Materials Processes And Reliability For Advanced Interconnects For Micro And Nanoelectronics 2009

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Materials Processes And Reliability For Advanced Interconnects For Micro And Nanoelectronics 2009 Volume 1156
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Author : Martin Gall
language : en
Publisher:
Release Date : 2009-11-18
Materials Processes And Reliability For Advanced Interconnects For Micro And Nanoelectronics 2009 Volume 1156 written by Martin Gall and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2009-11-18 with Technology & Engineering categories.
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Handbook Of Thin Film Deposition
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Author : Krishna Seshan
language : en
Publisher: William Andrew
Release Date : 2018-02-23
Handbook Of Thin Film Deposition written by Krishna Seshan and has been published by William Andrew this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-02-23 with Technology & Engineering categories.
Handbook of Thin Film Deposition, Fourth Edition, is a comprehensive reference focusing on thin film technologies and applications used in the semiconductor industry and the closely related areas of thin film deposition, thin film micro properties, photovoltaic solar energy applications, materials for memory applications and methods for thin film optical processes. The book is broken up into three sections: scaling, equipment and processing, and applications. In this newly revised edition, the handbook will also explore the limits of thin film applications, most notably as they relate to applications in manufacturing, materials, design and reliability. - Offers a practical survey of thin film technologies aimed at engineers and managers involved in all stages of the process: design, fabrication, quality assurance, applications and the limitations faced by those processes - Covers core processes and applications in the semiconductor industry and new developments within the photovoltaic and optical thin film industries - Features a new chapter discussing Gates Dielectrics
Handbook Of Thin Film Deposition
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Author : Dominic Schepis
language : en
Publisher: Elsevier
Release Date : 2024-10-08
Handbook Of Thin Film Deposition written by Dominic Schepis and has been published by Elsevier this book supported file pdf, txt, epub, kindle and other format this book has been release on 2024-10-08 with Technology & Engineering categories.
Handbook of Thin Film Deposition, Fifth Edition, is a comprehensive reference focusing on thin film technologies and applications used in the semiconductor industry. When pursuing patents, there is a phase called 'reduction to practice' where the idea for a technology transitions from a concept to actual use. The section 'Thin Film Reduction to Practice' includes chapters that review the most relevant methods to fabricate thin films towards practical applications. Then, the latest applications of thin film deposition technologies are discussed. Handbook of Thin Film Deposition, 5th Edition is suitable for materials scientists and engineers in academia and working in semiconductor R&D. - Offers a practical survey of thin film technologies including design, fabrication, and reliability - Covers core processes and applications in the semiconductor industry and discusses latest advances in new thin film development - Features new chapters that review methods on front-end and back-end thin films
Concepts In Molecular And Organic Electronics Volume 1154
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Author : Norbert Koch
language : en
Publisher:
Release Date : 2009-10-08
Concepts In Molecular And Organic Electronics Volume 1154 written by Norbert Koch and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2009-10-08 with Technology & Engineering categories.
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Electron Crystallography For Materials Research And Quantitive Characterization Of Nanostructured Materials Volume 1184
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Author : Peter Moeck
language : en
Publisher:
Release Date : 2009-10-07
Electron Crystallography For Materials Research And Quantitive Characterization Of Nanostructured Materials Volume 1184 written by Peter Moeck and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2009-10-07 with Science categories.
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Materials For Nanophotonics Plasmonics Metamaterials And Light Localization Volume 1182
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Author : Luca Dal Negro
language : en
Publisher:
Release Date : 2009-11-19
Materials For Nanophotonics Plasmonics Metamaterials And Light Localization Volume 1182 written by Luca Dal Negro and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2009-11-19 with Science categories.
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Materials And Strategies For Lab On A Chip Biological Analysis Cell Material Interfaces And Fluidic Assembly Of Nanostructures Volume 1191
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Author : Sashi K. Murthy
language : en
Publisher: Cambridge University Press
Release Date : 2009-11-12
Materials And Strategies For Lab On A Chip Biological Analysis Cell Material Interfaces And Fluidic Assembly Of Nanostructures Volume 1191 written by Sashi K. Murthy and has been published by Cambridge University Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2009-11-12 with Technology & Engineering categories.
The development of miniaturized systems for chemical and biochemical analysis has grown to the point where lab-on-a-chip devices are now important enabling tools in a diverse array of application areas. As the size of these systems continues to shrink, details of the micro- and nanoscale phenomena associated with their construction and operation must be considered. This book focuses on materials and engineering aspects of lab-on-a-chip devices and the application of microfluidics to materials synthesis. A microfabricated fluidic system integrating biological sample treatment and detection on a single chip offers the promise of low-cost, rapid and high-performance analysis. These devices can perform high-throughput biochemical assays for drug discovery and provide portability for point-of-care diagnostics and biothreat monitoring. Topics include: frontiers in lab-on-a-chip research; materials for lab-on-a-chip; materials synthesis on chip; cell manipulation and biomimetics on chip; porous materials in lab-on-a-chip; sensing and detection on chip - molecular level; sensing and detecting on chip - cells and particles; and sensing and detection on chip - DNA.
Materials And Devices For Thermal To Electric Energy Conversion Volume 1166
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Author : Jihui Yang
language : en
Publisher:
Release Date : 2009-09-09
Materials And Devices For Thermal To Electric Energy Conversion Volume 1166 written by Jihui Yang and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2009-09-09 with Science categories.
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Materials And Physics For Nonvolatile Memories Volume 1160
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Author : Yoshihisa Fujisaki
language : en
Publisher:
Release Date : 2009-11-17
Materials And Physics For Nonvolatile Memories Volume 1160 written by Yoshihisa Fujisaki and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2009-11-17 with Technology & Engineering categories.
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Interconnect Reliability In Advanced Memory Device Packaging
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Author : Chong Leong, Gan
language : en
Publisher: Springer Nature
Release Date : 2023-05-30
Interconnect Reliability In Advanced Memory Device Packaging written by Chong Leong, Gan and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2023-05-30 with Computers categories.
This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing. In the past 40 years, memory packaging processes have evolved enormously. This book discusses the reliability and technical challenges of first-level interconnect materials, packaging processes, advanced specialty reliability testing, and characterization of interconnects. It also examines the reliability of wire bonding, lead-free solder joints such as reliability testing and data analyses, design for reliability in hybrid packaging and HBM packaging, and failure analyses. The specialty of this book is that the materials covered are not only for second-level interconnects, but also for packaging assembly on first-level interconnects and for the semiconductor back-end on 2.5D and 3D memory interconnects. This book can be used as a text for college and graduate students who have the potential to become our future leaders, scientists, and engineers in the electronics and semiconductor industry.