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Voil E S D Voil E S


Voil E S D Voil E S
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Esd


Esd
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Author : Steven H. Voldman
language : en
Publisher: John Wiley & Sons
Release Date : 2006-11-02

Esd written by Steven H. Voldman and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2006-11-02 with Technology & Engineering categories.


With the growth of high-speed telecommunications and wireless technology, it is becoming increasingly important for engineers to understand radio frequency (RF) applications and their sensitivity to electrostatic discharge (ESD) phenomena. This enables the development of ESD design methods for RF technology, leading to increased protection against electrical overstress (EOS) and ESD. ESD: RF Technology and Circuits: Presents methods for co-synthesizisng ESD networks for RF applications to achieve improved performance and ESD protection of semiconductor chips; discusses RF ESD design methods of capacitance load transformation, matching network co-synthesis, capacitance shunts, inductive shunts, impedance isolation, load cancellation methods, distributed loads, emitter degeneration, buffering and ballasting; examines ESD protection and design of active and passive elements in RF complementary metal-oxide-semiconductor (CMOS), RF laterally-diffused metal oxide semiconductor (LDMOS), RF BiCMOS Silicon Germanium (SiGe), RF BiCMOS Silicon Germanium Carbon (SiGeC), and Gallim Arsenide technology; gives information on RF ESD testing methodologies, RF degradation effects, and failure mechanisms for devices, circuits and systems; highlights RF ESD mixed-signal design integration of digital, analog and RF circuitry; sets out examples of RF ESD design computer aided design methodologies; covers state-of-the-art RF ESD input circuits, as well as voltage-triggered to RC-triggered ESD power clamps networks in RF technologies, as well as off-chip protection concepts. Following the authors series of books on ESD, this book will be a thorough overview of ESD in RF technology for RF semiconductor chip and ESD engineers. Device and circuit engineers working in the RF domain, and quality, reliability and failure analysis engineers will also find it a valuable reference in the rapidly growing are of RF ESD design. In addition, it will appeal to graduate students in RF microwave technology and RF circuit design.



Esd From A To Z


Esd From A To Z
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Author : John M. Kolyer
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-12-06

Esd From A To Z written by John M. Kolyer and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-06 with Technology & Engineering categories.


Existing sections in ESD Frim A to Z have been thoroughly revised and updated. New examples have been added to the troubleshooting chapter; and new versions of model specifications for ESD-safe handling and packaging can be found in the specifications chapter. The Appendix now includes ten recently published papers (making a total of 20) whose topics span the field of ESD control.



The Esd Handbook


The Esd Handbook
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Author : Steven H. Voldman
language : en
Publisher: John Wiley & Sons
Release Date : 2021-03-02

The Esd Handbook written by Steven H. Voldman and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2021-03-02 with Technology & Engineering categories.


A practical and comprehensive reference that explores Electrostatic Discharge (ESD) in semiconductor components and electronic systems The ESD Handbook offers a comprehensive reference that explores topics relevant to ESD design in semiconductor components and explores ESD in various systems. Electrostatic discharge is a common problem in the semiconductor environment and this reference fills a gap in the literature by discussing ESD protection. Written by a noted expert on the topic, the text offers a topic-by-topic reference that includes illustrative figures, discussions, and drawings. The handbook covers a wide-range of topics including ESD in manufacturing (garments, wrist straps, and shoes); ESD Testing; ESD device physics; ESD semiconductor process effects; ESD failure mechanisms; ESD circuits in different technologies (CMOS, Bipolar, etc.); ESD circuit types (Pin, Power, Pin-to-Pin, etc.); and much more. In addition, the text includes a glossary, index, tables, illustrations, and a variety of case studies. Contains a well-organized reference that provides a quick review on a range of ESD topics Fills the gap in the current literature by providing information from purely scientific and physical aspects to practical applications Offers information in clear and accessible terms Written by the accomplished author of the popular ESD book series Written for technicians, operators, engineers, circuit designers, and failure analysis engineers, The ESD Handbook contains an accessible reference to ESD design and ESD systems.



Esd From A To Z


Esd From A To Z
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Author : John Kolyer
language : en
Publisher: Springer Science & Business Media
Release Date : 1990-08-02

Esd From A To Z written by John Kolyer and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 1990-08-02 with Science categories.


This cost-effective approach to ESD-control situations provides a detailed and logical system that codifies control methods into specific model specifications that can be adapted to any program. By emphasizing the essentials of handling technique, it minimizes the need for expensive equipment beyond the reach of many budgets. Annotation copyrighted by Book News, Inc., Portland, OR



Official Gazette Of The United States Patent And Trademark Office


Official Gazette Of The United States Patent And Trademark Office
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Author : United States. Patent and Trademark Office
language : en
Publisher:
Release Date : 2002

Official Gazette Of The United States Patent And Trademark Office written by United States. Patent and Trademark Office and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2002 with Patents categories.




Handbook Of Aerospace Electromagnetic Compatibility


Handbook Of Aerospace Electromagnetic Compatibility
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Author : Reinaldo J. Perez
language : en
Publisher: John Wiley & Sons
Release Date : 2018-12-27

Handbook Of Aerospace Electromagnetic Compatibility written by Reinaldo J. Perez and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-12-27 with Science categories.


A comprehensive resource that explores electromagnetic compatibility (EMC) for aerospace systems Handbook of Aerospace Electromagnetic Compatibility is a groundbreaking book on EMC for aerospace systems that addresses both aircraft and space vehicles. With contributions from an international panel of aerospace EMC experts, this important text deals with the testing of spacecraft components and subsystems, analysis of crosstalk and field coupling, aircraft communication systems, and much more. The text also includes information on lightning effects and testing, as well as guidance on design principles and techniques for lightning protection. The book offers an introduction to E3 models and techniques in aerospace systems and explores EMP effects on and technology for aerospace systems. Filled with the most up-to-date information, illustrative examples, descriptive figures, and helpful scenarios, Handbook of Aerospace Electromagnetic Compatibility is designed to be a practical information source. This vital guide to electromagnetic compatibility: • Provides information on a range of topics including grounding, coupling, test procedures, standards, and requirements • Offers discussions on standards for aerospace applications • Addresses aerospace EMC through the use of testing and theoretical approaches Written for EMC engineers and practitioners, Handbook of Aerospace Electromagnetic Compatibility is a critical text for understanding EMC for aerospace systems.



Cyclotrons And Their Applications Twelfth International Conference


Cyclotrons And Their Applications Twelfth International Conference
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Author : B Martin
language : en
Publisher: World Scientific
Release Date : 1991-02-22

Cyclotrons And Their Applications Twelfth International Conference written by B Martin and has been published by World Scientific this book supported file pdf, txt, epub, kindle and other format this book has been release on 1991-02-22 with categories.


The international conference held in Berlin is the 12th in the series of meetings to provide the exchange of ideas and information by cyclotron builders and users throughout the world. The international character is confirmed by the number of countries represented, the general interest by the numbers of contributions and participants. The Berlin conference which was organized by the Hahn-Meitner-Institut Berlin, had about 220 participants from 22 countries with about 165 contributions, thereof 16 invited.



Design Constraints For Nfc Devices


Design Constraints For Nfc Devices
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Author : Dominique Paret
language : en
Publisher: John Wiley & Sons
Release Date : 2016-04-11

Design Constraints For Nfc Devices written by Dominique Paret and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2016-04-11 with Technology & Engineering categories.


Near field communication (NFC) can appear to be a simple intuitive technology for exchanging data between close devices. In reality, these contactless structures that combine components and antennas must respect important and specific working constraints. Illustrated by a number of detailed technological examples, this book discusses the multiple normative (ISO, CEN, NFC Forum, EMVCo, etc.) and regulatory (ERC, FCC, ETSI, radiofrequency, private and ecological pollution, etc.) constraints, as well as the applied, typological, functional, structural, environmental or interoperability constraints that a NFC device might face. Design Constraints for NFC Devices also presents techniques that enable us to free ourselves from the technological constraints of current NFC operations encountered in banking, public transport, administration, automotive, industrial, communicating object and Internet of Things applications.



Wireless Power Transfer For E Mobility


Wireless Power Transfer For E Mobility
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Author : Mauro Feliziani
language : en
Publisher: Elsevier
Release Date : 2023-12-13

Wireless Power Transfer For E Mobility written by Mauro Feliziani and has been published by Elsevier this book supported file pdf, txt, epub, kindle and other format this book has been release on 2023-12-13 with Technology & Engineering categories.


Wireless Power Transfer for e-Mobility: Fundamentals and Design Guidelines for Wireless Charging of Electric Vehicles provides a comprehensive resource for researchers and engineers engaged in the development of automotive WPT systems. The book opens with an overview of wireless technologies for power transfer and their evolution over time, then focusing on the application of this technology to electric mobility highlighting its importance in terms of impact and perspectives on the development of sustainable transport and autonomous driving. Chapters discuss the fundamentals of electromagnetic field in WPT systems and the circuit modelling. In addition, they examine core current electric vehicle systems and present-day automotive WPT standards. Design techniques of magnetic couplers, including compensation networks are explored in-depth alongside power electronics techniques for automotive WPT systems. Both stationary and dynamic automotive WPT systems are rigorously assessed. Finally, the problems of electromagnetic compatibility and electromagnetic field safety are described with particular attention to shielding techniques for the mitigation of magnetic field emissions. Addressing essential knowledge from foundational to advanced levels, Wireless Power Transfer for e-Mobility provides practical guidance to engineers and researchers developing the future of electric mobility. Provides an advanced foundation for research and current industrial applications in automotive WPT systems Develops proven methodologies linked to some case studies using examples drawn from global practice Explores the role of WPT in near-future mobility scenarios, with featured coverage of electrified transportation Includes an extensive usage of equations from MATLAB, Spice and COMSOL



Design Of 3d Integrated Circuits And Systems


Design Of 3d Integrated Circuits And Systems
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Author : Rohit Sharma
language : en
Publisher: CRC Press
Release Date : 2018-09-03

Design Of 3d Integrated Circuits And Systems written by Rohit Sharma and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-09-03 with Technology & Engineering categories.


Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration requires a greater understanding of several interconnected systems stacked over each other. While this vertical growth profoundly increases the system functionality, it also exponentially increases the design complexity. Design of 3D Integrated Circuits and Systems tackles all aspects of 3D integration, including 3D circuit and system design, new processes and simulation techniques, alternative communication schemes for 3D circuits and systems, application of novel materials for 3D systems, and the thermal challenges to restrict power dissipation and improve performance of 3D systems. Containing contributions from experts in industry as well as academia, this authoritative text: Illustrates different 3D integration approaches, such as die-to-die, die-to-wafer, and wafer-to-wafer Discusses the use of interposer technology and the role of Through-Silicon Vias (TSVs) Presents the latest improvements in three major fields of thermal management for multiprocessor systems-on-chip (MPSoCs) Explores ThruChip Interface (TCI), NAND flash memory stacking, and emerging applications Describes large-scale integration testing and state-of-the-art low-power testing solutions Complete with experimental results of chip-level 3D integration schemes tested at IBM and case studies on advanced complementary metal–oxide–semiconductor (CMOS) integration for 3D integrated circuits (ICs), Design of 3D Integrated Circuits and Systems is a practical reference that not only covers a wealth of design issues encountered in 3D integration but also demonstrates their impact on the efficiency of 3D systems.