Advanced Interconnects For Ulsi Technology
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Advanced Interconnects For Ulsi Technology
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Author : Mikhail Baklanov
language : en
Publisher: John Wiley & Sons
Release Date : 2012-02-17
Advanced Interconnects For Ulsi Technology written by Mikhail Baklanov and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-02-17 with Technology & Engineering categories.
Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects, and discusses: Interconnect functions, characterisations, electrical properties and wiring requirements Low-k materials: fundamentals, advances and mechanical properties Conductive layers and barriers Integration and reliability including mechanical reliability, electromigration and electrical breakdown New approaches including 3D, optical, wireless interchip, and carbon-based interconnects Intended for postgraduate students and researchers, in academia and industry, this book provides a critical overview of the enabling technology at the heart of the future development of computer chips.
Advanced Nanoscale Ulsi Interconnects Fundamentals And Applications
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Author : Yosi Shacham-Diamand
language : en
Publisher: Springer Science & Business Media
Release Date : 2009-09-19
Advanced Nanoscale Ulsi Interconnects Fundamentals And Applications written by Yosi Shacham-Diamand and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2009-09-19 with Science categories.
In Advanced ULSI interconnects – fundamentals and applications we bring a comprehensive description of copper-based interconnect technology for ultra-lar- scale integration (ULSI) technology for integrated circuit (IC) application. In- grated circuit technology is the base for all modern electronics systems. You can ?nd electronics systems today everywhere: from toys and home appliances to a- planes and space shuttles. Electronics systems form the hardware that together with software are the bases of the modern information society. The rapid growth and vast exploitation of modern electronics system create a strong demand for new and improved electronic circuits as demonstrated by the amazing progress in the ?eld of ULSI technology. This progress is well described by the famous “Moore’s law” which states, in its most general form, that all the metrics that describe integrated circuit performance (e. g. , speed, number of devices, chip area) improve expon- tially as a function of time. For example, the number of components per chip d- bles every 18 months and the critical dimension on a chip has shrunk by 50% every 2 years on average in the last 30 years. This rapid growth in integrated circuits te- nology results in highly complex integrated circuits with an increasing number of interconnects on chips and between the chip and its package. The complexity of the interconnect network on chips involves an increasing number of metal lines per interconnect level, more interconnect levels, and at the same time a reduction in the interconnect line critical dimensions.
Reliability Characterisation Of Electrical And Electronic Systems
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Author :
language : en
Publisher: Elsevier
Release Date : 2014-12-24
Reliability Characterisation Of Electrical And Electronic Systems written by and has been published by Elsevier this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-12-24 with Technology & Engineering categories.
This book takes a holistic approach to reliability engineering for electrical and electronic systems by looking at the failure mechanisms, testing methods, failure analysis, characterisation techniques and prediction models that can be used to increase reliability for a range of devices. The text describes the reliability behavior of electrical and electronic systems. It takes an empirical scientific approach to reliability engineering to facilitate a greater understanding of operating conditions, failure mechanisms and the need for testing for a more realistic characterisation. After introducing the fundamentals and background to reliability theory, the text moves on to describe the methods of reliability analysis and charactersation across a wide range of applications. Takes a holistic approach to reliability engineering Looks at the failure mechanisms, testing methods, failure analysis, characterisation techniques and prediction models that can be used to increase reliability Facilitates a greater understanding of operating conditions, failure mechanisms and the need for testing for a more realistic characterisation
Proceedings
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Author :
language : en
Publisher:
Release Date : 2001
Proceedings written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2001 with Integrated circuits categories.
Electromigration In Metals
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Author : Paul S. Ho
language : en
Publisher: Cambridge University Press
Release Date : 2022-05-12
Electromigration In Metals written by Paul S. Ho and has been published by Cambridge University Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2022-05-12 with Technology & Engineering categories.
Learn to assess electromigration reliability and design more resilient chips in this comprehensive and practical resource. Beginning with fundamental physics and building to advanced methodologies, this book enables the reader to develop highly reliable on-chip wiring stacks and power grids. Through a detailed review on the role of microstructure, interfaces and processing on electromigration reliability, as well as characterisation, testing and analysis, the book follows the development of on-chip interconnects from microscale to nanoscale. Practical modeling methodologies for statistical analysis, from simple 1D approximation to complex 3D description, can be used for step-by-step development of reliable on-chip wiring stacks and industrial-grade power/ground grids. This is an ideal resource for materials scientists and reliability and chip design engineers.
Semiconductors Dielectrics And Metals For Nanoelectronics 15 In Memory Of Samares Kar
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Author : D. Misra
language : en
Publisher: The Electrochemical Society
Release Date :
Semiconductors Dielectrics And Metals For Nanoelectronics 15 In Memory Of Samares Kar written by D. Misra and has been published by The Electrochemical Society this book supported file pdf, txt, epub, kindle and other format this book has been release on with categories.
Cmos Plasma And Process Damage
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Author : Kirk Prall
language : en
Publisher: Springer Nature
Release Date : 2025-05-16
Cmos Plasma And Process Damage written by Kirk Prall and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2025-05-16 with Technology & Engineering categories.
This book discusses the complex technology of building CMOS computer chips and covers some of the unusual problems that can occur during chip manufacturing. Readers will learn how plasma and process damage results from the high-energy processes that are used in chip manufacturing, causing harm to the chips, functional failure and reliability problems.
Signal Integrity Effects In Custom Ic And Asic Designs
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Author : Raminderpal Singh
language : en
Publisher: John Wiley & Sons
Release Date : 2001-12-12
Signal Integrity Effects In Custom Ic And Asic Designs written by Raminderpal Singh and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2001-12-12 with Technology & Engineering categories.
"...offers a tutorial guide to IC designers who want to move to the next level of chip design by unlocking the secrets of signal integrity." —Jake Buurma, Senior Vice President, Worldwide Research & Development, Cadence Design Systems, Inc. Covers signal integrity effects in high performance Radio Frequency (RF) IC Brings together research papers from the past few years that address the broad range of issues faced by IC designers and CAD managers now and in the future A Wiley-IEEE Press publication
Esd
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Author : Steven H. Voldman
language : en
Publisher: John Wiley & Sons
Release Date : 2005-12-13
Esd written by Steven H. Voldman and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2005-12-13 with Technology & Engineering categories.
This volume is the first in a series of three books addressing Electrostatic Discharge (ESD) physics, devices, circuits and design across the full range of integrated circuit technologies. ESD Physics and Devices provides a concise treatment of the ESD phenomenon and the physics of devices operating under ESD conditions. Voldman presents an accessible introduction to the field for engineers and researchers requiring a solid grounding in this important area. The book contains advanced CMOS, Silicon On Insulator, Silicon Germanium, and Silicon Germanium Carbon. In addition it also addresses ESD in advanced CMOS with discussions on shallow trench isolation (STI), Copper and Low K materials. Provides a clear understanding of ESD device physics and the fundamentals of ESD phenomena. Analyses the behaviour of semiconductor devices under ESD conditions. Addresses the growing awareness of the problems resulting from ESD phenomena in advanced integrated circuits. Covers ESD testing, failure criteria and scaling theory for CMOS, SOI (silicon on insulator), BiCMOS and BiCMOS SiGe (Silicon Germanium) technologies for the first time. Discusses the design and development implications of ESD in semiconductor technologies. An invaluable reference for EMC non-specialist engineers and researchers working in the fields of IC and transistor design. Also, suitable for researchers and advanced students in the fields of device/circuit modelling and semiconductor reliability.
Silver Metallization
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Author : Daniel Adams
language : en
Publisher: Springer Science & Business Media
Release Date : 2007-10-27
Silver Metallization written by Daniel Adams and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007-10-27 with Science categories.
Here is the first book to discuss the current understanding of silver metallization and its potential as a future interconnect material for integrated circuit technology. With the lowest resistivity of all metals, silver is an attractive interconnect material for higher current densities and faster switching speeds in integrated circuits. Over the past ten years, extensive research has been conducted to address the issues that have prevented silver from being used as an interconnect metal. The authors provide details on a wide range of experimental, characterization, and analysis techniques. The book is written for students, scientists, engineers, and technologists in the fields of integrated circuits and microelectronics research and development.