A Chip Off The Silicon Block


A Chip Off The Silicon Block
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A Chip Off The Silicon Block


A Chip Off The Silicon Block
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Author : Carol Latham
language : en
Publisher: Page Publishing Inc
Release Date : 2020-04-02

A Chip Off The Silicon Block written by Carol Latham and has been published by Page Publishing Inc this book supported file pdf, txt, epub, kindle and other format this book has been release on 2020-04-02 with Business & Economics categories.


Ever wonder why the success rate of start-up companies is so low? In this inspirational and informative book, Latham demonstrates how the power of sound entrepreneurial thinking can lead to positive results in the most daunting of circumstances. Latham's company, Thermagon Inc., evolved as an offshoot of the explosive growth of silicon chips driving the computer industry and the information age. As computers transitioned from large mainframes, filling whole airconditioned rooms to personal computers, such as desktops, notebooks, tablets, and smartphones, their functionality and speed were dramatically increasing. This phenomenon of miniaturization, combined with increased function and speed, caused overheating of the silicon chips, leading to widespread system failure. Hence, the evolution of the industry designed to manage the heat in electronic systems, of which Thermagon, became a worldwide leader. As a female, Latham defied all odds by successfully creating the products, the facilities, and the funding for a thriving and much sought-after company in the world of technology overwhelmingly dominated by men. Latham, by sharing her experiences in developing Thermagon and in assisting other start-up endeavors, intends to inspire budding entrepreneurs, working against all odds, by providing guidelines and principles for attaining success. The multitude of personal stories embracing her journey are sure to keep you entertained.



The Chip


The Chip
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Author : T.R. Reid
language : en
Publisher: Random House
Release Date : 2007-12-18

The Chip written by T.R. Reid and has been published by Random House this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007-12-18 with Biography & Autobiography categories.


Barely fifty years ago a computer was a gargantuan, vastly expensive thing that only a handful of scientists had ever seen. The world’s brightest engineers were stymied in their quest to make these machines small and affordable until the solution finally came from two ingenious young Americans. Jack Kilby and Robert Noyce hit upon the stunning discovery that would make possible the silicon microchip, a work that would ultimately earn Kilby the Nobel Prize for physics in 2000. In this completely revised and updated edition of The Chip, T.R. Reid tells the gripping adventure story of their invention and of its growth into a global information industry. This is the story of how the digital age began.



The Silicon Web


The Silicon Web
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Author : Michael G. Raymer
language : en
Publisher: CRC Press
Release Date : 2009-06-23

The Silicon Web written by Michael G. Raymer and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2009-06-23 with Mathematics categories.


The technology behind computers, fiber optics, and networks did not originate in the minds of engineers attempting to build an Internet. The Internet is a culmination of intellectual work by thousands of minds spanning hundreds of years. We have built concept upon concept and technology upon technology to arrive at where we are today, in a world co



The Physics And Fabrication Of Microstructures And Microdevices


The Physics And Fabrication Of Microstructures And Microdevices
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Author : Michael J. Kelly
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-12-06

The Physics And Fabrication Of Microstructures And Microdevices written by Michael J. Kelly and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-06 with Technology & Engineering categories.


les Houches This Winter School on "The Physics and Fabrication of Microstructures" originated with a European industrial decision to investigate in some detail the potential of custom-designed microstructures for new devices. Beginning in 1985, GEC and THOMSON started a collaboration on these subjects, supported by an ESPRIT grant from the Commission of the European Com munity. To the outside observer of the whole field, it appears clear that the world effort is very largely based in the United States and Japan. It also appears that cooperation and dissemination of results are very well organised outside Europe and act as a major influence on the development of new concepts and devices. In Japan, a main research programme of the Research and Development for Basic Technology for Future Industries is focused on "Future Electron Devices". In Japan and in the United States, many workshops are organised annually in order to bring together the major specialists in industry and academia, allowing fast dissemination of advances and contacts for setting up cooperative efforts.



Direct Copper Interconnection For Advanced Semiconductor Technology


Direct Copper Interconnection For Advanced Semiconductor Technology
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Author : Dongkai Shangguan
language : en
Publisher: CRC Press
Release Date : 2024-06-28

Direct Copper Interconnection For Advanced Semiconductor Technology written by Dongkai Shangguan and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2024-06-28 with Technology & Engineering categories.


In the “More than Moore” era, performance requirements for leading edge semiconductor devices are demanding extremely fine pitch interconnection in semiconductor packaging. Direct copper interconnection has emerged as the technology of choice in the semiconductor industry for fine pitch interconnection, with significant benefits for interconnect density and device performance. Low-temperature direct copper bonding, in particular, will become widely adopted for a broad range of highperformance semiconductor devices in the years to come. This book offers a comprehensive review and in-depth discussions of the key topics in this critical new technology. Chapter 1 reviews the evolution and the most recent advances in semiconductor packaging, leading to the requirement for extremely fine pitch interconnection, and Chapter 2 reviews different technologies for direct copper interconnection, with advantages and disadvantages for various applications. Chapter 3 offers an in-depth review of the hybrid bonding technology, outlining the critical processes and solutions. The area of materials for hybrid bonding is covered in Chapter 4, followed by several chapters that are focused on critical process steps and equipment for copper electrodeposition (Chapter 5), planarization (Chapter 6), wafer bonding (Chapter 7), and die bonding (Chapter 8). Aspects related to product applications are covered in Chapter 9 for design and Chapter 10 for thermal simulation. Finally, Chapter 11 covers reliability considerations and computer modeling for process and performance characterization, followed by the final chapter (Chapter 12) outlining the current and future applications of the hybrid bonding technology. Metrology and testing are also addressed throughout the chapters. Business, economic, and supply chain considerations are discussed as related to the product applications and manufacturing deployment of the technology, and the current status and future outlook as related to the various aspects of the ecosystem are outlined in the relevant chapters of the book. The book is aimed at academic and industry researchers as well as industry practitioners, and is intended to serve as a comprehensive source of the most up-to-date knowledge, and a review of the state-of-the art of the technology and applications, for direct copper interconnection and advanced semiconductor packaging in general.



Real Time Systems


Real Time Systems
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Author : Hermann Kopetz
language : en
Publisher: Springer Nature
Release Date : 2022-09-22

Real Time Systems written by Hermann Kopetz and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2022-09-22 with Technology & Engineering categories.


"This book is a comprehensive text for the design of safety critical, hard real-time embedded systems. It offers a splendid example for the balanced, integrated treatment of systems and software engineering, helping readers tackle the hardest problems of advanced real-time system design, such as determinism, compositionality, timing and fault management. This book is an essential reading for advanced undergraduates and graduate students in a wide range of disciplines impacted by embedded computing and software. Its conceptual clarity, the style of explanations and the examples make the abstract concepts accessible for a wide audience." Janos Sztipanovits, Director E. Bronson Ingram Distinguished Professor of Engineering Institute for Software Integrated Systems Vanderbilt University Real-Time Systems focuses on hard real-time systems, which are computing systems that must meet their temporal specification in all anticipated load and fault scenarios. The book stresses the system aspects of distributed real-time applications, treating the issues of real-time, distribution and fault-tolerance from an integral point of view. A unique cross-fertilization of ideas and concepts between the academic and industrial worlds has led to the inclusion of many insightful examples from industry to explain the fundamental scientific concepts in a real-world setting. Compared to the Second Edition, new developments in communication standards for time-sensitive networks, such as TSN and Time-Triggered Ethernet are addressed. Furthermore, this edition includes a new chapter on real-time aspects in cloud and fog computing. The book is written as a standard textbook for a high-level undergraduate or graduate course on real-time embedded systems or cyber-physical systems. Its practical approach to solving real-time problems, along with numerous summary exercises, makes it an excellent choice for researchers and practitioners alike.



Orange Coast Magazine


Orange Coast Magazine
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Author :
language : en
Publisher:
Release Date : 1988-12

Orange Coast Magazine written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1988-12 with categories.


Orange Coast Magazine is the oldest continuously published lifestyle magazine in the region, bringing together Orange County¹s most affluent coastal communities through smart, fun, and timely editorial content, as well as compelling photographs and design. Each issue features an award-winning blend of celebrity and newsmaker profiles, service journalism, and authoritative articles on dining, fashion, home design, and travel. As Orange County¹s only paid subscription lifestyle magazine with circulation figures guaranteed by the Audit Bureau of Circulation, Orange Coast is the definitive guidebook into the county¹s luxe lifestyle.



Integrated Circuit Design And Technology


Integrated Circuit Design And Technology
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Author : M. J. Morant
language : en
Publisher: Springer
Release Date : 2013-12-01

Integrated Circuit Design And Technology written by M. J. Morant and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-12-01 with Technology & Engineering categories.




The Invention Of The Silicon Chip


The Invention Of The Silicon Chip
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Author : Windsor Chorlton
language : en
Publisher: Heinemann Educational Books
Release Date : 2002

The Invention Of The Silicon Chip written by Windsor Chorlton and has been published by Heinemann Educational Books this book supported file pdf, txt, epub, kindle and other format this book has been release on 2002 with Juvenile Nonfiction categories.


Examines the events surrounding the development of the silicon chip, its uses, and its impact on civilization.



Molecular Electronics Bio Sensors And Bio Computers


Molecular Electronics Bio Sensors And Bio Computers
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Author : L. Barsanti
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-12-06

Molecular Electronics Bio Sensors And Bio Computers written by L. Barsanti and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-06 with Science categories.


How fast and powerful can computers become? Will it be possible someday to create artificial brains that have intellectual capabilities comparable to those of human beings? The answers to these questions depend to a very great extent on a single factor: how small and dense we can make computer circuits. Very recently, scientists have achieved revolutionary advances that may very well radically change the future of computing. There are significant advantages to using biological molecules in a new computational paradigm, since nature has solved similar problems to those encountered in harnessing organic molecules to perform data manipulation. Biomolecules could be used as photonic devices in holography, as spatial light modulators, in neural network optical computing, as nonlinear optical devices, and as optical memories. Such computers may use a billion times less energy than electronic computers, while storing data in a trillionth of the space, while also being highly parallel. Research projects implemented by national and international groups have produced a large amount of data from multidisciplinary work, ranging from physics and engineering to chemistry and biology.