A Fresh Concept Of Software Resemblant Hardware To Leap To 6g And Future Networks
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A Fresh Concept Of Software Resemblant Hardware To Leap To 6g And Future Networks
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Author : Jacopo Iannacci
language : en
Publisher: CRC Press
Release Date : 2024-04-01
A Fresh Concept Of Software Resemblant Hardware To Leap To 6g And Future Networks written by Jacopo Iannacci and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2024-04-01 with Computers categories.
For a decade, with the uptake of 4G, we have become accustomed to the relentless increase in data and services on the move. The deployment of 5G is advancing crucial key performance indicators (KPIs), along with quality of service (QoS). Setting the horizon to 2030 and later, 6G will take the KPIs to numbers 100–1000 times better than 5G. Yet, the actual disruption of 6G and future networks (FN) will take place following other unprecedented paths. Artificial intelligence (AI) will be exploited in a threadlike fashion, at any level of the network physical infrastructure. This will introduce, to date unknown features, like self-sustaining, self-evolution and high-resilience of small portions of the infrastructure, pioneering the concept of a network of networks. Each segment of the infrastructure will bear a high degree of independence, while working at the same time as a whole, in full orchestration with the rest of the network. Given such a scenario, this book claims that the established and currently in use paradigms for the design and development of hardware–software (HW–SW) systems, are not appropriate to address the challenges of 6G and, further ahead, of FN. In response, unprecedented design approaches are suggested, relying on a fresh reinterpretation of the standard concept of HW, with specific attention to the network edge and edge intelligence (EI). This work develops some conceptual tools that may help address the technical challenges resulting from the intricate scenario sketched above. Within the mentioned HW reconceptualization, a pivotal role is forecasted for microtechnologies and nanotechnologies, intended with a broad meaning, which embraces, among others, devices, systems (MEMS/NEMS) and materials.
Flip Chip Technologies
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Author : John H. Lau
language : en
Publisher: McGraw-Hill Professional Publishing
Release Date : 1996
Flip Chip Technologies written by John H. Lau and has been published by McGraw-Hill Professional Publishing this book supported file pdf, txt, epub, kindle and other format this book has been release on 1996 with Technology & Engineering categories.
A guide to flip chip technologies, for professionals in flip chip and MCM research and development, and for engineers and technical managers choosing design and manufacturing processes for electronic packaging and interconnect systems. Discusses economic, design, material, quality, and reliability issues of flip chip technologies, and details aspects of classical solder-bumped flip chip interconnect technologies; the next generations of flip chip technologies; and known-good-die testing for multiple module applications. Annotation copyright by Book News, Inc., Portland, OR
Finfets And Other Multi Gate Transistors
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Author : J.-P. Colinge
language : en
Publisher: Springer Science & Business Media
Release Date : 2008
Finfets And Other Multi Gate Transistors written by J.-P. Colinge and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2008 with Technology & Engineering categories.
This book explains the physics and properties of multi-gate field-effect transistors (MuGFETs), how they are made and how circuit designers can use them to improve the performances of integrated circuits. It covers the emergence of quantum effects due to the reduced size of the devices and describes the evolution of the MOS transistor from classical structures to SOI (silicon-on-insulator) and then to MuGFETs.
Micro And Nanoelectronics Devices Circuits And Systems
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Author : Trupti Ranjan Lenka
language : en
Publisher: Springer Nature
Release Date : 2021-09-09
Micro And Nanoelectronics Devices Circuits And Systems written by Trupti Ranjan Lenka and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2021-09-09 with Technology & Engineering categories.
The book presents select proceedings of the International Conference on Micro and Nanoelectronics Devices, Circuits and Systems (MNDCS-2021). The volume includes cutting-edge research papers in the emerging fields of micro and nanoelectronics devices, circuits, and systems from experts working in these fields over the last decade. The book is a unique collection of chapters from different areas with a common theme and will be immensely useful to academic researchers and practitioners in the industry who work in this field.
The Tactile Internet
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Author : Tara Ali-Yahiya
language : en
Publisher: John Wiley & Sons
Release Date : 2021-12-01
The Tactile Internet written by Tara Ali-Yahiya and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2021-12-01 with Computers categories.
The Tactile Internet will change the landscape of communication by introducing a new paradigm that enables the remote delivery of haptic data. This book answers the many questions surrounding the Tactile Internet, including its reference architecture and adapted compression methods for conveying haptic information. It also describes the key enablers for deploying the applications of the Tactile Internet. As an antecedent technology, the IoT is tackled, explaining the differences and similarities between the Tactile Internet, the Internet of Things and the Internet of Everything. The essentials of teleoperation systems are summarized and the challenges that face this paradigm in its implementation and deployment are also discussed. Finally, a teleoperation case study demonstrating an application of the Tactile Internet is investigated to demonstrate its functionalities, architecture and performance.
Advanced Project Management
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Author : Harold Kerzner
language : en
Publisher: John Wiley & Sons
Release Date : 2003-12-01
Advanced Project Management written by Harold Kerzner and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2003-12-01 with Technology & Engineering categories.
ADVANCED PROJECT MANAGEMENT AUTHORITATIVE STRATEGIES FOR IMPLEMENTING PROJECT MANAGEMENT Senior managers at world-class corporations open their office doors to discuss case studies that demonstrate their thought processes and actual strategies that helped them lead their companies to excellence in project management in less than six years! Following the Project Management Institute’s Body of Knowledge (PMBOK®), industry leaders address: Project risk management Project portfolio management The Project Office Project management multinational cultures Integrated project teams and virtual project teams
Inkjet Based Micromanufacturing
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Author : Oliver Brand
language : en
Publisher: John Wiley & Sons
Release Date : 2012-04-16
Inkjet Based Micromanufacturing written by Oliver Brand and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-04-16 with Technology & Engineering categories.
Inkjet-based Micromanufacturing Inkjet technology goes way beyond putting ink on paper: it enables simpler, faster and more reliable manufacturing processes in the fields of micro- and nanotechnology. Modern inkjet heads are per se precision instruments that deposit droplets of fluids on a variety of surfaces in programmable, repeating patterns, allowing, after suitable modifications and adaptations, the manufacturing of devices such as thin-film transistors, polymer-based displays and photovoltaic elements. Moreover, inkjet technology facilitates the large-scale production of flexible RFID transponders needed, eg, for automated logistics and miniaturized sensors for applications in health surveillance. The book gives an introduction to inkjet-based micromanufacturing, followed by an overview of the underlying theories and models, which provides the basis for a full understanding and a successful usage of inkjet-based methods in current microsystems research and development Overview of Inkjet-based Micromanufacturing: Thermal Inkjet Theory and Modeling Post-Printing Processes for Inorganic Inks for Plastic Electronics Applications Inkjet Ink Formulations Inkjet Fabrication of Printed Circuit Boards Antennas for Radio Frequency Identification Tags Inkjet Printing for MEMS
Advanced Rf Mems
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Author : Stepan Lucyszyn
language : en
Publisher: Cambridge University Press
Release Date : 2010-08-19
Advanced Rf Mems written by Stepan Lucyszyn and has been published by Cambridge University Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2010-08-19 with Technology & Engineering categories.
An up-to-date guide to the theory and applications of RF MEMS. With detailed information about RF MEMS technology as well as its reliability and applications, this is a comprehensive resource for professionals, researchers, and students alike. • Reviews RF MEMS technologies • Illustrates new techniques that solve long-standing problems associated with reliability and packaging • Provides the information needed to incorporate RF MEMS into commercial products • Describes current and future trends in RF MEMS, providing perspective on industry growth • Ideal for those studying or working in RF and microwave circuits, systems, microfabrication and manufacturing, production management and metrology, and performance evaluation
Handbook Of Wafer Bonding
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Author : Peter Ramm
language : en
Publisher: John Wiley & Sons
Release Date : 2012-02-13
Handbook Of Wafer Bonding written by Peter Ramm and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-02-13 with Technology & Engineering categories.
The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding and micro-electro-mechanical systems (MEMS) with new functional layers. Written by authors and edited by a team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies. Part I sorts the wafer bonding technologies into four categories: Adhesive and Anodic Bonding; Direct Wafer Bonding; Metal Bonding; and Hybrid Metal/Dielectric Bonding. Part II summarizes the key wafer bonding applications developed recently, that is, 3D integration, MEMS, and temporary bonding, to give readers a taste of the significant applications of wafer bonding technologies. This book is aimed at materials scientists, semiconductor physicists, the semiconductor industry, IT engineers, electrical engineers, and libraries.
Micro Process Engineering
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Author : Norbert Kockmann
language : en
Publisher: John Wiley & Sons
Release Date : 2013-03-26
Micro Process Engineering written by Norbert Kockmann and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-03-26 with Technology & Engineering categories.
This edition of 'Micro Process Engineering' was originally published in the successful series 'Advanced Micro & Nanosystems'. Authors from leading industrial players and research institutions present a concise and didactical introduction to Micro Process Engineering, the combination of microtechnology and process engineering into a most promising and powerful tool for revolutionizing chemical processes and industrial mass production of bulk materials, fine chemicals, pharmaceuticals and many other products. The book takes the readers from the fundamentals of engineering methods, transport processes, and fluid dynamics to device conception, simulation and modelling, control interfaces and issues of modularity and compatibility. Fabrication strategies and techniques are examined next, focused on the fabrication of suitable microcomponents from various materials such as metals, polymers, silicon, ceramics and glass. The book concludes with actual applications and operational aspects of micro process systems, giving broad coverage to industrial efforts in America, Europe and Asia as well as laboratory equipment and education.