3d Ic And Rf Sips Advanced Stacking And Planar Solutions For 5g Mobility

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3d Ic And Rf Sips Advanced Stacking And Planar Solutions For 5g Mobility

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Author : Lih-Tyng Hwang
language : en
Publisher: John Wiley & Sons
Release Date : 2018-03-28

3d Ic And Rf Sips Advanced Stacking And Planar Solutions For 5g Mobility written by Lih-Tyng Hwang and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-03-28 with Technology & Engineering categories.

An interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability assessments Features an interdisciplinary approach to the enabling technologies and hardware for 3D ICs and 5G mobility Presents statistical treatments and examples with tools that are easily accessible, such as Microsoft’s Excel and Minitab Fundamental design topics such as electromagnetic design for logic and RF/passives centric circuits are explained in detail Provides chapter-wise review questions and powerpoint slides as teaching tools

3d Ic And Rf Sips Advanced Stacking And Planar Solutions For 5g Mobility

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Author : Lih-Tyng Hwang
language : en
Publisher: John Wiley & Sons
Release Date : 2018-03-29

3d Ic And Rf Sips Advanced Stacking And Planar Solutions For 5g Mobility written by Lih-Tyng Hwang and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-03-29 with Technology & Engineering categories.

An interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability assessments Features an interdisciplinary approach to the enabling technologies and hardware for 3D ICs and 5G mobility Presents statistical treatments and examples with tools that are easily accessible, such as Microsoft’s Excel and Minitab Fundamental design topics such as electromagnetic design for logic and RF/passives centric circuits are explained in detail Provides chapter-wise review questions and powerpoint slides as teaching tools

Advanced Nanoscale Mosfet Architectures

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Author : Kalyan Biswas
language : en
Publisher: John Wiley & Sons
Release Date : 2024-07-03

Advanced Nanoscale Mosfet Architectures written by Kalyan Biswas and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2024-07-03 with Technology & Engineering categories.

Comprehensive reference on the fundamental principles and basic physics dictating metal–oxide–semiconductor field-effect transistor (MOSFET) operation Advanced Nanoscale MOSFET Architectures provides an in-depth review of modern metal–oxide–semiconductor field-effect transistor (MOSFET) device technologies and advancements, with information on their operation, various architectures, fabrication, materials, modeling and simulation methods, circuit applications, and other aspects related to nanoscale MOSFET technology. The text begins with an introduction to the foundational technology before moving on to describe challenges associated with the scaling of nanoscale devices. Other topics covered include device physics and operation, strain engineering for highly scaled MOSFETs, tunnel FET, graphene based field effect transistors, and more. The text also compares silicon bulk and devices, nanosheet transistors and introduces low-power circuit design using advanced MOSFETs. Additional topics covered include: High-k gate dielectrics and metal gate electrodes for multi-gate MOSFETs, covering gate stack processing and metal gate modification Strain engineering in 3D complementary metal-oxide semiconductors (CMOS) and its scaling impact, and strain engineering in silicon–germanium (SiGe) FinFET and its challenges and future perspectives TCAD simulation of multi-gate MOSFET, covering model calibration and device performance for analog and RF applications Description of the design of an analog amplifier circuit using digital CMOS technology of SCL for ultra-low power VLSI applications Advanced Nanoscale MOSFET Architectures helps readers understand device physics and design of new structures and material compositions, making it an important resource for the researchers and professionals who are carrying out research in the field, along with students in related programs of study.

Mimo Ofdm Wireless Communications With Matlab

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Author : Yong Soo Cho
language : en
Publisher: John Wiley & Sons
Release Date : 2010-08-20

Mimo Ofdm Wireless Communications With Matlab written by Yong Soo Cho and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2010-08-20 with Technology & Engineering categories.

MIMO-OFDM is a key technology for next-generation cellular communications (3GPP-LTE, Mobile WiMAX, IMT-Advanced) as well as wireless LAN (IEEE 802.11a, IEEE 802.11n), wireless PAN (MB-OFDM), and broadcasting (DAB, DVB, DMB). In MIMO-OFDM Wireless Communications with MATLAB®, the authors provide a comprehensive introduction to the theory and practice of wireless channel modeling, OFDM, and MIMO, using MATLAB® programs to simulate the various techniques on MIMO-OFDM systems. One of the only books in the area dedicated to explaining simulation aspects Covers implementation to help cement the key concepts Uses materials that have been classroom-tested in numerous universities Provides the analytic solutions and practical examples with downloadable MATLAB® codes Simulation examples based on actual industry and research projects Presentation slides with key equations and figures for instructor use MIMO-OFDM Wireless Communications with MATLAB® is a key text for graduate students in wireless communications. Professionals and technicians in wireless communication fields, graduate students in signal processing, as well as senior undergraduates majoring in wireless communications will find this book a practical introduction to the MIMO-OFDM techniques. Instructor materials and MATLAB® code examples available for download at www.wiley.com/go/chomimo

Semiconductor Advanced Packaging

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Author : John H. Lau
language : en
Publisher: Springer Nature
Release Date : 2021-05-17

Semiconductor Advanced Packaging written by John H. Lau and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2021-05-17 with Technology & Engineering categories.

The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.

Heterogeneous Integrations

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Author : John H. Lau
language : en
Publisher: Springer
Release Date : 2019-04-03

Heterogeneous Integrations written by John H. Lau and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-04-03 with Technology & Engineering categories.

Heterogeneous integration uses packaging technology to integrate dissimilar chips, LED, MEMS, VCSEL, etc. from different fabless houses and with different functions and wafer sizes into a single system or subsystem. How are these dissimilar chips and optical components supposed to talk to each other? The answer is redistribution layers (RDLs). This book addresses the fabrication of RDLs for heterogeneous integrations, and especially focuses on RDLs on: A) organic substrates, B) silicon substrates (through-silicon via (TSV)-interposers), C) silicon substrates (bridges), D) fan-out substrates, and E) ASIC, memory, LED, MEMS, and VCSEL systems. The book offers a valuable asset for researchers, engineers, and graduate students in the fields of semiconductor packaging, materials sciences, mechanical engineering, electronic engineering, telecommunications, networking, etc.

Nano Chips 2030

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Author : Boris Murmann
language : en
Publisher: Springer Nature
Release Date : 2020-06-08

Nano Chips 2030 written by Boris Murmann and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2020-06-08 with Science categories.

In this book, a global team of experts from academia, research institutes and industry presents their vision on how new nano-chip architectures will enable the performance and energy efficiency needed for AI-driven advancements in autonomous mobility, healthcare, and man-machine cooperation. Recent reviews of the status quo, as presented in CHIPS 2020 (Springer), have prompted the need for an urgent reassessment of opportunities in nanoelectronic information technology. As such, this book explores the foundations of a new era in nanoelectronics that will drive progress in intelligent chip systems for energy-efficient information technology, on-chip deep learning for data analytics, and quantum computing. Given its scope, this book provides a timely compendium that hopes to inspire and shape the future of nanoelectronics in the decades to come.

Smart Device To Smart Device Communication

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Author : Shahid Mumtaz
language : en
Publisher: Springer Science & Business Media
Release Date : 2014-04-05

Smart Device To Smart Device Communication written by Shahid Mumtaz and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-04-05 with Technology & Engineering categories.

This book presents a comprehensive analysis of D2D communication over LTE-A band. The book uses 3GPP LTE-A as a baseline and explains all fundamental requirements for deploying D2D network under cellular systems from an architectural, technical and business point of view. The contributors explain the standardization activities of Release 12 of LTE-A, which has been recently acknowledged as support of D2D communication in LTE-A. The text updates the research community on the D2D roadmap as well as new features emerging for consideration in 3GPP.

Electronic Systems And Intelligent Computing

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Author : Pradeep Kumar Mallick
language : en
Publisher: Springer Nature
Release Date : 2020-09-22

Electronic Systems And Intelligent Computing written by Pradeep Kumar Mallick and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2020-09-22 with Technology & Engineering categories.

This book presents selected, high-quality research papers from the International Conference on Electronic Systems and Intelligent Computing (ESIC 2020), held at NIT Yupia, Arunachal Pradesh, India, on 2 – 4 March 2020. Discussing the latest challenges and solutions in the field of smart computing, cyber-physical systems and intelligent technologies, it includes papers based on original theoretical, practical and experimental simulations, developments, applications, measurements, and testing. The applications and solutions featured provide valuable reference material for future product development.

Flip Chip Technologies

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Author : John H. Lau
language : en
Publisher: McGraw-Hill Professional Publishing
Release Date : 1996

Flip Chip Technologies written by John H. Lau and has been published by McGraw-Hill Professional Publishing this book supported file pdf, txt, epub, kindle and other format this book has been release on 1996 with Technology & Engineering categories.

A guide to flip chip technologies, for professionals in flip chip and MCM research and development, and for engineers and technical managers choosing design and manufacturing processes for electronic packaging and interconnect systems. Discusses economic, design, material, quality, and reliability issues of flip chip technologies, and details aspects of classical solder-bumped flip chip interconnect technologies; the next generations of flip chip technologies; and known-good-die testing for multiple module applications. Annotation copyright by Book News, Inc., Portland, OR