System On Package
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Introduction To System On Package Sop
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Author :
language : en
Publisher:
Release Date : 2008
Introduction To System On Package Sop written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2008 with Microelectronic packaging categories.
System-on-Package (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. Where systems8221; used to be bulky boxes housing hundreds of components, SOP saves interconnection time and heat gener.
Semiconductor Advanced Packaging
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Author : John H. Lau
language : en
Publisher: Springer Nature
Release Date : 2021-05-17
Semiconductor Advanced Packaging written by John H. Lau and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2021-05-17 with Technology & Engineering categories.
The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.
Power Electronic Packaging
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Author : Yong Liu
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-02-15
Power Electronic Packaging written by Yong Liu and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-02-15 with Technology & Engineering categories.
Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions.
R Packages
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Author : Hadley Wickham
language : en
Publisher: "O'Reilly Media, Inc."
Release Date : 2015-03-26
R Packages written by Hadley Wickham and has been published by "O'Reilly Media, Inc." this book supported file pdf, txt, epub, kindle and other format this book has been release on 2015-03-26 with Computers categories.
Turn your R code into packages that others can easily download and use. This practical book shows you how to bundle reusable R functions, sample data, and documentation together by applying author Hadley Wickham’s package development philosophy. In the process, you’ll work with devtools, roxygen, and testthat, a set of R packages that automate common development tasks. Devtools encapsulates best practices that Hadley has learned from years of working with this programming language. Ideal for developers, data scientists, and programmers with various backgrounds, this book starts you with the basics and shows you how to improve your package writing over time. You’ll learn to focus on what you want your package to do, rather than think about package structure. Learn about the most useful components of an R package, including vignettes and unit tests Automate anything you can, taking advantage of the years of development experience embodied in devtools Get tips on good style, such as organizing functions into files Streamline your development process with devtools Learn the best way to submit your package to the Comprehensive R Archive Network (CRAN) Learn from a well-respected member of the R community who created 30 R packages, including ggplot2, dplyr, and tidyr
Materials For Advanced Packaging
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Author : Daniel Lu
language : en
Publisher: Springer
Release Date : 2016-11-18
Materials For Advanced Packaging written by Daniel Lu and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2016-11-18 with Technology & Engineering categories.
Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.
Packaging Sustainability
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Author : Wendy Jedlicka
language : en
Publisher: John Wiley & Sons
Release Date : 2009-04-08
Packaging Sustainability written by Wendy Jedlicka and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2009-04-08 with Design categories.
How to take the lead with sustainable packaging design solutions With initiatives like the Wal-Mart Scorecard in the U.S. and the E.U.'s Packaging Directive, delivering sustainable packaging is now an integral part of today's global competitive market. Written by experts from a wide variety of fields, here is a comprehensive, single source of actionable information that enables everyone involved in the design and development process to make smart, informed decisions, opening new possibilities for creating truly innovative solutions. Wendy Jedlicka, CPP (Roseville, MN) is President of Jedlicka Design Ltd. and a member of the faculty at Minneapolis College of Art and Design's groundbreaking Sustainable Design Certificate Program. A Certified Packaging Professional, she serves as Upper Midwest Chapter Chair (o2umw.org), as well as U.S. co-coordinator for the o2 Global Green Design Network (o2.org), and contributes frequently to Packaging Design magazine's "Sustainability Update" feature column.
Managing Linux Systems With Webmin
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Author : Jamie Cameron
language : en
Publisher: Prentice Hall Professional
Release Date : 2004
Managing Linux Systems With Webmin written by Jamie Cameron and has been published by Prentice Hall Professional this book supported file pdf, txt, epub, kindle and other format this book has been release on 2004 with Computers categories.
bull; Written by the creator of Webmin -- the most popular GUI admin tool for Linux bull; Webmin is currently downloaded 4000 times a day & -- nearly one million times of all versions in the last year! Shows how to use Webmin to configure Apache, Sendmail, and other complex Linux servers bull; Start developing your own Webmin modules and themes with the complete reference for the API
Dielectrics For Nanosystems
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Author :
language : en
Publisher: The Electrochemical Society
Release Date : 2004
Dielectrics For Nanosystems written by and has been published by The Electrochemical Society this book supported file pdf, txt, epub, kindle and other format this book has been release on 2004 with Dielectrics categories.
Programming Languages And Systems
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Author : Hakjoo Oh
language : en
Publisher: Springer Nature
Release Date : 2021-10-12
Programming Languages And Systems written by Hakjoo Oh and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2021-10-12 with Computers categories.
This book constitutes the proceedings of the 19th Asian Symposium on Programming Languages and Systems, APLAS 2021, held in Chicago, USA, in October 2021.* The 17 papers presented in this volume were carefully reviewed and selected from 43 submissions. They were organized in topical sections named: analysis and synthesis, compilation and transformation, language, and verification. * The conference was held in a hybrid format due to the COVID-19 pandemic.
Rf Measurements Of Die And Packages
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Author : Scott A. Wartenberg
language : en
Publisher: Artech House
Release Date : 2002
Rf Measurements Of Die And Packages written by Scott A. Wartenberg and has been published by Artech House this book supported file pdf, txt, epub, kindle and other format this book has been release on 2002 with Technology & Engineering categories.
The recent explosion of the RF wireless integrated circuits (IC), coupled with higher operating speeds in digital IC's has made accurate RF testing of IC's vital. This ground-breaking resource explains the fundamentals of performing accurate RF measurements of die and packages. It offers you practical advice on how to use coplanar probes and test fixtures in the lab for RF on-wafer die and package characterization. It also details how to build separate RF test systems for noise, high-power, and thermal testing as well as de-embed the test system's parasitic effects to get the die's RF performance. This book is a handy, practical resource for RFIC and MMIC designers as well as high-frequency digital IC designers, IC test engineers, and IC manufacturing test engineers.