley & Sons
Release Date : 2007-10-26
Lead Free Electronics written by Edwin Bradley and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007-10-26 with Technology & Engineering categories.
Based on the results of a more than two-year study, Lead-Free Electronics: iNEMI Projects Lead to Successful Manufacturing is the first practical, primary reference to cover Pb-free solder assembly as well as the analysis and reasoning behind the selection of Sn-Ag-Cu as the recommended Pb-free replacement for Sn-Pb. Reflecting the results of a two-year study, Lead-Free Electronics: iNEMI Projects Lead to Successful Manufacturing provides full coverage of the issues surrounding the implementation of Pb-free solder into electronic board assembly. This book is extremely timelyâ??most electronic manufacturers are going to change over to Pb free soldering by 2006 to meet new European laws. All manufacturers around the globe are going to be affected by this change. The text provides specific results from the thirty company NEMI project activities. It contains integrated and fully documented book chapters with references to existing published work in the area. These serve as tremendous resources for engineers and companies faced with making the switch to Pb-free solder assembly.
Implementing Lead Free Electronics
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Author : Jennie S. Hwang
language : en
Publisher: McGraw Hill Professional
Release Date : 2004-12-10
Implementing Lead Free Electronics written by Jennie S. Hwang and has been published by McGraw Hill Professional this book supported file pdf, txt, epub, kindle and other format this book has been release on 2004-12-10 with Technology & Engineering categories.
Publisher Description
Logistics For The Implementation Of Lead Free Solders On Electronic Assemblies
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Author :
language : en
Publisher:
Release Date : 1993
Logistics For The Implementation Of Lead Free Solders On Electronic Assemblies written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1993 with categories.
The prospects of legislative and regulatory action aimed at taxing, restricting or banning lead-bearing materials from manufactured products has prompted the electronics community to examine the implementation of lead-free solders to replace currently used lead-containing alloys in the manufacture of electronic devices and assemblies. The logistics for changing the well established ''tin-lead solder technology'' require not only the selection of new compositions but also the qualification of different surface finishes and manufacturing processes. The meniscometer/wetting balance technique was used to evaluate the wettability of several candidate lead-free solders as well as to establish windows on processing parameters so as to facilitate prototype manufacturing. Electroplated and electroless 100Sn coatings, as well as organic preservatives, were also examined as potential alternative finishes for device leads and terminations as well as circuit board conductor surfaces to replace traditional tin-lead layers. Sandia National Laboratories and AT & T have implemented a program to qualify the manufacturing feasibility of surface mount prototype circuit boards using several commercial lead-free solders by infrared reflow technology.
Lead Free Solder Process Development
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Author : Gregory Henshall
language : en
Publisher: John Wiley & Sons
Release Date : 2011-03-29
Lead Free Solder Process Development written by Gregory Henshall and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011-03-29 with Technology & Engineering categories.
Discusses the growth mechanisms of tin whiskers and the effective mitigation strategies necessary to reduce whisker growth risks This book covers key tin whisker topics, ranging from fundamental science to practical mitigation strategies. The text begins with a review of the characteristic properties of local microstructures around whisker and hillock grains to identify why these particular grains and locations become predisposed to forming whiskers and hillocks. The book discusses the basic properties of tin-based alloy finishes and the effects of various alloying elements on whisker formation, with a focus on potential mechanisms for whisker suppression or enhancement for each element. Tin whisker risk mitigation strategies for each tier of the supply chain for high reliability electronic systems are also described. Discusses whisker formation factors including surface grain geometry, crystallographic orientation-dependent surface grain boundary structure, and the localization of elastic strain/strain energy density distribution Examines how whiskers and hillocks evolve in time through real-time studies of whisker growth with the scanning electron microscope/focused ion beaming milling (SEM/FIB) Covers characterization methods of tin and tin-based alloy finishes such as transmission electron microscopy (TEM), scanning electron microscopy (SEM), and electron backscatter diffraction (EBSD) Reviews theories of mechanically-induced tin whiskers with case studies using pure tin and other lead-free finishes shown to evaluate the pressure-induced tin whiskers Mitigating Tin Whisker Risks: Theory and Practice is intended for the broader electronic packaging and manufacturing community including: manufacturing engineers, packaging development engineers, as well as engineers and researchers in high reliability industries.
Implementing Lead Free Electronics
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Author : Jennie S. Hwang
language : en
Publisher: McGraw Hill Professional
Release Date : 2004-12-10
Implementing Lead Free Electronics written by Jennie S. Hwang and has been published by McGraw Hill Professional this book supported file pdf, txt, epub, kindle and other format this book has been release on 2004-12-10 with Technology & Engineering categories.
Publisher Description
A Guide To Lead Free Solders
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Author : John W. Evans
language : en
Publisher: Springer Science & Business Media
Release Date : 2007-01-05
A Guide To Lead Free Solders written by John W. Evans and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007-01-05 with Technology & Engineering categories.
The book is important because it reflects a trend, especially in microelectronics manufacture toward recyclability. Europe and Asia are moving towards legislation to ban the use of lead in solders and public demand in the US will likely have the same result. Producers of solders and manufacturers who use them will have to invent and employ suitable substitutes and A Guide to Lead-free Solders will show them how to do so.