Design Of 3d Integrated Circuits And Systems
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Design Of 3d Integrated Circuits And Systems
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Author : Rohit Sharma
language : en
Publisher: CRC Press
Release Date : 2018-09-03
Design Of 3d Integrated Circuits And Systems written by Rohit Sharma and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-09-03 with Technology & Engineering categories.
Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration requires a greater understanding of several interconnected systems stacked over each other. While this vertical growth profoundly increases the system functionality, it also exponentially increases the design complexity. Design of 3D Integrated Circuits and Systems tackles all aspects of 3D integration, including 3D circuit and system design, new processes and simulation techniques, alternative communication schemes for 3D circuits and systems, application of novel materials for 3D systems, and the thermal challenges to restrict power dissipation and improve performance of 3D systems. Containing contributions from experts in industry as well as academia, this authoritative text: Illustrates different 3D integration approaches, such as die-to-die, die-to-wafer, and wafer-to-wafer Discusses the use of interposer technology and the role of Through-Silicon Vias (TSVs) Presents the latest improvements in three major fields of thermal management for multiprocessor systems-on-chip (MPSoCs) Explores ThruChip Interface (TCI), NAND flash memory stacking, and emerging applications Describes large-scale integration testing and state-of-the-art low-power testing solutions Complete with experimental results of chip-level 3D integration schemes tested at IBM and case studies on advanced complementary metal–oxide–semiconductor (CMOS) integration for 3D integrated circuits (ICs), Design of 3D Integrated Circuits and Systems is a practical reference that not only covers a wealth of design issues encountered in 3D integration but also demonstrates their impact on the efficiency of 3D systems.
Design Of 3d Integrated Circuits And Systems
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Author : Rohit Sharma
language : en
Publisher: CRC Press
Release Date : 2018-09-03
Design Of 3d Integrated Circuits And Systems written by Rohit Sharma and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-09-03 with Science categories.
Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration requires a greater understanding of several interconnected systems stacked over each other. While this vertical growth profoundly increases the system functionality, it also exponentially increases the design complexity. Design of 3D Integrated Circuits and Systems tackles all aspects of 3D integration, including 3D circuit and system design, new processes and simulation techniques, alternative communication schemes for 3D circuits and systems, application of novel materials for 3D systems, and the thermal challenges to restrict power dissipation and improve performance of 3D systems. Containing contributions from experts in industry as well as academia, this authoritative text: Illustrates different 3D integration approaches, such as die-to-die, die-to-wafer, and wafer-to-wafer Discusses the use of interposer technology and the role of Through-Silicon Vias (TSVs) Presents the latest improvements in three major fields of thermal management for multiprocessor systems-on-chip (MPSoCs) Explores ThruChip Interface (TCI), NAND flash memory stacking, and emerging applications Describes large-scale integration testing and state-of-the-art low-power testing solutions Complete with experimental results of chip-level 3D integration schemes tested at IBM and case studies on advanced complementary metal–oxide–semiconductor (CMOS) integration for 3D integrated circuits (ICs), Design of 3D Integrated Circuits and Systems is a practical reference that not only covers a wealth of design issues encountered in 3D integration but also demonstrates their impact on the efficiency of 3D systems.
Physical Design For 3d Integrated Circuits
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Author : Aida Todri-Sanial
language : en
Publisher: CRC Press
Release Date : 2017-12-19
Physical Design For 3d Integrated Circuits written by Aida Todri-Sanial and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-12-19 with Technology & Engineering categories.
Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology. The book begins by offering an overview of physical design challenges with respect to conventional 2D circuits, and then each chapter delivers an in-depth look at a specific physical design topic. This comprehensive reference: Contains extensive coverage of the physical design of 2.5D/3D ICs and monolithic 3D ICs Supplies state-of-the-art solutions for challenges unique to 3D circuit design Features contributions from renowned experts in their respective fields Physical Design for 3D Integrated Circuits provides a single, convenient source of cutting-edge information for those pursuing 2.5D/3D technology.
Advances In 3d Integrated Circuits And Systems
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Author : Hao Yu
language : en
Publisher: World Scientific
Release Date : 2015-08-28
Advances In 3d Integrated Circuits And Systems written by Hao Yu and has been published by World Scientific this book supported file pdf, txt, epub, kindle and other format this book has been release on 2015-08-28 with Technology & Engineering categories.
3D integration is an emerging technology for the design of many-core microprocessors and memory integration. This book, Advances in 3D Integrated Circuits and Systems, is written to help readers understand 3D integrated circuits in three stages: device basics, system level management, and real designs.Contents presented in this book include fabrication techniques for 3D TSV and 2.5D TSI; device modeling; physical designs; thermal, power and I/O management; and 3D designs of sensors, I/Os, multi-core processors, and memory.Advanced undergraduates, graduate students, researchers and engineers may find this text useful for understanding the many challenges faced in the development and building of 3D integrated circuits and systems.
Design For High Performance Low Power And Reliable 3d Integrated Circuits
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Author : Sung Kyu Lim
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-11-27
Design For High Performance Low Power And Reliable 3d Integrated Circuits written by Sung Kyu Lim and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-11-27 with Technology & Engineering categories.
This book provides readers with a variety of algorithms and software tools, dedicated to the physical design of through-silicon-via (TSV) based, three-dimensional integrated circuits. It describes numerous “manufacturing-ready” GDSII-level layouts of TSV-based 3D ICs developed with the tools covered in the book. This book will also feature sign-off level analysis of timing, power, signal integrity, and thermal analysis for 3D IC designs. Full details of the related algorithms will be provided so that the readers will be able not only to grasp the core mechanics of the physical design tools, but also to be able to reproduce and improve upon the results themselves. This book will also offer various design-for-manufacturability (DFM), design-for-reliability (DFR), and design-for-testability (DFT) techniques that are considered critical to the physical design process.
Three Dimensional Integrated Circuit Design
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Author : Yuan Xie
language : en
Publisher: Springer Science & Business Media
Release Date : 2009-12-02
Three Dimensional Integrated Circuit Design written by Yuan Xie and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2009-12-02 with Technology & Engineering categories.
We live in a time of great change. In the electronics world, the last several decades have seen unprecedented growth and advancement, described by Moore’s law. This observation stated that transistor density in integrated circuits doubles every 1. 5–2 years. This came with the simultaneous improvement of individual device perf- mance as well as the reduction of device power such that the total power of the resulting ICs remained under control. No trend remains constant forever, and this is unfortunately the case with Moore’s law. The trouble began a number of years ago when CMOS devices were no longer able to proceed along the classical scaling trends. Key device parameters such as gate oxide thickness were simply no longer able to scale. As a result, device o- state currents began to creep up at an alarming rate. These continuing problems with classical scaling have led to a leveling off of IC clock speeds to the range of several GHz. Of course, chips can be clocked higher but the thermal issues become unmanageable. This has led to the recent trend toward microprocessors with mul- ple cores, each running at a few GHz at the most. The goal is to continue improving performance via parallelism by adding more and more cores instead of increasing speed. The challenge here is to ensure that general purpose codes can be ef?ciently parallelized. There is another potential solution to the problem of how to improve CMOS technology performance: three-dimensional integrated circuits (3D ICs).
Integrated Circuit And System Design Power And Timing Modeling Optimization And Simulation
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Author : Rene van Leuken
language : en
Publisher: Springer Science & Business Media
Release Date : 2011-02-04
Integrated Circuit And System Design Power And Timing Modeling Optimization And Simulation written by Rene van Leuken and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011-02-04 with Computers categories.
This book constitutes the refereed proceedings of the 20th International Conference on Integrated Circuit and System Design, PATMOS 2010, held in Grenoble, France, in September 2010. The 24 revised full papers presented and the 9 extended abstracts were carefully reviewed and are organized in topical sections on design flows; circuit techniques; low power circuits; self-timed circuits; process variation; high-level modeling of poweraware heterogeneous designs in SystemC-AMS; and minalogic.
Ai Enabled Electronic Circuit And System Design
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Author : Ali Iranmanesh
language : en
Publisher: Springer Nature
Release Date : 2025-01-27
Ai Enabled Electronic Circuit And System Design written by Ali Iranmanesh and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2025-01-27 with Computers categories.
As our world becomes increasingly digital, electronics underpin nearly every industry. Understanding how AI enhances this foundational technology can unlock innovations, from smarter homes to more powerful gadgets, offering vast opportunities for businesses and consumers alike. This book demystifies how AI streamlines the creation of electronic systems, making them smarter and more efficient. With AI’s transformative impact on various engineering fields, this resource provides an up-to-date exploration of these advancements, authored by experts actively engaged in this dynamic field. Stay ahead in the rapidly evolving landscape of AI in engineering with “AI-Enabled Electronic Circuit and System Design: From Ideation to Utilization,” your essential guide to the future of electronic systems. !--[endif]--A transformative guide describing how revolutionizes electronic design through AI integration. Highlighting trends, challenges and opportunities; Demystifies complex AI applications in electronic design for practical use; Leading insights, authored by top experts actively engaged in the field; Offers a current, relevant exploration of significant topics in AI’s role in electronic circuit and system design. Editor’s bios. Dr. Ali A. Iranmanesh is the founder and CEO of Silicon Valley Polytechnic Institute. He has received his Bachelor of Science in Electrical Engineering from Sharif University of Technology (SUT), Tehran, Iran, and both his master’s and Ph.D. degrees in Electrical Engineering and Physics from Stanford University in Stanford, CA. He additionally holds a master’s degree in business administration (MBA) from San Jose State University in San Jose, CA. Dr. Iranmanesh is the founder and chairman of the International Society for Quality Electronic Design (ISQED). Currently, he serves as the CEO of Innovotek. Dr. Iranmanesh has been instrumental in advancing semiconductor technologies, innovative design methodologies, and engineering education. He holds nearly 100 US and international patents, reflecting his signifi cant contributions to the field. Dr. Iranmanesh is the Senior life members of EEE, senior member of the American Society for Quality, co-founder and Chair Emeritus of the IEEE Education Society of Silicon Valley, Vice Chair Emeritus of the IEEE PV chapter, and recipient of IEEE Outstanding Educator Award. Dr. Hossein Sayadi is a Tenure-Track Assistant Professor and Associate Chair in the Department of Computer Engineering and Computer Science at California State University, Long Beach (CSULB). He earned his Ph.D. in Electrical and Computer Engineering from George Mason University in Fairfax, Virginia, and an M.Sc. in Computer Engineering from Sharif University of Technology in Tehran, Iran. As a recognized researcher with over 14 years of research experience, Dr. Sayadi is the founder and director of the Intelligent, Secure, and Energy-Efficient Computing (iSEC) Lab at CSULB. His research focuses on advancing hardware security and trust, AI and machine learning, cybersecurity, and energy-efficient computing, addressing critical challenges in modern computing and cyber-physical systems. He has authored over 75 peer-reviewed publications in leading conferences and journals. Dr. Sayadi is the CSU STEM-NET Faculty Fellow, with his research supported by multiple National Science Foundation (NSF) grants and awards from CSULB and the CSU Chancellor’s Office. He has contributed to various international conferences as an organizer and program committee member, including as the TPC Chair for the 2024 and 2025 IEEE ISQED.
Electrical Modeling And Design For 3d System Integration
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Author : Er-Ping Li
language : en
Publisher: John Wiley & Sons
Release Date : 2012-03-19
Electrical Modeling And Design For 3d System Integration written by Er-Ping Li and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-03-19 with Technology & Engineering categories.
New advanced modeling methods for simulating the electromagnetic properties of complex three-dimensional electronic systems Based on the author's extensive research, this book sets forth tested and proven electromagnetic modeling and simulation methods for analyzing signal and power integrity as well as electromagnetic interference in large complex electronic interconnects, multilayered package structures, integrated circuits, and printed circuit boards. Readers will discover the state of the technology in electronic package integration and printed circuit board simulation and modeling. In addition to popular full-wave electromagnetic computational methods, the book presents new, more sophisticated modeling methods, offering readers the most advanced tools for analyzing and designing large complex electronic structures. Electrical Modeling and Design for 3D System Integration begins with a comprehensive review of current modeling and simulation methods for signal integrity, power integrity, and electromagnetic compatibility. Next, the book guides readers through: The macromodeling technique used in the electrical and electromagnetic modeling and simulation of complex interconnects in three-dimensional integrated systems The semi-analytical scattering matrix method based on the N-body scattering theory for modeling of three-dimensional electronic package and multilayered printed circuit boards with multiple vias Two- and three-dimensional integral equation methods for the analysis of power distribution networks in three-dimensional package integrations The physics-based algorithm for extracting the equivalent circuit of a complex power distribution network in three-dimensional integrated systems and printed circuit boards An equivalent circuit model of through-silicon vias Metal-oxide-semiconductor capacitance effects of through-silicon vias Engineers, researchers, and students can turn to this book for the latest techniques and methods for the electrical modeling and design of electronic packaging, three-dimensional electronic integration, integrated circuits, and printed circuit boards.
Integrated Circuit And System Design Power And Timing Modeling Optimization And Simulation
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Author : Lars Svensson
language : en
Publisher: Springer Science & Business Media
Release Date : 2009-02-13
Integrated Circuit And System Design Power And Timing Modeling Optimization And Simulation written by Lars Svensson and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2009-02-13 with Computers categories.
This book constitutes the thoroughly refereed post-conference proceedings of 18th International Workshop on Power and Timing Modeling, Optimization and Simulation, PATMOS 2008, featuring Integrated Circuit and System Design, held in Lisbon, Portugal during September 10-12, 2008. The 31 revised full papers and 10 revised poster papers presented together with 3 invited talks and 4 papers from a special session on reconfigurable architectures were carefully reviewed and selected from numerous submissions. The papers are organized in topical sections on low-leakage and subthreshold circuits, low-power methods and models, arithmetic and memories, variability and statistical timing, synchronization and interconnect, power supplies and switching noise, low-power circuits; reconfigurable architectures, circuits and methods, power and delay modeling, as well as power optimizations addressing reconfigurable architectures.