Handbook Of 3d Integration Volume 4
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Handbook Of 3d Integration Volume 4
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Author : Paul D. Franzon
language : en
Publisher: John Wiley & Sons
Release Date : 2019-01-25
Handbook Of 3d Integration Volume 4 written by Paul D. Franzon and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-01-25 with Technology & Engineering categories.
This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration.
Handbook Of 3d Integration Volume 4
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Author : Paul D. Franzon
language : en
Publisher: John Wiley & Sons
Release Date : 2019-05-06
Handbook Of 3d Integration Volume 4 written by Paul D. Franzon and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-05-06 with Technology & Engineering categories.
This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration.
Handbook Of 3d Integration Volume 1
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Author : Philip Garrou
language : en
Publisher: John Wiley & Sons
Release Date : 2011-09-22
Handbook Of 3d Integration Volume 1 written by Philip Garrou and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011-09-22 with Technology & Engineering categories.
The first encompassing treatise of this new, but very important field puts the known physical limitations for classic 2D electronics into perspective with the requirements for further electronics developments and market necessities. This two-volume handbook presents 3D solutions to the feature density problem, addressing all important issues, such as wafer processing, die bonding, packaging technology, and thermal aspects. It begins with an introductory part, which defines necessary goals, existing issues and relates 3D integration to the semiconductor roadmap of the industry. Before going on to cover processing technology and 3D structure fabrication strategies in detail. This is followed by fields of application and a look at the future of 3D integration. The contributions come from key players in the field, from both academia and industry, including such companies as Lincoln Labs, Fraunhofer, RPI, ASET, IMEC, CEA-LETI, IBM, and Renesas.
Handbook Of 3d Integration Volume 3
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Author : Philip Garrou
language : en
Publisher: John Wiley & Sons
Release Date : 2014-07-21
Handbook Of 3d Integration Volume 3 written by Philip Garrou and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-07-21 with Technology & Engineering categories.
Edited by key figures in 3D integration and written by top authors from high-tech companies and renowned research institutions, this book covers the intricate details of 3D process technology. As such, the main focus is on silicon via formation, bonding and debonding, thinning, via reveal and backside processing, both from a technological and a materials science perspective. The last part of the book is concerned with assessing and enhancing the reliability of the 3D integrated devices, which is a prerequisite for the large-scale implementation of this emerging technology. Invaluable reading for materials scientists, semiconductor physicists, and those working in the semiconductor industry, as well as IT and electrical engineers.
Resonant Mems
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Author : Oliver Brand
language : en
Publisher: John Wiley & Sons
Release Date : 2015-04-22
Resonant Mems written by Oliver Brand and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2015-04-22 with Technology & Engineering categories.
Part of the AMN book series, this book covers the principles, modeling and implementation as well as applications of resonant MEMS from a unified viewpoint. It starts out with the fundamental equations and phenomena that govern the behavior of resonant MEMS and then gives a detailed overview of their implementation in capacitive, piezoelectric, thermal and organic devices, complemented by chapters addressing the packaging of the devices and their stability. The last part of the book is devoted to the cutting-edge applications of resonant MEMS such as inertial, chemical and biosensors, fluid properties sensors, timing devices and energy harvesting systems.
Art Book News Annual Volume 4 2008art Book News Annual Volume 4 2008
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Author :
language : en
Publisher: Book News Inc.
Release Date :
Art Book News Annual Volume 4 2008art Book News Annual Volume 4 2008 written by and has been published by Book News Inc. this book supported file pdf, txt, epub, kindle and other format this book has been release on with categories.
Introduction For Heart 3d Bioprinting Book 4
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Author : Edenilson Brandl
language : en
Publisher: Edenilson Brandl
Release Date : 2024-05-18
Introduction For Heart 3d Bioprinting Book 4 written by Edenilson Brandl and has been published by Edenilson Brandl this book supported file pdf, txt, epub, kindle and other format this book has been release on 2024-05-18 with Medical categories.
In recent years, the field of 3D bioprinting has witnessed remarkable advancements, particularly in the realm of cardiovascular medicine. The ability to fabricate intricate cardiac structures using biocompatible materials holds immense promise for revolutionizing the treatment of heart disease and advancing regenerative medicine. This book aims to provide a comprehensive overview of the multifaceted landscape of 3D bioprinting as it pertains to the heart. From the fundamentals of heart modeling and biomaterial selection to the intricate interplay of genetic engineering and pharmacological customization, each chapter delves into key concepts and cutting-edge research in the field. Throughout these pages, readers will explore the latest developments in heart 3D bioprinting, including the challenges posed by tissue vascularization, the integration of artificial intelligence for personalized treatment strategies, and the potential applications of this technology in telemedicine and space environments. Moreover, this book underscores the interdisciplinary nature of 3D bioprinting, highlighting the collaborative efforts of researchers, clinicians, engineers, and ethicists in pushing the boundaries of innovation. By addressing not only the technical aspects but also the ethical considerations and societal implications of organ bioprinting, we strive to foster a holistic understanding of this transformative technology. Whether you are a seasoned researcher seeking to expand your knowledge or a newcomer intrigued by the possibilities of 3D bioprinting, we hope that this book serves as a valuable resource and catalyst for further exploration in this exciting field. Happy reading, and may the journey through the intricate realm of heart 3D bioprinting inspire you to envision a future where personalized, regenerative therapies are within reach for all.
Interconnect Technologies For Integrated Circuits And Flexible Electronics
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Author : Yash Agrawal
language : en
Publisher: Springer Nature
Release Date : 2023-09-21
Interconnect Technologies For Integrated Circuits And Flexible Electronics written by Yash Agrawal and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2023-09-21 with Technology & Engineering categories.
This contributed book provides a thorough understanding of the basics along with detailed state-of-the-art emerging interconnect technologies for integrated circuit design and flexible electronics. It focuses on the investigation of advanced on-chip interconnects which match the current as well as future technology requirements. The contents focus on different aspects of interconnects such as material, physical characteristics, parasitic extraction, design, structure, modeling, machine learning, and neural network-based models for interconnects, signaling schemes, varying signal integrity performance analysis, variability, reliability aspects, associated electronic design automation tools. The book also explores interconnect technologies for flexible electronic systems. It also highlights the integration of sensors with stretchable interconnects to demonstrate the concept of a stretchable sensing network for wearable and flexible applications. This book is a useful guide for those working in academia and industry to understand the fundamentals and application of interconnect technologies.
Carbon Nanotubes For Interconnects
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Author : Aida Todri-Sanial
language : en
Publisher: Springer
Release Date : 2016-07-09
Carbon Nanotubes For Interconnects written by Aida Todri-Sanial and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2016-07-09 with Technology & Engineering categories.
This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in order to improve the performance, reliability and integration of 3D integrated circuits (ICs). This book will be first to provide a coherent overview of exploiting carbon nanotubes for 3D interconnects covering aspects from processing, modeling, simulation, characterization and applications. Coverage also includes a thorough presentation of the application of CNTs as horizontal on-chip interconnects which can potentially revolutionize the nanoelectronics industry. This book is a must-read for anyone interested in the state-of-the-art on exploiting carbon nanotubes for interconnects for both 2D and 3D integrated circuits.
Introduction For Liver 3d Bioprinting Book 4
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Author : Edenilson Brandl
language : en
Publisher: Edenilson Brandl
Release Date : 2024-05-19
Introduction For Liver 3d Bioprinting Book 4 written by Edenilson Brandl and has been published by Edenilson Brandl this book supported file pdf, txt, epub, kindle and other format this book has been release on 2024-05-19 with Medical categories.
In recent years, 3D bioprinting has emerged as a groundbreaking technology with the potential to revolutionize the field of regenerative medicine. The ability to create complex, functional biological tissues and organs using advanced printing techniques promises to address some of the most pressing challenges in healthcare, including organ shortages and the need for personalized medical treatments. This book, Introduction for Liver 3D Bioprinting – Book 4: Introduction for Liver 3D Bioprinting, aims to provide a comprehensive guide to the current state of liver bioprinting, exploring the technological advancements, applications, and future directions of this innovative field. The liver, being one of the most vital organs in the human body, is central to numerous metabolic, detoxification, and synthetic functions. The high incidence of liver diseases and the limited availability of donor organs underscore the urgent need for alternative therapeutic strategies. This book delves into the nuances of liver 3D bioprinting, presenting a detailed exploration of the processes, materials, and technologies involved in creating bioprinted liver tissues and models. Throughout the chapters, we cover a wide array of topics, from the basics of 3D bioprinting technology and the development of bioprintable materials to the applications of liver bioprinting in scientific research, pharmacological testing, and clinical practices. We explore the use of computational modeling, stem cell engineering, and advanced imaging technologies in enhancing the precision and functionality of bioprinted liver tissues. Additionally, the book addresses the ethical, legal, and regulatory challenges associated with the bioprinting of human organs, providing a balanced perspective on the potential and limitations of this technology. We hope that this book will serve as a valuable resource for researchers, clinicians, students, and anyone interested in the field of 3D bioprinting. By presenting a thorough overview of liver bioprinting, we aim to inspire innovation and collaboration, fostering the development of new techniques and solutions that can ultimately improve patient outcomes and advance the field of regenerative medicine. I would like to extend my deepest gratitude to all the contributors, researchers, and professionals whose work and dedication have made this book possible. Your commitment to pushing the boundaries of medical science is truly inspiring. To the readers, thank you for your interest and support. Together, let us embark on this exciting journey towards the future of medicine, where the possibilities of 3D bioprinting are just beginning to be realized.