High Speed Vlsi Interconnections
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High Speed Vlsi Interconnections
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Author : Ashok K. Goel
language : en
Publisher: John Wiley & Sons
Release Date : 2007-10-19
High Speed Vlsi Interconnections written by Ashok K. Goel and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007-10-19 with Technology & Engineering categories.
This Second Edition focuses on emerging topics and advances in the field of VLSI interconnections In the decade since High-Speed VLSI Interconnections was first published, several major developments have taken place in the field. Now, updated to reflect these advancements, this Second Edition includes new information on copper interconnections, nanotechnology circuit interconnects, electromigration in the copper interconnections, parasitic inductances, and RLC models for comprehensive analysis of interconnection delays and crosstalk. Each chapter is designed to exist independently or as a part of one coherent unit, and several appropriate exercises are provided at the end of each chapter, challenging the reader to gain further insight into the contents being discussed. Chapter subjects include: * Preliminary Concepts * Parasitic Resistances, Capacitances, and Inductances * Interconnection Delays * Crosstalk Analysis * Electromigration-Induced Failure Analysis * Future Interconnections High-Speed VLSI Interconnections, Second Edition is an indispensable reference for high-speed VLSI designers, RF circuit designers, and advanced students of electrical engineering.
Modeling And Simulation Of High Speed Vlsi Interconnects
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Author : Michel S. Nakhla
language : en
Publisher: Springer Science & Business Media
Release Date : 2011-06-28
Modeling And Simulation Of High Speed Vlsi Interconnects written by Michel S. Nakhla and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011-06-28 with Technology & Engineering categories.
Modeling and Simulation of High Speed VLSI Interconnects brings together in one place important contributions and state-of-the-art research results in this rapidly advancing area. Modeling and Simulation of High Speed VLSI Interconnects serves as an excellent reference, providing insight into some of the most important issues in the field.
The Vlsi Handbook
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Author : Wai-Kai Chen
language : en
Publisher: CRC Press
Release Date : 2018-10-03
The Vlsi Handbook written by Wai-Kai Chen and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-10-03 with Technology & Engineering categories.
For the new millenium, Wai-Kai Chen introduced a monumental reference for the design, analysis, and prediction of VLSI circuits: The VLSI Handbook. Still a valuable tool for dealing with the most dynamic field in engineering, this second edition includes 13 sections comprising nearly 100 chapters focused on the key concepts, models, and equations. Written by a stellar international panel of expert contributors, this handbook is a reliable, comprehensive resource for real answers to practical problems. It emphasizes fundamental theory underlying professional applications and also reflects key areas of industrial and research focus. WHAT'S IN THE SECOND EDITION? Sections on... Low-power electronics and design VLSI signal processing Chapters on... CMOS fabrication Content-addressable memory Compound semiconductor RF circuits High-speed circuit design principles SiGe HBT technology Bipolar junction transistor amplifiers Performance modeling and analysis using SystemC Design languages, expanded from two chapters to twelve Testing of digital systems Structured for convenient navigation and loaded with practical solutions, The VLSI Handbook, Second Edition remains the first choice for answers to the problems and challenges faced daily in engineering practice.
Carbon Nanotube Based Vlsi Interconnects
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Author : Brajesh Kumar Kaushik
language : en
Publisher: Springer
Release Date : 2014-11-01
Carbon Nanotube Based Vlsi Interconnects written by Brajesh Kumar Kaushik and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-11-01 with Technology & Engineering categories.
The brief primarily focuses on the performance analysis of CNT based interconnects in current research scenario. Different CNT structures are modeled on the basis of transmission line theory. Performance comparison for different CNT structures illustrates that CNTs are more promising than Cu or other materials used in global VLSI interconnects. The brief is organized into five chapters which mainly discuss: (1) an overview of current research scenario and basics of interconnects; (2) unique crystal structures and the basics of physical properties of CNTs, and the production, purification and applications of CNTs; (3) a brief technical review, the geometry and equivalent RLC parameters for different single and bundled CNT structures; (4) a comparative analysis of crosstalk and delay for different single and bundled CNT structures; and (5) various unique mixed CNT bundle structures and their equivalent electrical models.
On Chip Inductance In High Speed Integrated Circuits
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Author : Yehea I. Ismail
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-12-06
On Chip Inductance In High Speed Integrated Circuits written by Yehea I. Ismail and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-06 with Technology & Engineering categories.
The appropriate interconnect model has changed several times over the past two decades due to the application of aggressive technology scaling. New, more accurate interconnect models are required to manage the changing physical characteristics of integrated circuits. Currently, RC models are used to analyze high resistance nets while capacitive models are used for less resistive interconnect. However, on-chip inductance is becoming more important with integrated circuits operating at higher frequencies, since the inductive impedance is proportional to the frequency. The operating frequencies of integrated circuits have increased dramatically over the past decade and are expected to maintain the same rate of increase over the next decade, approaching 10 GHz by the year 2012. Also, wide wires are frequently encountered in important global nets, such as clock distribution networks and in upper metal layers, and performance requirements are pushing the introduction of new materials for low resistance interconnect, such as copper interconnect already used in many commercial CMOS technologies. On-Chip Inductance in High Speed Integrated Circuits deals with the design and analysis of integrated circuits with a specific focus on on-chip inductance effects. It has been described throughout this book that inductance can have a tangible effect on current high speed integrated circuits. For example, neglecting inductance and using an RC interconnect model in a production 0.25 mum CMOS technology can cause large errors (over 35%) in estimates of the propagation delay of on-chip interconnect. It has also been shown that including inductance in the repeater insertion design process as compared to using an RC model improves the overall repeater solution in terms of area, power, and delay with average savings of 40.8%, 15.6%, and 6.7%, respectively. On-Chip Inductance in High Speed Integrated Circuitsis full of design and analysis techniques for RLC interconnect. These techniques are compared to techniques traditionally used for RC interconnect design to emphasize the effect of inductance. emOn-Chip Inductance in High Speed Integrated Circuits will be of interest to researchers in the area of high frequency interconnect, noise, and high performance integrated circuit design.
Tutorials On Emerging Methodologies And Applications In Operations Research
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Author : Harvey J. Greenberg
language : en
Publisher: Springer Science & Business Media
Release Date : 2006-06-16
Tutorials On Emerging Methodologies And Applications In Operations Research written by Harvey J. Greenberg and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2006-06-16 with Business & Economics categories.
This volume reflects the theme of the INFORMS 2004 Meeting in Denver: Back to OR Roots. Emerging as a quantitative approach to problem-solving in World War II, our founders were physicists, mathematicians, and engineers who quickly found peace-time uses. It is fair to say that Operations Research (OR) was born in the same incubator as computer science, and it has spawned many new disciplines, such as systems engineering, health care management, and transportation science. Although people from many disciplines routinely use OR methods, many scientific researchers, engineers, and others do not understand basic OR tools and how they can help them. Disciplines ranging from finance to bioengineering are the beneficiaries of what we do — we take an interdisciplinary approach to problem-solving. Our strengths are modeling, analysis, and algorithm design. We provide a quanti- tive foundation for a broad spectrum of problems, from economics to medicine, from environmental control to sports, from e-commerce to computational - ometry. We are both producers and consumers because the mainstream of OR is in the interfaces. As part of this effort to recognize and extend OR roots in future probl- solving, we organized a set of tutorials designed for people who heard of the topic and want to decide whether to learn it. The 90 minutes was spent addre- ing the questions: What is this about, in a nutshell? Why is it important? Where can I learn more? In total, we had 14 tutorials, and eight of them are published here.
Introduction To Physical Integration And Tapeout In Vlsis
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Author : Patrick Lee
language : en
Publisher: Lulu.com
Release Date : 2010-04-27
Introduction To Physical Integration And Tapeout In Vlsis written by Patrick Lee and has been published by Lulu.com this book supported file pdf, txt, epub, kindle and other format this book has been release on 2010-04-27 with Technology & Engineering categories.
This book covers issues and solutions in the physical integration and tapeout management for VLSI design. Chapter 1 gives the overview. Chapter 2 shows detailed techniques for physical design. Chapter 3 provides CAD flows. Chapter 4 discusses on-chip interconnects. A glossary of keywords is provided at the end.
Interconnect Noise Optimization In Nanometer Technologies
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Author : Mohamed Elgamel
language : en
Publisher: Springer Science & Business Media
Release Date : 2006-03-20
Interconnect Noise Optimization In Nanometer Technologies written by Mohamed Elgamel and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2006-03-20 with Technology & Engineering categories.
Interconnect has become the dominating factor in determining system performance in nanometer technologies. Dedicated to this subject, Interconnect Noise Optimization in Nanometer Technologies provides insight and intuition into layout analysis and optimization for interconnect in high speed, high complexity integrated circuits. The authors bring together a wealth of information presenting a range of CAD algorithms and techniques for synthesizing and optimizing interconnect. Practical aspects of the algorithms and the models are explained with sufficient details. The book investigates the most effective parameters in layout optimization. Different post-layout optimization techniques with complexity analysis and benchmarks tests are provided. The impact crosstalk noise and coupling on the wire delay is analyzed. Parameters that affect signal integrity are also considered.
Microelectronics Packaging Handbook
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Author : R.R. Tummala
language : en
Publisher: Springer Science & Business Media
Release Date : 2013-11-27
Microelectronics Packaging Handbook written by R.R. Tummala and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-11-27 with Computers categories.
Electronics has become the largest industry, surpassing agriculture, auto, and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan, Korea, Singapore, Hong Kong, and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors, the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries, displays, magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies, from mainframe and supercomputer applications at any cost, to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example, going from $500IMIP when products were first introduced in 1981, to a projected $IIMIP within 10 years. Thin, light portable, user friendly and very low-cost are, therefore, the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection, powering, cool ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.
Power Integrity For I O Interfaces
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Author : Vishram S. Pandit
language : en
Publisher: Pearson Education
Release Date : 2010-10-13
Power Integrity For I O Interfaces written by Vishram S. Pandit and has been published by Pearson Education this book supported file pdf, txt, epub, kindle and other format this book has been release on 2010-10-13 with Technology & Engineering categories.
Foreword by Joungho Kim The Hands-On Guide to Power Integrity in Advanced Applications, from Three Industry Experts In this book, three industry experts introduce state-of-the-art power integrity design techniques for today’s most advanced digital systems, with real-life, system-level examples. They introduce a powerful approach to unifying power and signal integrity design that can identify signal impediments earlier, reducing cost and improving reliability. After introducing high-speed, single-ended and differential I/O interfaces, the authors describe on-chip, package, and PCB power distribution networks (PDNs) and signal networks, carefully reviewing their interactions. Next, they walk through end-to-end PDN and signal network design in frequency domain, addressing crucial parameters such as self and transfer impedance. They thoroughly address modeling and characterization of on-chip components of PDNs and signal networks, evaluation of power-to-signal coupling coefficients, analysis of Simultaneous Switching Output (SSO) noise, and many other topics. Coverage includes The exponentially growing challenge of I/O power integrity in high-speed digital systems PDN noise analysis and its timing impact for single-ended and differential interfaces Concurrent design and co-simulation techniques for evaluating all power integrity effects on signal integrity Time domain gauges for designing and optimizing components and systems Power/signal integrity interaction mechanisms, including power noise coupling onto signal trace and noise amplification through signal resonance Performance impact due to Inter Symbol Interference (ISI), crosstalk, and SSO noise, as well as their interactions Validation techniques, including low impedance VNA measurements, power noise measurements, and characterization of power-to-signal coupling effects Power Integrity for I/O Interfaces will be an indispensable resource for everyone concerned with power integrity in cutting-edge digital designs, including system design and hardware engineers, signal and power integrity engineers, graduate students, and researchers.