The Mechanics Of Solder Alloy Wetting And Spreading
DOWNLOAD
Download The Mechanics Of Solder Alloy Wetting And Spreading PDF/ePub or read online books in Mobi eBooks. Click Download or Read Online button to get The Mechanics Of Solder Alloy Wetting And Spreading book now. This website allows unlimited access to, at the time of writing, more than 1.5 million titles, including hundreds of thousands of titles in various foreign languages. If the content not found or just blank you must refresh this page
The Mechanics Of Solder Alloy Wetting And Spreading
DOWNLOAD
Author : Michael Hosking
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-12-06
The Mechanics Of Solder Alloy Wetting And Spreading written by Michael Hosking and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-06 with Technology & Engineering categories.
In 1992 Congress passed the Defense Manufacturing Engineering Education Act with the intent of encouraging academic institutions to increase their emphasis on manufacturing curricula. The need for this incentive to integrate the academic and industrial communities was clear: gaps in manufacturing science were inhibiting the evolution of new manufacturing technologies that are required for the U.S. to maintain a competitive posture in the world marketplace. The Army Research Laboratory and Sandia National Laboratories sought to contribute to the congressional intent by initiating a new series of graduate level college textbooks. The goal was to focus next-generation scientists onto issues that were common to the needs of the commercial market, the affordability of DoD weapons systems, and the mobilization readiness of the U.S. Armed Forces. The textbook The Mechanics of Solder Wetting and Spreading was written in this spirit by nationally renowned scientists for academe and industry. Research ers using the book are encouraged to formulate programs that will establish scien tific correlations between manufacturing process controls and product reliability. Such correlations are essential to the building of a new electronics industry which is based upon the futuristic concepts of Virtual Factories, Prototyping, and Testing.
The Mechanics Of Solder Alloy Wetting And Spreading
DOWNLOAD
Author : Michael Hosking
language : en
Publisher:
Release Date : 1993-11-30
The Mechanics Of Solder Alloy Wetting And Spreading written by Michael Hosking and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1993-11-30 with categories.
Mechanics Of Solder Alloy Interconnects
DOWNLOAD
Author : Darrel R. Frear
language : en
Publisher: Springer Science & Business Media
Release Date : 1994-01-31
Mechanics Of Solder Alloy Interconnects written by Darrel R. Frear and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 1994-01-31 with Computers categories.
The Mechanics of Solder Alloy Interconnects is a resource to be used in developing a solder joint reliability assessment. Each chapter is written to be used as a stand-alone resource for a particular aspect of materials and modeling issues. With this gained understanding, the reader in search of a solution to a solder joint reliability problem knows where in the materials and modeling communities to go for the appropriate answer.
The Mechanics Of Solder Alloy Interconnects
DOWNLOAD
Author :
language : en
Publisher:
Release Date : 1994
The Mechanics Of Solder Alloy Interconnects written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1994 with Solder and soldering categories.
Area Array Interconnection Handbook
DOWNLOAD
Author : Karl J. Puttlitz
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-12-06
Area Array Interconnection Handbook written by Karl J. Puttlitz and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-06 with Technology & Engineering categories.
Microelectronic packaging has been recognized as an important "enabler" for the solid state revolution in electronics which we have witnessed in the last third of the twentieth century. Packaging has provided the necessary external wiring and interconnection capability for transistors and integrated circuits while they have gone through their own spectacular revolution from discrete device to gigascale integration. At IBM we are proud to have created the initial, simple concept of flip chip with solder bump connections at a time when a better way was needed to boost the reliability and improve the manufacturability of semiconductors. The basic design which was chosen for SLT (Solid Logic Technology) in the 1960s was easily extended to integrated circuits in the '70s and VLSI in the '80s and '90s. Three I/O bumps have grown to 3000 with even more anticipated for the future. The package families have evolved from thick-film (SLT) to thin-film (metallized ceramic) to co-fired multi-layer ceramic. A later family or ceramics with matching expansivity to sili con and copper internal wiring was developed as a predecessor of the chip interconnection revolution in copper, multilevel, submicron wiring. Powerful server packages have been de veloped in which the combined chip and package copper wiring exceeds a kilometer. All of this was achieved with the constant objective of minimizing circuit delays through short, efficient interconnects.
Principles Of Soldering
DOWNLOAD
Author : Giles Humpston
language : en
Publisher: ASM International
Release Date : 2004
Principles Of Soldering written by Giles Humpston and has been published by ASM International this book supported file pdf, txt, epub, kindle and other format this book has been release on 2004 with Technology & Engineering categories.
Microjoining And Nanojoining
DOWNLOAD
Author : Y N Zhou
language : en
Publisher: Elsevier
Release Date : 2008-03-27
Microjoining And Nanojoining written by Y N Zhou and has been published by Elsevier this book supported file pdf, txt, epub, kindle and other format this book has been release on 2008-03-27 with Technology & Engineering categories.
Many important advances in technology have been associated with nanotechnology and the miniaturization of components, devices and systems. Microjoining has been closely associated with the evolution of microelectronic packaging, but actually covers a much broader area, and is essential for manufacturing many electronic, precision and medical products.Part one reviews the basics of microjoining, including solid-state bonding and fusion microwelding. Part two covers microjoining and nanojoining processes, such as bonding mechanisms and metallurgy, process development and optimization, thermal stresses and distortion, positioning and fixturing, sensing, and numerical modelling. Part three discusses microjoining of materials such as plastics, ceramics, metals and advanced materials such as shape memory alloys and nanomaterials. The book also discusses applications of microjoining such as joining superconductors, the manufacture of medical devices and the sealing of solid oxide fuel cells.This book provides a comprehensive overview of the fundamental aspects of microjoining processes and techniques. It is a valuable reference for production engineers, designers and researchers using or studying microjoining technologies in such industries as microelectronics and biomedical engineering. Reviews the basics of nanojoining including solid-state bonding and fusion microwelding Covers microjoining and nanojoining processes such as bonding mechanisms and metallurgy, sensing and numerical modelling Examines applications of microjoining such as the manufacturing of medical devices, and the sealing of solid oxide fuel cells
Computer Recognition Systems 4
DOWNLOAD
Author : Robert Burduk
language : en
Publisher: Springer Science & Business Media
Release Date : 2011-04-21
Computer Recognition Systems 4 written by Robert Burduk and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011-04-21 with Technology & Engineering categories.
The computer recognition systems are nowadays one of the most promising directions in artificial intelligence. This book is the most comprehensive study of this field. It contains a collection of 78 carefully selected articles contributed by experts of pattern recognition. It reports on current research with respect to both methodology and applications. In particular, it includes the following sections: Biometrics, Features, learning and classifiers, Image processing and computer vision, Knowledge acquisition based on reasoning methods Medical applications, Miscellaneous applications, This book is a great reference tool for scientists who deal with the problems of designing computer pattern recognition systems. Its target readers can be as well researchers as students of computer science, artificial intelligence or robotics.
Fatigue Of Electronic Materials
DOWNLOAD
Author : Scott A. Schroeder
language : en
Publisher: ASTM International
Release Date : 1994
Fatigue Of Electronic Materials written by Scott A. Schroeder and has been published by ASTM International this book supported file pdf, txt, epub, kindle and other format this book has been release on 1994 with Electronics categories.
Unlike earlier electronic circuits, today's microelectronic devices demand that solder serve structural as well as electrical ends, and do so at relatively high temperature for years. Fatigue and failure of the solder has therefore become an issue in the industry. Nine studies from a May 1993 sympos
National Semiconductor Metrology Program
DOWNLOAD
Author : National Semiconductor Metrology Program (U.S.)
language : en
Publisher:
Release Date : 1997
National Semiconductor Metrology Program written by National Semiconductor Metrology Program (U.S.) and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1997 with Semiconductors categories.