2007 12th International Symposium On Advanced Packaging Materials
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2007 12th International Symposium On Advanced Packaging Materials
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Author :
language : en
Publisher: IEEE Computer Society Press
Release Date : 2007-01-01
2007 12th International Symposium On Advanced Packaging Materials written by and has been published by IEEE Computer Society Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007-01-01 with Technology & Engineering categories.
2007 12th International Symposium On Advanced Packaging Materials Processes Properties And Interfaces
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Author : Components, Packaging, and Manufacturing Technology Society
language : en
Publisher:
Release Date : 2007
2007 12th International Symposium On Advanced Packaging Materials Processes Properties And Interfaces written by Components, Packaging, and Manufacturing Technology Society and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007 with Electronic packaging categories.
Handbook Of Wafer Bonding
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Author : Peter Ramm
language : en
Publisher: John Wiley & Sons
Release Date : 2011-11-17
Handbook Of Wafer Bonding written by Peter Ramm and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011-11-17 with Technology & Engineering categories.
The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding and micro-electro-mechanical systems (MEMS) with new functional layers. Written by authors and edited by a team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies. Part I sorts the wafer bonding technologies into four categories: Adhesive and Anodic Bonding; Direct Wafer Bonding; Metal Bonding; and Hybrid Metal/Dielectric Bonding. Part II summarizes the key wafer bonding applications developed recently, that is, 3D integration, MEMS, and temporary bonding, to give readers a taste of the significant applications of wafer bonding technologies. This book is aimed at materials scientists, semiconductor physicists, the semiconductor industry, IT engineers, electrical engineers, and libraries.
International Symposium On Advanced Packaging Materials
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Author :
language : en
Publisher:
Release Date : 2005
International Symposium On Advanced Packaging Materials written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2005 with Electronic packaging categories.
2011 International Symposium On Advanced Packaging Materials
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Author : Components, Packaging & Manufacturing Technology Society
language : en
Publisher:
Release Date : 2011-11
2011 International Symposium On Advanced Packaging Materials written by Components, Packaging & Manufacturing Technology Society and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011-11 with categories.
Emerging Nanotechnology Applications In Electrical Engineering
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Author : Mohamed, Ahmed Thabet
language : en
Publisher: IGI Global
Release Date : 2021-06-25
Emerging Nanotechnology Applications In Electrical Engineering written by Mohamed, Ahmed Thabet and has been published by IGI Global this book supported file pdf, txt, epub, kindle and other format this book has been release on 2021-06-25 with Technology & Engineering categories.
The energy sector continues to receive increased attention from both consumers and producers due to its impact on all aspects of life. Electrical energy especially has become more in demand because of the delivery of the service to a large percentage of consumers in addition to the progress and increase of industrial production. It is thus necessary to find advanced systems capable of transferring huge amounts of electrical energy efficiently and safely. Nanotechnology aims to develop new types of atomic electronics that adopt quantum mechanics and the movement of individual particles to produce equipment faster and smaller and solve problems attributed to the electrical engineering field. Emerging Nanotechnology Applications in Electrical Engineering contains innovative research on the methods and applications of nanoparticles in electrical engineering. This book discusses the wide array of uses nanoparticles have within electrical engineering and the diverse electric and magnetic properties that nanomaterials help make prevalent. While highlighting topics including electrical applications, magnetic applications, and electronic applications, this book is ideally designed for researchers, engineers, industry professionals, practitioners, scientists, managers, manufacturers, analysts, students, and educators seeking current research on nanotechnology in electrical, electronic, and industrial applications.
Harsh Environment Electronics
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Author : Ahmed Sharif
language : en
Publisher: John Wiley & Sons
Release Date : 2019-08-05
Harsh Environment Electronics written by Ahmed Sharif and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-08-05 with Technology & Engineering categories.
Provides in-depth knowledge on novel materials that make electronics work under high-temperature and high-pressure conditions This book reviews the state of the art in research and development of lead-free interconnect materials for electronic packaging technology. It identifies the technical barriers to the development and manufacture of high-temperature interconnect materials to investigate into the complexities introduced by harsh conditions. It teaches the techniques adopted and the possible alternatives of interconnect materials to cope with the impacts of extreme temperatures for implementing at industrial scale. The book also examines the application of nanomaterials, current trends within the topic area, and the potential environmental impacts of material usage. Written by world-renowned experts from academia and industry, Harsh Environment Electronics: Interconnect Materials and Performance Assessment covers interconnect materials based on silver, gold, and zinc alloys as well as advanced approaches utilizing polymers and nanomaterials in the first section. The second part is devoted to the performance assessment of the different interconnect materials and their respective environmental impact. -Takes a scientific approach to analyzing and addressing the issues related to interconnect materials involved in high temperature electronics -Reviews all relevant materials used in interconnect technology as well as alternative approaches otherwise neglected in other literature -Highlights emergent research and theoretical concepts in the implementation of different materials in soldering and die-attach applications -Covers wide-bandgap semiconductor device technologies for high temperature and harsh environment applications, transient liquid phase bonding, glass frit based die attach solution for harsh environment, and more -A pivotal reference for professionals, engineers, students, and researchers Harsh Environment Electronics: Interconnect Materials and Performance Assessment is aimed at materials scientists, electrical engineers, and semiconductor physicists, and treats this specialized topic with breadth and depth.
2005 10th International Symposium On Advanced Packaging Materials
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Author :
language : en
Publisher: Institute of Electrical & Electronics Engineers(IEEE)
Release Date : 2005-01-01
2005 10th International Symposium On Advanced Packaging Materials written by and has been published by Institute of Electrical & Electronics Engineers(IEEE) this book supported file pdf, txt, epub, kindle and other format this book has been release on 2005-01-01 with Electronic packaging categories.
Introduction To Microsystem Packaging Technology
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Author : Yufeng Jin
language : en
Publisher: CRC Press
Release Date : 2017-12-19
Introduction To Microsystem Packaging Technology written by Yufeng Jin and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-12-19 with Technology & Engineering categories.
The multi-billion-dollar microsystem packaging business continues to play an increasingly important technical role in today’s information industry. The packaging process—including design and manufacturing technologies—is the technical foundation upon which function chips are updated for use in application systems, and it is an important guarantee of the continued growth of technical content and value of information systems. Introduction to Microsystem Packaging Technology details the latest advances in this vital area, which involves microelectronics, optoelectronics, RF and wireless, MEMS, and related packaging and assembling technologies. It is purposefully written so that each chapter is relatively independent and the book systematically presents the widest possible overview of packaging knowledge. Elucidates the evolving world of packaging technologies for manufacturing The authors begin by introducing the fundamentals, history, and technical challenges of microsystems. Addressing an array of design techniques for packaging and integration, they cover substrate and interconnection technologies, examples of device- and system-level packaging, and various MEMS packaging techniques. The book also discusses module assembly and optoelectronic packaging, reliability methodologies and analysis, and prospects for the evolution and future applications of microsystems packaging and associated environmental protection. With its research examples and targeted reference questions and answers to reinforce understanding, this text is ideal for researchers, engineers, and students involved in microelectronics and MEMS. It is also useful to those who are not directly engaged in packaging but require a solid understanding of the field and its associated technologies.
Electrical Connectors
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Author : San Kyeong
language : en
Publisher: John Wiley & Sons
Release Date : 2020-12-29
Electrical Connectors written by San Kyeong and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2020-12-29 with Technology & Engineering categories.
Discover the foundations and nuances of electrical connectors in this comprehensive and insightful resource Electrical Connectors: Design, Manufacture, Test, and Selection delivers a comprehensive discussion of electrical connectors, from the components and materials that comprise them to their classifications and underwater, power, and high-speed signal applications. Accomplished engineer and author Michael G. Pecht offers readers a thorough explanation of the key performance and reliability concerns and trade-offs involved in electrical connector selection. Readers, both at introductory and advanced levels, will discover the latest industry standards for performance, reliability, and safety assurance. The book discusses everything a student or practicing engineer might require to design, manufacture, or select a connector for any targeted application. The science of contact physics, contact finishes, housing materials, and the full connector assembly process are all discussed at length, as are test methods, performance, and guidelines for various applications. Electrical Connectors covers a wide variety of other relevant and current topics, like: A comprehensive description of all electrical connectors, including their materials, components, applications, and classifications A discussion of the design and manufacture of all parts of a connector Application-specific criteria for contact resistance, signal quality, and temperature rise An examination of key suppliers, materials used, and the different types of data provided A presentation of guidelines for end-users involved in connector selection and design Perfect for connector manufacturers who select, design, and assemble connectors for their products or the end users who concern themselves with operational reliability of the system in which they’re installed, Electrical Connectors also belongs on the bookshelves of students learning the basics of electrical contacts and those who seek a general reference with best-practice advice on how to choose and test connectors for targeted applications.