Electromigration In Metals
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Electromigration In Metals
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Author : Paul S. Ho
language : en
Publisher: Cambridge University Press
Release Date : 2022-05-12
Electromigration In Metals written by Paul S. Ho and has been published by Cambridge University Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2022-05-12 with Science categories.
Learn to assess electromigration reliability and design resilient chips, building from fundamental physics to advanced methodologies.
Proceedings Of The Symposium On Electromigration Of Metals And First International Symposium On Multilevel Metallization And Packaging
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Author : James R. Lloyd
language : en
Publisher:
Release Date : 1985
Proceedings Of The Symposium On Electromigration Of Metals And First International Symposium On Multilevel Metallization And Packaging written by James R. Lloyd and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1985 with Electrodiffusion categories.
High Speed Vlsi Interconnections
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Author : Ashok K. Goel
language : en
Publisher: John Wiley & Sons
Release Date : 2007-10-19
High Speed Vlsi Interconnections written by Ashok K. Goel and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007-10-19 with Technology & Engineering categories.
This Second Edition focuses on emerging topics and advances in the field of VLSI interconnections In the decade since High-Speed VLSI Interconnections was first published, several major developments have taken place in the field. Now, updated to reflect these advancements, this Second Edition includes new information on copper interconnections, nanotechnology circuit interconnects, electromigration in the copper interconnections, parasitic inductances, and RLC models for comprehensive analysis of interconnection delays and crosstalk. Each chapter is designed to exist independently or as a part of one coherent unit, and several appropriate exercises are provided at the end of each chapter, challenging the reader to gain further insight into the contents being discussed. Chapter subjects include: * Preliminary Concepts * Parasitic Resistances, Capacitances, and Inductances * Interconnection Delays * Crosstalk Analysis * Electromigration-Induced Failure Analysis * Future Interconnections High-Speed VLSI Interconnections, Second Edition is an indispensable reference for high-speed VLSI designers, RF circuit designers, and advanced students of electrical engineering.
Diffusion In Solids
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Author : A.S. Nowick
language : en
Publisher: Elsevier
Release Date : 2012-12-02
Diffusion In Solids written by A.S. Nowick and has been published by Elsevier this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-02 with Science categories.
Diffusion in Solids: Recent Developments provides an overview of diffusion in crystalline solids. This book discusses the various aspects of the theory of diffusion. Organized into nine chapters, this volume starts with a discussion on the process of diffusion in solids. This book then examines the tools that supplement the conventional diffusion measurements, including electromigration, ionic conductivity, isotope effects, and vacancy wind effects. This text explores the molecular dynamic calculation by which the interatomic forces must be assumed. Other chapters discuss the method of measurement of the isotope effect on diffusion, which is the most powerful method of determining relevant information about the correlation factor. This volume extensively discusses diffusion in organic and amorphous materials, as well as interstitial diffusion in solids. The final chapter deals with ionic motion and diffusion in various groups of materials called fast ionic conductors. Solid-state physicists, materials scientists, physical chemists, and electrochemists will find this book extremely useful.
Electromigration Of Metals
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Author : Electrochemical Society. Dielectrics and Insulation, Electronics and High Temperature Materials Divisions
language : en
Publisher:
Release Date :
Electromigration Of Metals written by Electrochemical Society. Dielectrics and Insulation, Electronics and High Temperature Materials Divisions and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on with categories.
The Physical Properties Of Thin Metal Films
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Author : G.P. Zhigal'skii
language : en
Publisher: CRC Press
Release Date : 2003-07-10
The Physical Properties Of Thin Metal Films written by G.P. Zhigal'skii and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2003-07-10 with Technology & Engineering categories.
Thin films of conducting materials, such as metals, alloys and semiconductors are currently in use in many areas of science and technology, particularly in modern integrated circuit microelectronics that require high quality thin films for the manufacture of connection layers, resistors and ohmic contacts. These conducting films are also important for fundamental investigations in physics, radio-physics and physical chemistry. Physical Properties of Thin Metal Films provides a clear presentation of the complex physical properties particular to thin conducting films and includes the necessary theory, confirming experiments and applications. The volume will be an invaluable reference for graduates, engineers and scientists working in the electronics industry and fields of pure and applied science.
Electronic Thin Film Reliability
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Author : King-Ning Tu
language : en
Publisher: Cambridge University Press
Release Date : 2010-11-25
Electronic Thin Film Reliability written by King-Ning Tu and has been published by Cambridge University Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2010-11-25 with Technology & Engineering categories.
Thin films are widely used in the electronic device industry. As the trend for miniaturization of electronic devices moves into the nanoscale domain, the reliability of thin films becomes an increasing concern. Building on the author's previous book, Electronic Thin Film Science by Tu, Mayer and Feldman, and based on a graduate course at UCLA given by the author, this new book focuses on reliability science and the processing of thin films. Early chapters address fundamental topics in thin film processes and reliability, including deposition, surface energy and atomic diffusion, before moving onto systematically explain irreversible processes in interconnect and packaging technologies. Describing electromigration, thermomigration and stress migration, with a closing chapter dedicated to failure analysis, the reader will come away with a complete theoretical and practical understanding of electronic thin film reliability. Kept mathematically simple, with real-world examples, this book is ideal for graduate students, researchers and practitioners.
Handbook Of Solid State Diffusion Volume 2
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Author : Aloke Paul
language : en
Publisher: Elsevier
Release Date : 2017-04-13
Handbook Of Solid State Diffusion Volume 2 written by Aloke Paul and has been published by Elsevier this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-04-13 with Science categories.
Handbook of Solid State Diffusion, Volume 2: Diffusion Analysis in Material Applications covers the basic fundamentals, techniques, applications, and latest developments in the area of solid-state diffusion, offering a pedagogical understanding for students, academicians, and development engineers. Both experimental techniques and computational methods find equal importance in the second of this two volume set. Volume 2 covers practical issues on diffusion phenomena in bulk, thin film, and in nanomaterials. Diffusion related problems and analysis of methods in industrial applications, such as electronic industry, high temperature materials, nuclear materials, and superconductor materials are discussed. - Presents a handbook with a short mathematical background and detailed examples of concrete applications of the sophisticated methods of analysis - Enables readers to learn the basic concepts of experimental approaches and the computational methods involved in solid-state diffusion - Covers bulk, thin film, and nanomaterials - Introduces the problems and analysis in important materials systems in various applications - Collates contributions from academic and industrial problems from leading scientists involved in developing key concepts across the globe
Defects And Diffusion In Metals Ii
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Author : David Fisher
language : en
Publisher: Trans Tech Publications Ltd
Release Date : 2000-01-05
Defects And Diffusion In Metals Ii written by David Fisher and has been published by Trans Tech Publications Ltd this book supported file pdf, txt, epub, kindle and other format this book has been release on 2000-01-05 with Technology & Engineering categories.
Annual Retrospective II
Liquid Metals
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Author : Lei Fu
language : en
Publisher: John Wiley & Sons
Release Date : 2022-03-28
Liquid Metals written by Lei Fu and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2022-03-28 with Technology & Engineering categories.
An up-to-date exploration of the properties and most recent applications of liquid metals In Liquid Metal: Properties, Mechanisms, and Applications, a pair of distinguished researchers delivers a comprehensive exploration of liquid metals with a strong focus on their structure and physicochemical properties, preparation methods, and tuning strategies. The book also illustrates the applications of liquid metals in fields as varied as mediated synthesis, 3D printing, flexible electronics, biomedicine, energy storage, and energy conversion. The authors include coverage of reactive mediums for synthesizing and assembling nanomaterials and direct-writing electronics, and the book offers access to supplementary video materials to highlight the concepts discussed within. Recent advancements in the field of liquid metals are also discussed, as are new opportunities for research and development in this rapidly developing area. The book also includes: A thorough introduction to the fundamentals of liquid metal, including a history of its discovery, its structure and physical properties, and its preparation Comprehensive explorations of the external field tuning of liquid metal, including electrical, magnetic, and chemical tuning Practical discussions of liquid metal as a new reaction medium, including nanomaterial synthesis and alloy preparation In-depth examinations of constructing techniques of liquid metal-based architectures, including injection, imprinting, and mask-assisted depositing Perfect for materials scientists, electrochemists, and catalytic chemists, Liquid Metal: Properties, Mechanisms, and Applications also belongs in the libraries of inorganic chemists, electronics engineers, and biochemists.