Thermal Spreading And Contact Resistance
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Thermal Spreading And Contact Resistance
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Author : Yuri S. Muzychka
language : en
Publisher: John Wiley & Sons
Release Date : 2023-08-09
Thermal Spreading And Contact Resistance written by Yuri S. Muzychka and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2023-08-09 with Science categories.
Thermal Spreading and Contact Resistance: Fundamentals and Applications Single source reference on how applying thermal spreading and contact resistance can solve problems across a variety of engineering fields Thermal Spreading and Contact Resistance: Fundamentals and Applications offers comprehensive coverage of the key information that engineers need to know to understand thermal spreading and contact resistance, including numerous predictive models for determining thermal spreading resistance and contact conductance of mechanical joints and interfaces, plus detailed examples throughout the book. Written by two of the leading experts in the field, Thermal Spreading and Contact Resistance: Fundamentals and Applications includes information on: Contact conductance, mass transfer, transport from super-hydrophobic surfaces, droplet/surface phase change problems, and tribology applications such as sliding surfaces and roller bearings Heat transfer in micro-devices and thermal spreaders, orthotropic systems, and multi-source applications for electronics thermal management applications Fundamental principles, thermal spreading in isotropic half-space regions, circular flux tubes and disc spreaders, and rectangular flux channels and compound spreaders Systems with non-uniform sink plane conductance, transient spreading resistance, and contact resistance between both non-conforming and conforming rough surfaces Providing comprehensive coverage of the subject, Thermal Spreading and Contact Resistance: Fundamentals and Applications is an essential resource for mechanical, aerospace, and chemical engineers working on research in the fields of heat transfer, thermal management of electronics, and tribology, as well as thermal engineers and researchers in the field of thermal physics.
Thermal Contact Conductance
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Author : C.V. Madhusudana
language : en
Publisher: Springer Science & Business Media
Release Date : 1995-12-15
Thermal Contact Conductance written by C.V. Madhusudana and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 1995-12-15 with Science categories.
Heat transfer between two bodies in thermal contact is of fundamental importance in a wide variety of applications ranging from industrial and domestic processes to fundamental biology and chemistry. This book covers both the theoretical and practical aspects of thermal contact conductance. The theoretical discussion covers heat transfer through spots, joints, and surfaces, as well as the role of interstitial materials (both planned and inadvertent). The practical discussion includes formulae and data for use in designing heat-transfer equipment for a variety of joints, including special geometries and configurations.
Thermal Management Of Telecommunications Equipment
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Author : Lian-Tuu Yeh
language : en
Publisher:
Release Date : 2023
Thermal Management Of Telecommunications Equipment written by Lian-Tuu Yeh and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2023 with Electronic apparatus and appliances categories.
Thermal Contact Conductance
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Author : Chakravarti V. Madhusudana
language : en
Publisher: Springer Science & Business Media
Release Date : 2013-09-24
Thermal Contact Conductance written by Chakravarti V. Madhusudana and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-09-24 with Science categories.
The work covers both theoretical and practical aspects of thermal contact conductance. The theoretical discussion focuses on heat transfer through spots, joints, and surfaces, as well as the role of interstitial materials (both planned and inadvertent). The practical discussion includes formulae and data that can be used in designing heat-transfer equipment for a variety of joints, including special geometries and configurations. All of the material has been updated to reflect the latest advances in the field.
Heat Transfer Handbook
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Author : Adrian Bejan
language : en
Publisher: John Wiley & Sons
Release Date : 2003-06-30
Heat Transfer Handbook written by Adrian Bejan and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2003-06-30 with Technology & Engineering categories.
Chapters contributed by thirty world-renown experts. * Covers all aspects of heat transfer, including micro-scale and heat transfer in electronic equipment. * An associated Web site offers computer formulations on thermophysical properties that provide the most up-to-date values.
Thermal Contact Resistance Volume I A Review Of The Literature
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Author : Merrill L. Minges
language : en
Publisher:
Release Date : 1966
Thermal Contact Resistance Volume I A Review Of The Literature written by Merrill L. Minges and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1966 with categories.
The objective of this report is to critically review the status of experimental and analytical developments in the area of heat transfer across interfaces of solids in contact. The nature of the heat flow patterns which develop across an imperfect interface are first discussed along with the equations defining the thermal contact resistance parameter. Following this a general discussion is given of the practical application areas where interface heat transfer is an important design parameter. The report gives a thorough presentation of the analytical analyses which have been developed to describe this phenomena. Surface deformation effects, geometrical characterization of surfaces and the influences of void phase conduction are outlined. Correlations of experimental results with analytical predictions are covered using equations derived for the single and multiple contact cases. Some of these correlations are based on limited experimental data; others are more generalized in nature.
Cooling Of Electronic Systems
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Author : Sadik Kakaç
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-12-06
Cooling Of Electronic Systems written by Sadik Kakaç and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-06 with Technology & Engineering categories.
Electronic technology is developing rapidly and, with it, the problems associated with the cooling of microelectronic equipment are becoming increasingly complex. So much so that it is necessary for experts in the fluid and thermal sciences to become involved with the cooling problem. Such thoughts as these led to an approach to leading specialists with a request to contribute to the present book. Cooling of Electronic Systems presents the technical progress achieved in the fundamentals of the thermal management of electronic systems and thermal strategies for the design of microelectronic equipment. The book starts with an introduction to the cooling of electronic systems, involving such topics as trends in computer system cooling, the cooling of high performance computers, thermal design of microelectronic components, natural and forced convection cooling, cooling by impinging air and liquid jets, thermal control systems for high speed computers, together with a detailed review of advances in manufacturing and assembly technology. Following this, practical methods for the determination of the parameters required for the thermal analysis of electronic systems and the accurate prediction of temperature in consumer electronics. Cooling of Electronic Systems is currently the most up-to-date book on the thermal management of electronic and microelectronic equipment, and the subject is presented by eminent scientists and experts in the field. Vital reading for all designers of modern, high-speed computers.
Qpedia Thermal Management Electronics Cooling Book Volume 1
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Author :
language : en
Publisher: Advanced Thermal Solutions
Release Date :
Qpedia Thermal Management Electronics Cooling Book Volume 1 written by and has been published by Advanced Thermal Solutions this book supported file pdf, txt, epub, kindle and other format this book has been release on with categories.
Thermal Design
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Author : HoSung Lee
language : en
Publisher: John Wiley & Sons
Release Date : 2022-05-20
Thermal Design written by HoSung Lee and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2022-05-20 with Technology & Engineering categories.
Thermal Design Discover a new window to thermal engineering and thermodynamics through the study of thermal design Thermal engineering is a specialized sub-discipline of mechanical engineering that focuses on the movement and transfer of heat energy between two mediums or altered into other forms of energy. Thermal engineers must have a strong knowledge of thermodynamics and the processes that convert generated energy from thermal sources into chemical, mechanical, or electrical energy — as such, thermal engineers can be employed in many industries, particularly in automotive manufacturing, commercial construction, and the HVAC industry. As part of their job, thermal engineers often have to improve a current system to make it more efficient, and so must be aware of a wide array of variables and familiar with a broad sweep of systems to ensure the work they do is economically viable. In this significantly updated new edition, Thermal Design details the physical mechanisms of standard thermal devices while integrating essential formulas and detailed derivations to give a practical understanding of the field to students. The textbook examines the design of thermal devices through mathematical modeling, graphical optimization, and occasionally computational-fluid-dynamic (CFD) simulation. Moreover, it presents information on significant thermal devices such as heat sinks, thermoelectric generators and coolers, heat pipes, and heat exchangers as design components in larger systems — all of which are increasingly important and fundamental to numerous fields such as microelectronic cooling, green or thermal energy conversion, and thermal control and management in space. Readers of the Second Edition of Thermal Design will also find: A new chapter on thermoelectrics that reflects the latest modern technology that has recently been developed More problems and examples to help clarify points throughout the book A range of appendices, including new additions, that include more specifics on topicscovered in the book, tutorials for applications, and computational work A solutions manual provided on a companion website Thermal Design is a useful reference for engineers and researchers in me chanical engineering, as well as senior undergraduate and graduate students in mechanical engineering.
Heat Transfer Between Surfaces In Contact An Analytical And Experimental Study Of Thermal Contact Resistance Of Metallic Interfaces
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Author :
language : en
Publisher:
Release Date : 1971
Heat Transfer Between Surfaces In Contact An Analytical And Experimental Study Of Thermal Contact Resistance Of Metallic Interfaces written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1971 with categories.