Microchip Fabrication Sixth Edition
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Microchip Fabrication Sixth Edition
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Author : Peter Van Zant
language : en
Publisher: McGraw Hill Professional
Release Date : 2013-10-22
Microchip Fabrication Sixth Edition written by Peter Van Zant and has been published by McGraw Hill Professional this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-10-22 with Technology & Engineering categories.
The most complete, current guide to semiconductor processing Fully revised to cover the latest advances in the field, Microchip Fabrication, Sixth Edition explains every stage of semiconductor processing, from raw material preparation to testing to packaging and shipping the finished device. This practical resource provides easy-to-understand information on the physics, chemistry, and electronic fundamentals underlying the sophisticated manufacturing materials and processes of modern semiconductors. State-of-the-art processes and cutting-edge technologies used in the patterning, doping, and layering steps are discussed in this new edition. Filled with detailed illustrations and real-world examples, this is a comprehensive, up-to-date introduction to the technological backbone of the high-tech industry. COVERAGE INCLUDES: The semiconductor industry Properties of semiconductor materials and chemicals Crystal growth and silicon wafer preparation Wafer fabrication and packaging Contamination control Productivity and process yields Oxidation The ten-step patterning process--surface preparation to exposure; developing to final inspection Next generation lithography Doping Layer deposition Metallization Process and device evaluation The business of wafer fabrication Devices and integrated circuit formation Integrated circuits Packaging
Microchip Fabrication A Practical Guide To Semiconductor Processing Sixth Edition
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Author : Peter Van Zant
language : en
Publisher: McGraw-Hill Education
Release Date : 2014-01-07
Microchip Fabrication A Practical Guide To Semiconductor Processing Sixth Edition written by Peter Van Zant and has been published by McGraw-Hill Education this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-01-07 with Technology & Engineering categories.
Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product. The most complete, current guide to semiconductor processing Fully revised to cover the latest advances in the field, Microchip Fabrication, Sixth Edition explains every stage of semiconductor processing, from raw material preparation to testing to packaging and shipping the finished device. This practical resource provides easy-to-understand information on the physics, chemistry, and electronic fundamentals underlying the sophisticated manufacturing materials and processes of modern semiconductors. State-of-the-art processes and cutting-edge technologies used in the patterning, doping, and layering steps are discussed in this new edition. Filled with detailed illustrations and real-world examples, this is a comprehensive, up-to-date introduction to the technological backbone of the high-tech industry. COVERAGE INCLUDES: The semiconductor industry Properties of semiconductor materials and chemicals Crystal growth and silicon wafer preparation Wafer fabrication and packaging Contamination control Productivity and process yields Oxidation The ten-step patterning process--surface preparation to exposure; developing to final inspection Next generation lithography Doping Layer deposition Metallization Process and device evaluation The business of wafer fabrication Devices and integrated circuit formation Integrated circuits Packaging
Microchip Fabrication 5th Ed
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Author : Peter Van Zant
language : en
Publisher: McGraw Hill Professional
Release Date : 2004-06-09
Microchip Fabrication 5th Ed written by Peter Van Zant and has been published by McGraw Hill Professional this book supported file pdf, txt, epub, kindle and other format this book has been release on 2004-06-09 with Technology & Engineering categories.
The #1 book in the industry for more than 15 years! Utilizing a straightforward, math-free pathology, this is a novice-friendly guide to the semiconductor fabrication process from raw materials through shipping the finished, packaged device. Challenging quizzes and review summaries make this the perfect learning guide for technicians in training. * NEW chapter on nanotechnology * NEW sections on 300mm wafer processing * Processes and devices, and Green processing * Every chapter updated to reflect the latest processing techniques
Microchip Fabrication
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Author : Peter Van Zant
language : en
Publisher: McGraw-Hill Companies
Release Date : 1990
Microchip Fabrication written by Peter Van Zant and has been published by McGraw-Hill Companies this book supported file pdf, txt, epub, kindle and other format this book has been release on 1990 with Computers categories.
Reports on the entire chip production process, describing the basic physical properties of semiconducting materials and the chemicals used to process them into fabrication-grade polished wafers. Written in nontechnical language and without complex engineering or mathematical discussions--for the nonspecialist, such as those involved in semiconductor operations, marketing, quality control, or technical services. Annotation copyrighted by Book News, Inc., Portland, OR
Microchip Fabrication
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Author : Peter Van Zant
language : en
Publisher:
Release Date : 1984
Microchip Fabrication written by Peter Van Zant and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1984 with Integrated circuits categories.
Fundamentals Of Semiconductor Manufacturing And Process Control
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Author : Gary S. May
language : en
Publisher: John Wiley & Sons
Release Date : 2006-05-26
Fundamentals Of Semiconductor Manufacturing And Process Control written by Gary S. May and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2006-05-26 with Technology & Engineering categories.
A practical guide to semiconductor manufacturing from processcontrol to yield modeling and experimental design Fundamentals of Semiconductor Manufacturing and Process Controlcovers all issues involved in manufacturing microelectronic devicesand circuits, including fabrication sequences, process control,experimental design, process modeling, yield modeling, and CIM/CAMsystems. Readers are introduced to both the theory and practice ofall basic manufacturing concepts. Following an overview of manufacturing and technology, the textexplores process monitoring methods, including those that focus onproduct wafers and those that focus on the equipment used toproduce wafers. Next, the text sets forth some fundamentals ofstatistics and yield modeling, which set the foundation for adetailed discussion of how statistical process control is used toanalyze quality and improve yields. The discussion of statistical experimental design offers readers apowerful approach for systematically varying controllable processconditions and determining their impact on output parameters thatmeasure quality. The authors introduce process modeling concepts,including several advanced process control topics such asrun-by-run, supervisory control, and process and equipmentdiagnosis. Critical coverage includes the following: * Combines process control and semiconductor manufacturing * Unique treatment of system and software technology and managementof overall manufacturing systems * Chapters include case studies, sample problems, and suggestedexercises * Instructor support includes electronic copies of the figures andan instructor's manual Graduate-level students and industrial practitioners will benefitfrom the detailed exami?nation of how electronic materials andsupplies are converted into finished integrated circuits andelectronic products in a high-volume manufacturingenvironment. An Instructor's Manual presenting detailed solutions to all theproblems in the book is available from the Wiley editorialdepartment. An Instructor Support FTP site is also available.
Microchip Fabrication
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Author : Peter Van Zant
language : en
Publisher:
Release Date : 1986-01-01
Microchip Fabrication written by Peter Van Zant and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1986-01-01 with Integrated circuits categories.
Making Microchips
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Author : Jan Mazurek
language : en
Publisher: MIT Press
Release Date : 1998-12-07
Making Microchips written by Jan Mazurek and has been published by MIT Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 1998-12-07 with Science categories.
An examination of the environmental and economic implications of the computer microchip industry's exodus from California's Silicon Valley to New Mexico, Virginia, Ireland, and Taiwan. In Making Microchips, Jan Mazurek examines the environmental and economic implications of the computer microchip industry's exodus from California's Silicon Valley to New Mexico, Virginia, Ireland, and Taiwan. Globalization, economic restructuring, and changing manufacturing processes in this rapidly growing industry present difficult new questions for environmental policy. Mazurek challenges the assumptions of U.S. policies designed to promote the competitiveness of domestic microchip makers. She argues that, although these initiatives focus on the economic effects of environmental regulation, they fail to acknowledge how economic and organizational changes within the industry collide with and often confound efforts to monitor and manage pollution from chemicals used in microchip manufacturing. Despite its reputation as a clean industry, microchip manufacturing is fraught with hazards. More than sixty dangerous acids, solvents, caustics, and gases are used to make microchips, and some of them are suspected to be carcinogens and/or reproductive toxins. Mazurek describes the environmental by-products of chipmaking, including soil contamination, air and water pollution, and damage to human health. Applying insights from economic geography to questions of how and where companies organize production, she shows how Silicon Valley played a pivotal role in the development of the microchip. Pairing federal environmental data with structural and geographic information on the six firms that continue to build wafer fabrication plants in the United States, she demonstrates how reorganization and relocation of manufacturing facilities divert attention from trends in toxic emissions and how they complicate public and private efforts to improve the industry's environmental performance. In the concluding chapter, Mazurek marshals her findings in a broader analysis of the expansion of global manufacturing and the resultant environmental problems.
Semiconductor Manufacturing Handbook
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Author : Hwaiyu Geng
language : en
Publisher: McGraw Hill Professional
Release Date : 2005-05-18
Semiconductor Manufacturing Handbook written by Hwaiyu Geng and has been published by McGraw Hill Professional this book supported file pdf, txt, epub, kindle and other format this book has been release on 2005-05-18 with Technology & Engineering categories.
WORLD-CLASS SEMICONDUCTOR MANUFACTURING EXPERTISE AT YOUR FINGERTIPS This is a comprehensive reference to the semiconductor manufacturing process and ancillary facilities -- from raw material preparation to packaging and testing, applying basics to emerging technologies. Readers charged with optimizing the design and performance of manufacturing processes will find all the information necessary to produce the highest quality chips at the lowest price in the shortest time possible. The Semiconductor Manufacturing Handbook provides leading-edge information on semiconductor wafer processes, MEMS, nanotechnology, and FPD, plus the latest manufacturing and automation technologies, including: Yield Management Automated Material Handling System Fab and Cleanroom Design and Operation Gas Abatement and Waste Treatment Management And much more Written by 60 international experts, and peer reviewed by a seasoned advisory board, this handbook covers the fundamentals of relevant technology and its real-life application and operational considerations for planning, implementing, and controlling manufacturing processes. It includes hundreds of detailed illustrations and a list of relevant books, technical papers, and websites for further research. This inclusive, wide-ranging coverage makes the Semiconductor Manufacturing Handbook the most comprehensive single-volume reference ever published in the field. STATE-OF-THE-ART SEMICONDUCTOR TECHNOLOGIES AND MANUFACTURING PROCESSES: SEMICONDUCTOR FUNDAMENTALS How Chips Are Designed and Made * Substrates * Copper and Low-k Dielectrics * Silicide Formation * Plasma * Vacuum * Photomask WAFER PROCESSING TECHNOLOGIES Microlithography * Ion Implantation * Etch * PVD/ALD * CVD * ECD * Epitaxy * CMP * Wet Cleaning FINAL MANUFACTURING Packaging * Grinding, Stress Relief, Dicing * Inspection, Measurement, and Testing NANOTECHNOLOGY, MEMS, AND FPD GAS AND CHEMICALS Specialty Gas System and DCA * Gas Abatement Systems * Chemical and Slurries Delivery System * Ultra Pure Water FAB YIELD, OPERATIONS, AND FACILITIES Yield Management * Automated Materials Handling System * Metrology * Six Sigma * Advanced Process Control * EHS * Fab Design and Construction * Cleanroom * Vibration and Acoustic Control * ESD * Airborne Molecular Control * Particle Monitoring * Wastewater Neutralization Systems
Semiconductor Advanced Packaging
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Author : John H. Lau
language : en
Publisher: Springer Nature
Release Date : 2021-05-17
Semiconductor Advanced Packaging written by John H. Lau and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2021-05-17 with Technology & Engineering categories.
The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.