2010 Asia Pacific Symposium On Electromagnetic Compatibility
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2010 Asia Pacific Symposium On Electromagnetic Compatibility
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Author : IEEE Staff
language : en
Publisher:
Release Date : 2010
2010 Asia Pacific Symposium On Electromagnetic Compatibility written by IEEE Staff and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2010 with Bioengineering categories.
2012 Asia Pacific Symposium On Electromagnetic Compatibility
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Author : IEEE Staff
language : en
Publisher:
Release Date : 2012-05-21
2012 Asia Pacific Symposium On Electromagnetic Compatibility written by IEEE Staff and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-05-21 with categories.
2017 Asia Pacific International Symposium On Electromagnetic Compatibility Apemc 2017
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Author :
language : en
Publisher:
Release Date : 2017
2017 Asia Pacific International Symposium On Electromagnetic Compatibility Apemc 2017 written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017 with Electromagnetic compatibility categories.
2010 Ieee International Symposium On Electromagnetic Compatibility
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Author : IEEE Staff
language : en
Publisher:
Release Date : 2010
2010 Ieee International Symposium On Electromagnetic Compatibility written by IEEE Staff and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2010 with categories.
Modeling And Design Of Electromagnetic Compatibility For High Speed Printed Circuit Boards And Packaging
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Author : Xing-Chang Wei
language : en
Publisher: CRC Press
Release Date : 2017-09-19
Modeling And Design Of Electromagnetic Compatibility For High Speed Printed Circuit Boards And Packaging written by Xing-Chang Wei and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-09-19 with Computers categories.
Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging presents the electromagnetic modelling and design of three major electromagnetic compatibility (EMC) issues related to the high-speed printed circuit board (PCB) and electronic packages: signal integrity (SI), power integrity (PI), and electromagnetic interference (EMI). The emphasis is put on two essential passive components of PCBs and packages: the power distribution network and the signal distribution network. This book includes two parts. Part one talks about the field-circuit hybrid methods used for the EMC modeling, including the modal method, the integral equation method, the cylindrical wave expansion method and the de-embedding method. Part two illustrates EMC design methods and explores the applications of novel metamaterials and two-dimensional materials on traditional EMC problems. This book is designed to enhance worthwhile electromagnetic theory and mathematical methods for practical engineers and to train students with advanced EMC applications.
Electromagnetic Compatibility For Space Systems Design
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Author : Nikolopoulos, Christos D.
language : en
Publisher: IGI Global
Release Date : 2018-03-02
Electromagnetic Compatibility For Space Systems Design written by Nikolopoulos, Christos D. and has been published by IGI Global this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-03-02 with Science categories.
In the aerospace industry, avoiding operating issues, especially in regard to space missions and satellite structures, is crucial. The vast majority of these issues can be traced to disturbances in the electromagnetic fields used. Electromagnetic Compatibility for Space Systems Design is a critical scholarly resource that examines the applications of electromagnetic compatibility and electromagnetic interference in the space industry. Featuring coverage on a wide range of topics, such as magnetometers, electromagnetic environmental effects, and electromagnetic shielding, this book is geared toward managers, engineers, and researchers seeking current research on the applications of electromagnetic technologies in the aerospace field.
Selected Papers From 2018 Ieee International Conference On High Voltage Engineering Ichve 2018
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Author : Issouf Fofana
language : en
Publisher: MDPI
Release Date : 2021-03-04
Selected Papers From 2018 Ieee International Conference On High Voltage Engineering Ichve 2018 written by Issouf Fofana and has been published by MDPI this book supported file pdf, txt, epub, kindle and other format this book has been release on 2021-03-04 with Technology & Engineering categories.
The 2018 IEEE International Conference on High Voltage Engineering (ICHVE 2018) was held on 10–13 September 2018 in Athens, Greece, organized by the National Technical University of Athens, Greece, and endorsed by the IEEE Dielectrics and Electrical Insulation Society. This conference has attracted a great deal of attention from international researchers in the field of high voltage engineering. This conference provided not only an excellent platform to share knowledge and experiences on high voltage engineering, but also the opportunity to present the latest achievements and different emerging challenges in power engineering, including topics related to ultra-high voltage, smart grids, and new insulation materials and their dielectric properties.
2013 Asia Pacific Symposium On Electromagnetic Compatibility Apemc
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Author : IEEE Staff
language : en
Publisher:
Release Date : 2013-05-20
2013 Asia Pacific Symposium On Electromagnetic Compatibility Apemc written by IEEE Staff and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-05-20 with categories.
The symposium will cover the entire scope of electromagnetic compatibility including emerging technologies Topics are management and standards, measurements, EMC environment, high power electromagnetics, EMC in space and transport, IC and semiconductor EMC, signal and power integrity, computational electromagnetics, bio medical EMC, nanotechnology and EMC and electromagnetic radiation hazards
System Level Esd Co Design
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Author : Charvaka Duvvury
language : en
Publisher: John Wiley & Sons
Release Date : 2017-05-05
System Level Esd Co Design written by Charvaka Duvvury and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-05-05 with Technology & Engineering categories.
An effective and cost efficient protection of electronic system against ESD stress pulses specified by IEC 61000-4-2 is paramount for any system design. This pioneering book presents the collective knowledge of system designers and system testing experts and state-of-the-art techniques for achieving efficient system-level ESD protection, with minimum impact on the system performance. All categories of system failures ranging from 'hard' to 'soft' types are considered to review simulation and tool applications that can be used. The principal focus of System Level ESD Co-Design is defining and establishing the importance of co-design efforts from both IC supplier and system builder perspectives. ESD designers often face challenges in meeting customers' system-level ESD requirements and, therefore, a clear understanding of the techniques presented here will facilitate effective simulation approaches leading to better solutions without compromising system performance. With contributions from Robert Ashton, Jeffrey Dunnihoo, Micheal Hopkins, Pratik Maheshwari, David Pomerenke, Wolfgang Reinprecht, and Matti Usumaki, readers benefit from hands-on experience and in-depth knowledge in topics ranging from ESD design and the physics of system ESD phenomena to tools and techniques to address soft failures and strategies to design ESD-robust systems that include mobile and automotive applications. The first dedicated resource to system-level ESD co-design, this is an essential reference for industry ESD designers, system builders, IC suppliers and customers and also Original Equipment Manufacturers (OEMs). Key features: Clarifies the concept of system level ESD protection. Introduces a co-design approach for ESD robust systems. Details soft and hard ESD fail mechanisms. Detailed protection strategies for both mobile and automotive applications. Explains simulation tools and methodology for system level ESD co-design and overviews available test methods and standards. Highlights economic benefits of system ESD co-design.
Proceedings Of The 2019 Joint International Symposium On Electromagnetic Compatibility Sapporo And Asia Pacific International Symposium On Electromagnetic Compatibility Emc Sapporo Apemc
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Author :
language : en
Publisher:
Release Date : 2019
Proceedings Of The 2019 Joint International Symposium On Electromagnetic Compatibility Sapporo And Asia Pacific International Symposium On Electromagnetic Compatibility Emc Sapporo Apemc written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019 with categories.