Process Dependence Of Properties In High Thermal Conductivity Aluminum Nitride Substrates For Electronic Packaging
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Process Dependence Of Properties In High Thermal Conductivity Aluminum Nitride Substrates For Electronic Packaging
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Author : John H. Cooper
language : en
Publisher:
Release Date : 1991
Process Dependence Of Properties In High Thermal Conductivity Aluminum Nitride Substrates For Electronic Packaging written by John H. Cooper and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1991 with categories.
Scientific And Technical Aerospace Reports
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Author :
language : en
Publisher:
Release Date : 1995
Scientific And Technical Aerospace Reports written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1995 with Aeronautics categories.
Lists citations with abstracts for aerospace related reports obtained from world wide sources and announces documents that have recently been entered into the NASA Scientific and Technical Information Database.
High Thermal Conductivity Aln Packages For High Temperature Electronics
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Author :
language : en
Publisher:
Release Date : 1998
High Thermal Conductivity Aln Packages For High Temperature Electronics written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1998 with categories.
A novel metallization for aluminum nitride substrates and related interconnection materials were investigated for packaging silicon carbide devices for use at temperatures up to 600 deg C. Aluminum nitride substrates were metallized with refractory metals using both thin and thick film metallization techniques. Excellent metallization adhesions (>- 10 ksi) were achieved at low sheet resistivities for both films. Phase diagrams were used to select potential bond pad, die attach and wire bond materials. Diffusion couples were constructed to screen the selected candidates. Gold and platinum were found to be stable bond pad materials on the refractory metallizations at 700 deg C. Gold-gold and platinum-platinum pad-wire combinations were suitable for use at temperatures of 600 deg C and beyond. Platinum-gold, copper-gold, and nickel-gold pad-wire combinations could be used with refractory metallized aluminum nitride substrate up to 400 deg C.
Electronic Materials And Processes Handbook
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Author : Charles A. Harper
language : en
Publisher: McGraw Hill Professional
Release Date : 2003-08-07
Electronic Materials And Processes Handbook written by Charles A. Harper and has been published by McGraw Hill Professional this book supported file pdf, txt, epub, kindle and other format this book has been release on 2003-08-07 with Technology & Engineering categories.
Electronic materials are the actual semiconductors, plastics, metals and ceramics that make up the chips and packages from which we construct today’s cell phones, palmtops, and PDAs. The switch in applications from PCs to smaller communications devices has driven the micro-miniaturization trend in electronics, which in turn has created a new set of challenges in creating materials to meet their specifications. This new edition, the first update of the handbook since 1993, is a complete rewrite, reflecting the great importance of engineering materials for thermal management and flexibility and micro-miniature sizes. This new handbook will be an invaluable tool to anyone working electronic packaging, fabrication, or assembly design.
Extreme Environment Electronics
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Author : John D. Cressler
language : en
Publisher: CRC Press
Release Date : 2017-12-19
Extreme Environment Electronics written by John D. Cressler and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-12-19 with Technology & Engineering categories.
Unfriendly to conventional electronic devices, circuits, and systems, extreme environments represent a serious challenge to designers and mission architects. The first truly comprehensive guide to this specialized field, Extreme Environment Electronics explains the essential aspects of designing and using devices, circuits, and electronic systems intended to operate in extreme environments, including across wide temperature ranges and in radiation-intense scenarios such as space. The Definitive Guide to Extreme Environment Electronics Featuring contributions by some of the world’s foremost experts in extreme environment electronics, the book provides in-depth information on a wide array of topics. It begins by describing the extreme conditions and then delves into a description of suitable semiconductor technologies and the modeling of devices within those technologies. It also discusses reliability issues and failure mechanisms that readers need to be aware of, as well as best practices for the design of these electronics. Continuing beyond just the "paper design" of building blocks, the book rounds out coverage of the design realization process with verification techniques and chapters on electronic packaging for extreme environments. The final set of chapters describes actual chip-level designs for applications in energy and space exploration. Requiring only a basic background in electronics, the book combines theoretical and practical aspects in each self-contained chapter. Appendices supply additional background material. With its broad coverage and depth, and the expertise of the contributing authors, this is an invaluable reference for engineers, scientists, and technical managers, as well as researchers and graduate students. A hands-on resource, it explores what is required to successfully operate electronics in the most demanding conditions.
Sintering Dielectric And Mechanical Properties Of Aluminum Nitride Glass Multilayer Substrates
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Author : Cheryl A. Shaffer
language : en
Publisher:
Release Date : 1989
Sintering Dielectric And Mechanical Properties Of Aluminum Nitride Glass Multilayer Substrates written by Cheryl A. Shaffer and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1989 with Aluminum nitride categories.
High Thermal Conductivity Materials
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Author : Subhash L. Shinde
language : en
Publisher: Springer Science & Business Media
Release Date : 2006-01-31
High Thermal Conductivity Materials written by Subhash L. Shinde and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2006-01-31 with Science categories.
The main objective of this book is to cover the basic understanding of thermal conduction mechanisms in various high thermal conductivity materials including diamond, cubic boron nitride, and also the latest material like carbon nanotubes. The book is intended as a good reference book for scientists and engineers involved in addressing thermal management issues in a broad spectrum of industries. Leading researchers from industry and academic institutions who are well known in their areas of expertise have contributed a chapter in the field of their interest.
Proceedings Of The 1990 International Symposium On Microelectronics October 15 17 1990 Mccormick Place North Chicago Illinois
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Author :
language : en
Publisher:
Release Date : 1990
Proceedings Of The 1990 International Symposium On Microelectronics October 15 17 1990 Mccormick Place North Chicago Illinois written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1990 with Hybrid integrated circuits categories.
Electronic Materials Handbook
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Author :
language : en
Publisher: ASM International
Release Date : 1989-11-01
Electronic Materials Handbook written by and has been published by ASM International this book supported file pdf, txt, epub, kindle and other format this book has been release on 1989-11-01 with Technology & Engineering categories.
Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.
Ceramic Abstracts
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Author :
language : en
Publisher:
Release Date : 1998
Ceramic Abstracts written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1998 with Ceramics categories.