Advances In 3d Integrated Circuits And Systems

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Advances In 3d Integrated Circuits And Systems

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Author : Hao Yu
language : en
Publisher: World Scientific
Release Date : 2015-08-28

Advances In 3d Integrated Circuits And Systems written by Hao Yu and has been published by World Scientific this book supported file pdf, txt, epub, kindle and other format this book has been release on 2015-08-28 with Technology & Engineering categories.

3D integration is an emerging technology for the design of many-core microprocessors and memory integration. This book, Advances in 3D Integrated Circuits and Systems, is written to help readers understand 3D integrated circuits in three stages: device basics, system level management, and real designs.Contents presented in this book include fabrication techniques for 3D TSV and 2.5D TSI; device modeling; physical designs; thermal, power and I/O management; and 3D designs of sensors, I/Os, multi-core processors, and memory.Advanced undergraduates, graduate students, researchers and engineers may find this text useful for understanding the many challenges faced in the development and building of 3D integrated circuits and systems.

Design Of 3d Integrated Circuits And Systems

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Author : Rohit Sharma
language : en
Publisher: CRC Press
Release Date : 2018-09-03

Design Of 3d Integrated Circuits And Systems written by Rohit Sharma and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-09-03 with Technology & Engineering categories.

Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration requires a greater understanding of several interconnected systems stacked over each other. While this vertical growth profoundly increases the system functionality, it also exponentially increases the design complexity. Design of 3D Integrated Circuits and Systems tackles all aspects of 3D integration, including 3D circuit and system design, new processes and simulation techniques, alternative communication schemes for 3D circuits and systems, application of novel materials for 3D systems, and the thermal challenges to restrict power dissipation and improve performance of 3D systems. Containing contributions from experts in industry as well as academia, this authoritative text: Illustrates different 3D integration approaches, such as die-to-die, die-to-wafer, and wafer-to-wafer Discusses the use of interposer technology and the role of Through-Silicon Vias (TSVs) Presents the latest improvements in three major fields of thermal management for multiprocessor systems-on-chip (MPSoCs) Explores ThruChip Interface (TCI), NAND flash memory stacking, and emerging applications Describes large-scale integration testing and state-of-the-art low-power testing solutions Complete with experimental results of chip-level 3D integration schemes tested at IBM and case studies on advanced complementary metal–oxide–semiconductor (CMOS) integration for 3D integrated circuits (ICs), Design of 3D Integrated Circuits and Systems is a practical reference that not only covers a wealth of design issues encountered in 3D integration but also demonstrates their impact on the efficiency of 3D systems.

Advanced Multicore Systems On Chip

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Author : Abderazek Ben Abdallah
language : en
Publisher: Springer
Release Date : 2017-09-10

Advanced Multicore Systems On Chip written by Abderazek Ben Abdallah and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-09-10 with Computers categories.

From basic architecture, interconnection, and parallelization to power optimization, this book provides a comprehensive description of emerging multicore systems-on-chip (MCSoCs) hardware and software design. Highlighting both fundamentals and advanced software and hardware design, it can serve as a primary textbook for advanced courses in MCSoCs design and embedded systems. The first three chapters introduce MCSoCs architectures, present design challenges and conventional design methods, and describe in detail the main building blocks of MCSoCs. Chapters 4, 5, and 6 discuss fundamental and advanced on-chip interconnection network technologies for multi and many core SoCs, enabling readers to understand the microarchitectures for on-chip routers and network interfaces that are essential in the context of latency, area, and power constraints. With the rise of multicore and many-core systems, concurrency is becoming a major issue in the daily life of a programmer. Thus, compiler and software development tools are critical in helping programmers create high-performance software. Programmers should make sure that their parallelized program codes will not cause race condition, memory-access deadlocks, or other faults that may crash their entire systems. As such, Chapter 7 describes a novel parallelizing compiler design for high-performance computing. Chapter 8 provides a detailed investigation of power reduction techniques for MCSoCs at component and network levels. It discusses energy conservation in general hardware design, and also in embedded multicore system components, such as CPUs, disks, displays and memories. Lastly, Chapter 9 presents a real embedded MCSoCs system design targeted for health monitoring in the elderly.

Integrated Interconnect Technologies For 3d Nanoelectronic Systems

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Author : Muhannad S. Bakir
language : en
Publisher: Artech House
Release Date : 2009

Integrated Interconnect Technologies For 3d Nanoelectronic Systems written by Muhannad S. Bakir and has been published by Artech House this book supported file pdf, txt, epub, kindle and other format this book has been release on 2009 with Technology & Engineering categories.

This cutting-edge book on off-chip technologies puts the hottest breakthroughs in high-density compliant electrical interconnects, nanophotonics, and microfluidics at your fingertips, integrating the full range of mathematics, physics, and technology issues together in a single comprehensive source. You get full details on state-of-the-art I/O interconnects and packaging, including mechanically compliant I/O approaches, fabrication, and assembly, followed by the latest advances and applications in power delivery design, analysis, and modeling. The book explores interconnect structures, materials, and packages for achieving high-bandwidth off-chip electrical communication, including optical interconnects and chip-to-chip signaling approaches, and brings you up to speed on CMOS integrated optical devices, 3D integration, wafer stacking technology, and through-wafer interconnects.

3d Integration In Vlsi Circuits

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Author : Katsuyuki Sakuma
language : en
Publisher: CRC Press
Release Date : 2018-04-17

3d Integration In Vlsi Circuits written by Katsuyuki Sakuma and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-04-17 with Technology & Engineering categories.

Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D ICs. The goal of this book is to provide readers with an understanding of the latest challenges and issues in 3D integration. TSVs are not the only technology element needed for 3D integration. There are numerous other key enabling technologies required for 3D integration, and the speed of the development in this emerging field is very rapid. To provide readers with state-of-the-art information on 3D integration research and technology developments, each chapter has been contributed by some of the world’s leading scientists and experts from academia, research institutes, and industry from around the globe. Covers chip/wafer level 3D integration technology, memory stacking, reconfigurable 3D, and monolithic 3D IC. Discusses the use of silicon interposer and organic interposer. Presents architecture, design, and technology implementations for 3D FPGA integration. Describes oxide bonding, Cu/SiO2 hybrid bonding, adhesive bonding, and solder bonding. Addresses the issue of thermal dissipation in 3D integration.

Physical Design For 3d Integrated Circuits

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Author : Aida Todri-Sanial
language : en
Publisher: CRC Press
Release Date : 2017-12-19

Physical Design For 3d Integrated Circuits written by Aida Todri-Sanial and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-12-19 with Technology & Engineering categories.

Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology. The book begins by offering an overview of physical design challenges with respect to conventional 2D circuits, and then each chapter delivers an in-depth look at a specific physical design topic. This comprehensive reference: Contains extensive coverage of the physical design of 2.5D/3D ICs and monolithic 3D ICs Supplies state-of-the-art solutions for challenges unique to 3D circuit design Features contributions from renowned experts in their respective fields Physical Design for 3D Integrated Circuits provides a single, convenient source of cutting-edge information for those pursuing 2.5D/3D technology.

Silicon Compatible Materials Processes And Technologies For Advanced Integrated Circuits And Emerging Applications

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Author : F. Roozeboom
language : en
Publisher: The Electrochemical Society
Release Date : 2011-04-25

Silicon Compatible Materials Processes And Technologies For Advanced Integrated Circuits And Emerging Applications written by F. Roozeboom and has been published by The Electrochemical Society this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011-04-25 with Science categories.

This issue of ECS Transactions covers emerging materials, process and technology options for large-area silicon wafers to enhance advanced IC performance or to enable revolutionary device structures with entirely new functionalities. Topics : high-mobility channel materials, (e.g. strained Si/Ge, compound semiconductors and graphene), high-performance gate stacks and low-resistivity junctions and contacts on new, Si-compatible materials; new materials and processes for 3-D (TSV) integration ; synthesis of nano-structures including wires, pores and membranes of Si-compatible materials; novel MEMS/NEMS structures and their integration with the mainstream Si-IC technology.

3d Ic And Rf Sips Advanced Stacking And Planar Solutions For 5g Mobility

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Author : Lih-Tyng Hwang
language : en
Publisher: John Wiley & Sons
Release Date : 2018-03-29

3d Ic And Rf Sips Advanced Stacking And Planar Solutions For 5g Mobility written by Lih-Tyng Hwang and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-03-29 with Technology & Engineering categories.

An interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability assessments Features an interdisciplinary approach to the enabling technologies and hardware for 3D ICs and 5G mobility Presents statistical treatments and examples with tools that are easily accessible, such as Microsoft’s Excel and Minitab Fundamental design topics such as electromagnetic design for logic and RF/passives centric circuits are explained in detail Provides chapter-wise review questions and powerpoint slides as teaching tools

Handbook Of 3d Integration Volume 4

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Author : Paul D. Franzon
language : en
Publisher: John Wiley & Sons
Release Date : 2019-05-06

Handbook Of 3d Integration Volume 4 written by Paul D. Franzon and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-05-06 with Technology & Engineering categories.

This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration.

Advanced Interconnects For Ulsi Technology

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Author : Mikhail Baklanov
language : en
Publisher: John Wiley & Sons
Release Date : 2012-02-17

Advanced Interconnects For Ulsi Technology written by Mikhail Baklanov and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-02-17 with Technology & Engineering categories.

Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects, and discusses: Interconnect functions, characterisations, electrical properties and wiring requirements Low-k materials: fundamentals, advances and mechanical properties Conductive layers and barriers Integration and reliability including mechanical reliability, electromigration and electrical breakdown New approaches including 3D, optical, wireless interchip, and carbon-based interconnects Intended for postgraduate students and researchers, in academia and industry, this book provides a critical overview of the enabling technology at the heart of the future development of computer chips.