Interconnect Technologies For Integrated Circuits And Flexible Electronics
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Interconnect Technologies For Integrated Circuits And Flexible Electronics
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Author : Yash Agrawal
language : en
Publisher: Springer Nature
Release Date : 2023-09-21
Interconnect Technologies For Integrated Circuits And Flexible Electronics written by Yash Agrawal and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2023-09-21 with Technology & Engineering categories.
This contributed book provides a thorough understanding of the basics along with detailed state-of-the-art emerging interconnect technologies for integrated circuit design and flexible electronics. It focuses on the investigation of advanced on-chip interconnects which match the current as well as future technology requirements. The contents focus on different aspects of interconnects such as material, physical characteristics, parasitic extraction, design, structure, modeling, machine learning, and neural network-based models for interconnects, signaling schemes, varying signal integrity performance analysis, variability, reliability aspects, associated electronic design automation tools. The book also explores interconnect technologies for flexible electronic systems. It also highlights the integration of sensors with stretchable interconnects to demonstrate the concept of a stretchable sensing network for wearable and flexible applications. This book is a useful guide for those working in academia and industry to understand the fundamentals and application of interconnect technologies.
Proceedings Of Third International Conference On Computational Electronics For Wireless Communications
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Author : Sanyog Rawat
language : en
Publisher: Springer Nature
Release Date : 2024-12-01
Proceedings Of Third International Conference On Computational Electronics For Wireless Communications written by Sanyog Rawat and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2024-12-01 with Technology & Engineering categories.
This book includes high-quality papers presented at the Third International Conference on Computational Electronics for Wireless Communications (ICCWC 2023), held at Dr. B. R. Ambedkar National Institute of Technology Jalandhar, India, during December 22-23, 2023. The book presents original research work of academics and industry professionals to exchange their knowledge of the state-of-the-art research and development in computational electronics with an emphasis on wireless communications. The topics covered in the book are radio frequency and microwave, signal processing, microelectronics, and wireless networks.
Encyclopedia Of Packaging Materials Processes And Mechanics
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Author : Avram Bar-Cohen
language : en
Publisher: World Scientific
Release Date : 2019
Encyclopedia Of Packaging Materials Processes And Mechanics written by Avram Bar-Cohen and has been published by World Scientific this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019 with Packaging categories.
"Packaging materials, assembly processes, and the detailed understanding of multilayer mechanics have enabled much of the progress in miniaturization, reliability, and functional density achieved by modern electronic, microelectronic, and nanoelectronic products. The design and manufacture of miniaturized packages, providing low-loss electrical and/or optical communication, while protecting the semiconductor chips from environmental stresses and internal power cycling, require a carefully balanced selection of packaging materials and processes. Due to the relative fragility of these semiconductor chips, as well as the underlying laminated substrates and the bridging interconnect, selection of the packaging materials and processes is inextricably bound with the mechanical behavior of the intimately packaged multilayer structures, in all phases of development for traditional, as well as emerging, electronic product categories. The Encyclopedia of Packaging Materials, Processes, and Mechanics, compiled in 8, multi-volume sets, provides comprehensive coverage of the configurations and techniques, assembly materials and processes, modeling and simulation tools, and experimental characterization and validation techniques for electronic packaging. Each of the volumes presents the accumulated wisdom and shared perspectives of leading researchers and practitioners in the packaging of electronic components. The Encyclopedia of Packaging Materials, Processes, and Mechanics will provide the novice and student with a complete reference for a quick ascent on the packaging "learning curve," the practitioner with a validated set of techniques and tools to face every challenge in packaging design and development, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in the assembly and mechanical behavior of electronic and photonic components and systems. It will be most beneficial to undergraduate and graduate students studying materials, mechanical, electrical, and electronic engineering, with a strong interest in electronic packaging applications"--Publisher's website
Research And Technology Program Digest
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Author : United States. National Aeronautics and Space Administration
language : en
Publisher:
Release Date :
Research And Technology Program Digest written by United States. National Aeronautics and Space Administration and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on with categories.
Area Array Interconnection Handbook
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Author : Karl J. Puttlitz
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-12-06
Area Array Interconnection Handbook written by Karl J. Puttlitz and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-06 with Technology & Engineering categories.
Microelectronic packaging has been recognized as an important "enabler" for the solid state revolution in electronics which we have witnessed in the last third of the twentieth century. Packaging has provided the necessary external wiring and interconnection capability for transistors and integrated circuits while they have gone through their own spectacular revolution from discrete device to gigascale integration. At IBM we are proud to have created the initial, simple concept of flip chip with solder bump connections at a time when a better way was needed to boost the reliability and improve the manufacturability of semiconductors. The basic design which was chosen for SLT (Solid Logic Technology) in the 1960s was easily extended to integrated circuits in the '70s and VLSI in the '80s and '90s. Three I/O bumps have grown to 3000 with even more anticipated for the future. The package families have evolved from thick-film (SLT) to thin-film (metallized ceramic) to co-fired multi-layer ceramic. A later family or ceramics with matching expansivity to sili con and copper internal wiring was developed as a predecessor of the chip interconnection revolution in copper, multilevel, submicron wiring. Powerful server packages have been de veloped in which the combined chip and package copper wiring exceeds a kilometer. All of this was achieved with the constant objective of minimizing circuit delays through short, efficient interconnects.
Electronic Materials Handbook
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Author :
language : en
Publisher: ASM International
Release Date : 1989-11-01
Electronic Materials Handbook written by and has been published by ASM International this book supported file pdf, txt, epub, kindle and other format this book has been release on 1989-11-01 with Technology & Engineering categories.
Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.
Nanocarbon Electronics
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Author : Changjian Zhou
language : en
Publisher: CRC Press
Release Date : 2020-12-30
Nanocarbon Electronics written by Changjian Zhou and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2020-12-30 with Technology & Engineering categories.
This book presents a comprehensive review of research on applications of carbon nanotubes (CNTs) and graphene to electronic devices. As nanocarbons in general, and CNTs and graphene in particular, are becoming increasingly recognized as the most promising materials for future generations of electronic devices, including transistors, sensors, and interconnects, a knowledge gap still exists between the basic science of nanocarbons and their feasibility for cost-effective product manufacturing. The book highlights some of the issues surrounding this missing link by providing a detailed review of the nanostructure and electronic properties, materials, and device fabrication and of the structure–property–application relationships.
Advances In Semiconductor Technologies
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Author : An Chen
language : en
Publisher: John Wiley & Sons
Release Date : 2022-09-27
Advances In Semiconductor Technologies written by An Chen and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2022-09-27 with Technology & Engineering categories.
Advances in Semiconductor Technologies Discover the broad sweep of semiconductor technologies in this uniquely curated resource Semiconductor technologies and innovations have been the backbone of numerous different fields: electronics, online commerce, the information and communication industry, and the defense industry. For over fifty years, silicon technology and CMOS scaling have been the central focus and primary driver of innovation in the semiconductor industry. Traditional CMOS scaling has approached some fundamental limits, and as a result, the pace of scientific research and discovery for novel semiconductor technologies is increasing with a focus on novel materials, devices, designs, architectures, and computer paradigms. In particular, new computing paradigms and systems—such as quantum computing, artificial intelligence, and Internet of Things—have the potential to unlock unprecedented power and application space. Advances in Semiconductor Technologies provides a comprehensive overview of selected semiconductor technologies and the most up-to-date research topics, looking in particular at mainstream developments in current industry research and development, from emerging materials and devices, to new computing paradigms and applications. This full-coverage volume gives the reader valuable insights into state-of-the-art advances currently being fabricated, a wide range of novel applications currently under investigation, and a glance into the future with emerging technologies in development. Advances in Semiconductor Technologies readers will also find: A comprehensive approach that ensures a thorough understanding of state-of-the-art technologies currently being fabricated Treatments on all aspects of semiconductor technologies, including materials, devices, manufacturing, modeling, design, architecture, and applications Articles written by an impressive team of international academics and industry insiders that provide unique insights into a wide range of topics Advances in Semiconductor Technologies is a useful, time-saving reference for electrical engineers working in industry and research, who are looking to stay abreast of rapidly advancing developments in semiconductor electronics, as well as academics in the field and government policy advisors.
Cmoset 2014 Abstracts
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Author : CMOS Emerging Technologies Research
language : en
Publisher: CMOS Emerging Technologies
Release Date : 2014-03-26
Cmoset 2014 Abstracts written by CMOS Emerging Technologies Research and has been published by CMOS Emerging Technologies this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-03-26 with categories.
A collection of abstracts for talks presented at the 2014 CMOS Emerging Technologies Research Symposium in Grenoble, France, July 6-8, 2014. The CMOS Emerging Technologies Research Symposium is a research and business event for those who want to discuss and find out about new exciting high tech opportunities. The conference provides researchers, companies and academic institutions with a platform for showcasing their technology, innovations, products and services. By bringing together people from all areas of the high tech arena, we create a stimulating common ground for exploring collaborations and encouraging discussions on emerging technologies.
Wdm Systems And Networks
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Author : Neophytos Neo Antoniades
language : en
Publisher: Springer Science & Business Media
Release Date : 2011-12-07
Wdm Systems And Networks written by Neophytos Neo Antoniades and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011-12-07 with Technology & Engineering categories.
Modeling, Simulation, Design and Engineering of WDM Systems and Networks provides readers with the basic skills, concepts, and design techniques used to begin design and engineering of optical communication systems and networks at various layers. The latest semi-analytical system simulation techniques are applied to optical WDM systems and networks, and a review of the various current areas of optical communications is presented. Simulation is mixed with experimental verification and engineering to present the industry as well as state-of-the-art research. This contributed volume is divided into three parts, accommodating different readers interested in various types of networks and applications. The first part of the book presents modeling approaches and simulation tools mainly for the physical layer including transmission effects, devices, subsystems, and systems), whereas the second part features more engineering/design issues for various types of optical systems including ULH, access, and in-building systems. The third part of the book covers networking issues related to the design of provisioning and survivability algorithms for impairment-aware and multi-domain networks. Intended for professional scientists, company engineers, and university researchers, the text demonstrates the effectiveness of computer-aided design when it comes to network engineering and prototyping.