Normally Off Gan Power Devices
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Normally Off Gan Power Devices
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Author : Hanxing Wang
language : en
Publisher:
Release Date : 2016
Normally Off Gan Power Devices written by Hanxing Wang and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2016 with Gallium nitride categories.
Gate Stability And Reliability Of Normally Off Gan Power
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Author : Jiabei He
language : en
Publisher:
Release Date : 2020
Gate Stability And Reliability Of Normally Off Gan Power written by Jiabei He and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2020 with categories.
Power Gan Devices
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Author : Matteo Meneghini
language : en
Publisher: Springer
Release Date : 2016-09-08
Power Gan Devices written by Matteo Meneghini and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2016-09-08 with Technology & Engineering categories.
This book presents the first comprehensive overview of the properties and fabrication methods of GaN-based power transistors, with contributions from the most active research groups in the field. It describes how gallium nitride has emerged as an excellent material for the fabrication of power transistors; thanks to the high energy gap, high breakdown field, and saturation velocity of GaN, these devices can reach breakdown voltages beyond the kV range, and very high switching frequencies, thus being suitable for application in power conversion systems. Based on GaN, switching-mode power converters with efficiency in excess of 99 % have been already demonstrated, thus clearing the way for massive adoption of GaN transistors in the power conversion market. This is expected to have important advantages at both the environmental and economic level, since power conversion losses account for 10 % of global electricity consumption. The first part of the book describes the properties and advantages of gallium nitride compared to conventional semiconductor materials. The second part of the book describes the techniques used for device fabrication, and the methods for GaN-on-Silicon mass production. Specific attention is paid to the three most advanced device structures: lateral transistors, vertical power devices, and nanowire-based HEMTs. Other relevant topics covered by the book are the strategies for normally-off operation, and the problems related to device reliability. The last chapter reviews the switching characteristics of GaN HEMTs based on a systems level approach. This book is a unique reference for people working in the materials, device and power electronics fields; it provides interdisciplinary information on material growth, device fabrication, reliability issues and circuit-level switching investigation.
Gallium Nitride And Silicon Carbide Power Devices
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Author : B Jayant Baliga
language : en
Publisher: World Scientific Publishing Company
Release Date : 2016-12-12
Gallium Nitride And Silicon Carbide Power Devices written by B Jayant Baliga and has been published by World Scientific Publishing Company this book supported file pdf, txt, epub, kindle and other format this book has been release on 2016-12-12 with categories.
During the last 30 years, significant progress has been made to improve our understanding of gallium nitride and silicon carbide device structures, resulting in experimental demonstration of their enhanced performances for power electronic systems. Gallium nitride power devices made by the growth of the material on silicon substrates have gained a lot of interest. Power device products made from these materials have become available during the last five years from many companies. This comprehensive book discusses the physics of operation and design of gallium nitride and silicon carbide power devices. It can be used as a reference by practicing engineers in the power electronics industry and as a textbook for a power device or power electronics course in universities. Request Inspection Copy
Gallium Nitride And Silicon Carbide Power Technologies 7
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Author : M. Dudley
language : en
Publisher: The Electrochemical Society
Release Date :
Gallium Nitride And Silicon Carbide Power Technologies 7 written by M. Dudley and has been published by The Electrochemical Society this book supported file pdf, txt, epub, kindle and other format this book has been release on with categories.
Gan Transistors For Efficient Power Conversion
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Author : Alex Lidow
language : en
Publisher: John Wiley & Sons
Release Date : 2019-08-12
Gan Transistors For Efficient Power Conversion written by Alex Lidow and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-08-12 with Science categories.
An up-to-date, practical guide on upgrading from silicon to GaN, and how to use GaN transistors in power conversion systems design This updated, third edition of a popular book on GaN transistors for efficient power conversion has been substantially expanded to keep students and practicing power conversion engineers ahead of the learning curve in GaN technology advancements. Acknowledging that GaN transistors are not one-to-one replacements for the current MOSFET technology, this book serves as a practical guide for understanding basic GaN transistor construction, characteristics, and applications. Included are discussions on the fundamental physics of these power semiconductors, layout, and other circuit design considerations, as well as specific application examples demonstrating design techniques when employing GaN devices. GaN Transistors for Efficient Power Conversion, 3rd Edition brings key updates to the chapters of Driving GaN Transistors; Modeling, Simulation, and Measurement of GaN Transistors; DC-DC Power Conversion; Envelope Tracking; and Highly Resonant Wireless Energy Transfer. It also offers new chapters on Thermal Management, Multilevel Converters, and Lidar, and revises many others throughout. Written by leaders in the power semiconductor field and industry pioneers in GaN power transistor technology and applications Updated with 35% new material, including three new chapters on Thermal Management, Multilevel Converters, Wireless Power, and Lidar Features practical guidance on formulating specific circuit designs when constructing power conversion systems using GaN transistors A valuable resource for professional engineers, systems designers, and electrical engineering students who need to fully understand the state-of-the-art GaN Transistors for Efficient Power Conversion, 3rd Edition is an essential learning tool and reference guide that enables power conversion engineers to design energy-efficient, smaller, and more cost-effective products using GaN transistors.
Process Modeling And Device Technology Of Gan Normally Off Power Transistors
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Author : Li Yuan
language : en
Publisher:
Release Date : 2011
Process Modeling And Device Technology Of Gan Normally Off Power Transistors written by Li Yuan and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011 with Gallium nitride categories.
Gallium Nitride Power Devices
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Author : Hongyu Yu
language : en
Publisher: CRC Press
Release Date : 2017-07-06
Gallium Nitride Power Devices written by Hongyu Yu and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-07-06 with Science categories.
GaN is considered the most promising material candidate in next-generation power device applications, owing to its unique material properties, for example, bandgap, high breakdown field, and high electron mobility. Therefore, GaN power device technologies are listed as the top priority to be developed in many countries, including the United States, the European Union, Japan, and China. This book presents a comprehensive overview of GaN power device technologies, for example, material growth, property analysis, device structure design, fabrication process, reliability, failure analysis, and packaging. It provides useful information to both students and researchers in academic and related industries working on GaN power devices. GaN wafer growth technology is from Enkris Semiconductor, currently one of the leading players in commercial GaN wafers. Chapters 3 and 7, on the GaN transistor fabrication process and GaN vertical power devices, are edited by Dr. Zhihong Liu, who has been working on GaN devices for more than ten years. Chapters 2 and 5, on the characteristics of polarization effects and the original demonstration of AlGaN/GaN heterojunction field-effect transistors, are written by researchers from Southwest Jiaotong University. Chapters 6, 8, and 9, on surface passivation, reliability, and package technologies, are edited by a group of researchers from the Southern University of Science and Technology of China.
Design Fabrication And Characterization Of Gan Based Devices For Power Applications
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Author : Burcu Ercan
language : en
Publisher:
Release Date : 2020
Design Fabrication And Characterization Of Gan Based Devices For Power Applications written by Burcu Ercan and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2020 with categories.
Gallium Nitride (GaN) and related alloys have gained considerable momentum in recent years since the improvement in silicon (Si) based power devices is now only incremental. GaN is a promising material for high-power, high-frequency applications due to its wide bandgap, high carrier mobility which result in devices with high breakdown voltage, low on-resistance, and high temperature stability. Despite the superior properties of GaN there is still room for improvement in device design and fabrication to reach theoretical limits of GaN based devices. Reaching the theoretical critical electric field in GaN devices has been challenging due to the presence of threading dislocations, surface impurities introduced during material growth and fabrication process. In order to prevent premature breakdown of the devices, these defects must be mitigated. In this study, avalanche breakdown was observed in p-n diodes fabricated with low power reactive ion etch with a moat etch profile, followed by Mg ion implantation to passivate the plasma damages. Additionally, the devices were fabricated on free standing GaN substrates which has lower dislocation than sapphire or SiC substrates. The electron and hole impact ionization coefficients were extracted separately by analyzing the ultraviolet (UV) assisted reverse bias current voltage measurements of vertical p-n and n-p diodes. GaN and related alloy such as Indium Aluminum Nitride (InAlN) or Aluminum Gallium Nitride (AlGaN) form a high mobility, high density sheet charge at the heterojunction. High electron mobility transistor (HEMT) devices fabricated on these layer stacks are depletion mode (normally-on) devices with a negative threshold voltage. However, normally-on devices are not preferred in power applications due to safety reasons and to reduce the external circuitry. Therefore, the development of an enhancement mode (normally-off) GaN based high electron mobility transistors (HEMT) with positive threshold voltage is important for next generation power devices. Several methods, such as growing a p-GaN on the barrier layer, recessed gate by dry etching, plasma treatment under the gate have been previously studied to develop enhancement-mode HEMT devices. In this study, MOS-HEMT devices were fabricated by selective thermal oxidation of InAlN to reduce InAlN barrier thickness under the gate contact. The thermal oxidation of InAlN occurs at temperatures above 600°C, while GaN oxidation occurs above 1000°C at a slow rate which allows the decrease of the InAlN barrier layer thickness under the gate in a reliable way due to the self-limiting nature of oxidation. A positive shift in the threshold voltage and a reduction in reverse leakage current was demonstrated on MOS-diode structures by thermally oxidizing InAlN layers with In composition of 0.17, 0.178 and 0.255 for increasing oxidation durations at 700°C and 800°C. Enhancement mode device operation was demonstrated on lattice matched InAlN/AlN/GaN/Sapphire MOS-HEMT devices by selective thermal oxidation of InAlN layer under the gate contact. A positive threshold voltage was observed for devices which were subjected to thermal oxidation at 700°C for 10, 30 and 60 minutes. The highest threshold voltage was observed as 1.16 V for the device that was oxidized for 30 minutes at 700°C. The maximum transconductance and the maximum drain saturation current of this device was 4.27 mS/mm and 150 mA/mm, respectively.
Wide Bandgap Semiconductor Power Devices
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Author : B. Jayant Baliga
language : en
Publisher: Woodhead Publishing
Release Date : 2018-10-17
Wide Bandgap Semiconductor Power Devices written by B. Jayant Baliga and has been published by Woodhead Publishing this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-10-17 with Technology & Engineering categories.
Wide Bandgap Semiconductor Power Devices: Materials, Physics, Design and Applications provides readers with a single resource on why these devices are superior to existing silicon devices. The book lays the groundwork for an understanding of an array of applications and anticipated benefits in energy savings. Authored by the Founder of the Power Semiconductor Research Center at North Carolina State University (and creator of the IGBT device), Dr. B. Jayant Baliga is one of the highest regarded experts in the field. He thus leads this team who comprehensively review the materials, device physics, design considerations and relevant applications discussed. Comprehensively covers power electronic devices, including materials (both gallium nitride and silicon carbide), physics, design considerations, and the most promising applications Addresses the key challenges towards the realization of wide bandgap power electronic devices, including materials defects, performance and reliability Provides the benefits of wide bandgap semiconductors, including opportunities for cost reduction and social impact