Proceedings Of The Trends In Electronics Conference

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Integrated Power Electronic Converters And Digital Control

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Author : Ali Emadi
language : en
Publisher: CRC Press
Release Date : 2017-12-19

Integrated Power Electronic Converters And Digital Control written by Ali Emadi and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-12-19 with Technology & Engineering categories.

Because of the demand for higher efficiencies, smaller output ripple, and smaller converter size for modern power electronic systems, integrated power electronic converters could soon replace conventional switched-mode power supplies. Synthesized integrated converters and related digital control techniques address problems related to cost, space, flexibility, energy efficiency, and voltage regulation—the key factors in digital power management and implementation. Meeting the needs of professionals working in power electronics, as well as advanced engineering students, Integrated Power Electronic Converters and Digital Control explores the many benefits associated with integrated converters. This informative text details boost type, buck type, and buck-boost type integrated topologies, as well as other integrated structures. It discusses concepts behind their operation as well specific applications. Topics discussed include: Isolated DC-DC converters such as flyback, forward, push-pull, full-bridge, and half-bridge Power factor correction and its application Definition of the integrated switched-mode power supplies Steady-state analysis of the boost integrated flyback rectifier energy storage converter Dynamic analysis of the buck integrated forward converter Digital control based on the use of digital signal processors (DSPs) With innovations in digital control becoming ever more pervasive, system designers continue to introduce products that integrate digital power management and control integrated circuit solutions, both hybrid and pure digital. This detailed assessment of the latest advances in the field will help anyone working in power electronics and related industries stay ahead of the curve.

Tencon 93

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Author : Institute of Electrical and Electronics Engineers. Region 10. Conference
language : en
Publisher:
Release Date : 1993

Tencon 93 written by Institute of Electrical and Electronics Engineers. Region 10. Conference and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1993 with categories.

Handbook Of Lead Free Solder Technology For Microelectronic Assemblies

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Author : Karl J. Puttlitz
language : en
Publisher: CRC Press
Release Date : 2004-02-27

Handbook Of Lead Free Solder Technology For Microelectronic Assemblies written by Karl J. Puttlitz and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2004-02-27 with Technology & Engineering categories.

This reference provides a complete discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications. Written by more than 45 world-class researchers and practitioners, the book discusses general reliability issues concerning microelectronic assemblies, as well as factors specific to the tin-rich replacement alloys commonly utilized in lead-free solders. It provides real-world manufacturing accounts of the introduction of reduced-lead and lead-free technology and discusses the functionality and cost effectiveness of alternative solder alloys and non-solder alternatives replacing lead-tin solders in microelectronics.

Current Serials Received

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Author : British Library. Document Supply Centre
language : en
Publisher:
Release Date : 2003

Current Serials Received written by British Library. Document Supply Centre and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2003 with Periodicals categories.

Proceedings Of Fifth Doctoral Symposium On Computational Intelligence

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Author : Abhishek Swaroop
language : en
Publisher: Springer Nature
Release Date : 2024-11-29

Proceedings Of Fifth Doctoral Symposium On Computational Intelligence written by Abhishek Swaroop and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2024-11-29 with Computers categories.

This book features high-quality research papers presented at Fifth Doctoral Symposium on Computational Intelligence (DoSCI 2024), jointly organised by Institute of Engineering & Technology, Lucknow, India, and School of Open Learning, University of Delhi in association with University of Calabria, Italy, on May 10, 2024. This book discusses the topics such as computational intelligence, artificial intelligence, deep learning, evolutionary algorithms, swarm intelligence, fuzzy sets and vague sets, rough set theoretic approaches, quantum-inspired computational intelligence, hybrid computational intelligence, machine learning, computer vision, soft computing, distributed computing, parallel and grid computing, cloud computing, high-performance computing, biomedical computing, and decision support and decision making.

Nasa Sp 7500

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Author : United States. National Aeronautics and Space Administration
language : en
Publisher:
Release Date : 1979

Nasa Sp 7500 written by United States. National Aeronautics and Space Administration and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1979 with categories.

New Serial Titles

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Author :
language : en
Publisher:
Release Date : 1998

New Serial Titles written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1998 with Periodicals categories.

A union list of serials commencing publication after Dec. 31, 1949.

Materials Manufacturing Technology Electronics And Information Science Proceedings Of The 2015 International Workshop Mmtei2015

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Author : Xiaolong Li
language : en
Publisher: World Scientific
Release Date : 2016-04-25

Materials Manufacturing Technology Electronics And Information Science Proceedings Of The 2015 International Workshop Mmtei2015 written by Xiaolong Li and has been published by World Scientific this book supported file pdf, txt, epub, kindle and other format this book has been release on 2016-04-25 with Technology & Engineering categories.

This proceedings consists of fifty one selected papers presented at the 2015 International Workshop on Materials, Manufacturing Technology, Electronics and Information Science (MMTEI2015), which was successfully held in Wuhan, China during October 9-11, 2015.MMTEI2015 covered a wide range of fundamental studies, technical innovations and industrial applications in the 4 areas, namely Material Science and Application, Mechanical Engineering and Mechatronics,Electronics Engineering and Microelectronics, and Information Science.This workshop aims to provide a forum for scientists, scholars, engineers and students from universities all around the world and the industry to present ongoing research activities, and hence to foster research relations between universities and the industry. All accepted papers were subjected to a strict peer-review process by 2-3 expert referees.

Advances In Embedded And Fan Out Wafer Level Packaging Technologies

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Author : Beth Keser
language : en
Publisher: John Wiley & Sons
Release Date : 2019-02-12

Advances In Embedded And Fan Out Wafer Level Packaging Technologies written by Beth Keser and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-02-12 with Technology & Engineering categories.

Examines the advantages of Embedded and FO-WLP technologies, potential application spaces, package structures available in the industry, process flows, and material challenges Embedded and fan-out wafer level packaging (FO-WLP) technologies have been developed across the industry over the past 15 years and have been in high volume manufacturing for nearly a decade. This book covers the advances that have been made in this new packaging technology and discusses the many benefits it provides to the electronic packaging industry and supply chain. It provides a compact overview of the major types of technologies offered in this field, on what is available, how it is processed, what is driving its development, and the pros and cons. Filled with contributions from some of the field's leading experts,Advances in Embedded and Fan-Out Wafer Level Packaging Technologies begins with a look at the history of the technology. It then goes on to examine the biggest technology and marketing trends. Other sections are dedicated to chip-first FO-WLP, chip-last FO-WLP, embedded die packaging, materials challenges, equipment challenges, and resulting technology fusions. Discusses specific company standards and their development results Content relates to practice as well as to contemporary and future challenges in electronics system integration and packaging Advances in Embedded and Fan-Out Wafer Level Packaging Technologies will appeal to microelectronic packaging engineers, managers, and decision makers working in OEMs, IDMs, IFMs, OSATs, silicon foundries, materials suppliers, equipment suppliers, and CAD tool suppliers. It is also an excellent book for professors and graduate students working in microelectronic packaging research.

Management

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Author :
language : en
Publisher:
Release Date : 1978

Management written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1978 with Industrial engineering categories.