A Strategy For Three Dimensional Vlsi
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A Strategy For Three Dimensional Vlsi
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Author : Christian Heckler
language : en
Publisher:
Release Date : 1991
A Strategy For Three Dimensional Vlsi written by Christian Heckler and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1991 with categories.
3 Dimensional Vlsi
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Author : Yangdong Deng
language : en
Publisher: Springer Science & Business Media
Release Date : 2010-09-08
3 Dimensional Vlsi written by Yangdong Deng and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2010-09-08 with Technology & Engineering categories.
"3-Dimensional VLSI: A 2.5-Dimensional Integration Scheme"elaborates the concept and importance of 3-Dimensional (3-D) VLSI. The authors have developed a new 3-D IC integration paradigm, so-called 2.5-D integration, to address many problems that are hard to resolve using traditional non-monolithic integration schemes. The book also introduces major 3-D VLSI design issues that need to be solved by IC designers and Electronic Design Automation (EDA) developers. By treating 3-D integration in an integrated framework, the book provides important insights for semiconductor process engineers, IC designers, and those working in EDA R&D. Dr. Yangdong Deng is an associate professor at the Institute of Microelectronics, Tsinghua University, China. Dr. Wojciech P. Maly is the U. A. and Helen Whitaker Professor at the Department of Electrical and Computer Engineering, Carnegie Mellon University, USA.
3d Integration For Vlsi Systems
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Author : Chuan Seng Tan
language : en
Publisher: CRC Press
Release Date : 2016-04-19
3d Integration For Vlsi Systems written by Chuan Seng Tan and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2016-04-19 with Science categories.
Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the conventional scaling approach is faced with unprecedented challenges in fundamental and economic limits. Wafer level 3D IC can take several forms, and they usually include a stack of several thinned IC layers th
Three Dimensional Vlsi I
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Author : Arnold L. Rosenberg
language : en
Publisher:
Release Date : 1981
Three Dimensional Vlsi I written by Arnold L. Rosenberg and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1981 with categories.
Design And Process For Three Dimensional Heterogeneous Integration
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Author : Shulu Chen
language : en
Publisher: Stanford University
Release Date : 2010
Design And Process For Three Dimensional Heterogeneous Integration written by Shulu Chen and has been published by Stanford University this book supported file pdf, txt, epub, kindle and other format this book has been release on 2010 with categories.
Since the invention of the integrated circuit (IC) in the late 1950s, the semiconductor industry has experienced dramatic growth driven by both technology and manufacturing improvements. Over the past 40 years, the industry's growth trend has been predicted by Moore's law, and driven by the constant electrical field scaling design methodology. While the intrinsic performance of each device improves over generations, the corresponding interconnects do not. To alleviate this interconnect issue, a three-dimensional (3D) integration concept of transforming longer side to side interconnects into shorter vertical vias by using multiple active layers has attracted much attention. The focus of this thesis is on providing the foundation for 3D heterogeneous integration by investigating methods of growing single crystal materials on the silicon platform and the subsequent low-temperature process flow, through experimental demonstration, theoretical modeling and device structure simplification. First, thin film single crystal GaAs and GaSb were grown on dielectric layers on bulk silicon substrates by the rapid melt growth (RMG) method, using both rapid thermal annealing (RTA) and laser annealing. The relationship between stoichiometry and the crystal structure is discussed according to the theoretical phase diagram and the experimental results. A modified RMG structure is also proposed and demonstrated to solve the potential issue involved in integrating the RMG method into a three-dimensional integrated circuits (3D-IC) process with thick isolation layers. In order to estimate the outcome of the crystallization and to provide further understanding of the physics behind this RMG process, compact models are derived based on classical crystallization theory. Mathematical models including the geometry, the thermal environment and the outcome of the crystallization are built. The initial cooling rate is identified as the key factor for the RMG process. With the ability of integrating multiple materials on silicon substrates, the subsequent process flows using low-temperature-fabrication or simplified device structures are proposed and evaluated to achieve high density 3D integration. A "bonding substrate/monolithic contact" approach is proposed to relieve the thermal constraint from getting the starting single crystal layer without sacrificing the interconnect performance. A low-temperature process using germanium as the channel material is also discussed. Finally, gated thin film resistor structures are designed and compared to the conventional MOSFET structure with a focus on their relative performance and process complexity trade-off for future 3D-IC implementation.
3d Integration In Vlsi Circuits
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Author : Katsuyuki Sakuma
language : en
Publisher: CRC Press
Release Date : 2018-04-17
3d Integration In Vlsi Circuits written by Katsuyuki Sakuma and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-04-17 with Technology & Engineering categories.
Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D ICs. The goal of this book is to provide readers with an understanding of the latest challenges and issues in 3D integration. TSVs are not the only technology element needed for 3D integration. There are numerous other key enabling technologies required for 3D integration, and the speed of the development in this emerging field is very rapid. To provide readers with state-of-the-art information on 3D integration research and technology developments, each chapter has been contributed by some of the world’s leading scientists and experts from academia, research institutes, and industry from around the globe. Covers chip/wafer level 3D integration technology, memory stacking, reconfigurable 3D, and monolithic 3D IC. Discusses the use of silicon interposer and organic interposer. Presents architecture, design, and technology implementations for 3D FPGA integration. Describes oxide bonding, Cu/SiO2 hybrid bonding, adhesive bonding, and solder bonding. Addresses the issue of thermal dissipation in 3D integration.
Analysis Of Three Dimensional Effects In Advanced Vlsi Devices
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Author : Thomas Dwight Linton
language : en
Publisher:
Release Date : 1989
Analysis Of Three Dimensional Effects In Advanced Vlsi Devices written by Thomas Dwight Linton and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1989 with Integrated circuits categories.
Three Dimensional Integrated Circuit Design
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Author : Vasilis F. Pavlidis
language : en
Publisher: Newnes
Release Date : 2017-07-04
Three Dimensional Integrated Circuit Design written by Vasilis F. Pavlidis and has been published by Newnes this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-07-04 with Technology & Engineering categories.
Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: Manufacturing techniques for 3-D ICs with TSVs Electrical modeling and closed-form expressions of through silicon vias Substrate noise coupling in heterogeneous 3-D ICs Design of 3-D ICs with inductive links Synchronization in 3-D ICs Variation effects on 3-D ICs Correlation of WID variations for intra-tier buffers and wires Offers practical guidance on designing 3-D heterogeneous systems Provides power delivery of 3-D ICs Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more Provides experimental case studies in power delivery, synchronization, and thermal characterization
Development Of An Architectural Design Tool For 3 D Vlsi Sensors
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Author : Brian Matthew Tyrrell
language : en
Publisher:
Release Date : 2004
Development Of An Architectural Design Tool For 3 D Vlsi Sensors written by Brian Matthew Tyrrell and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2004 with categories.
Three dimensional integration schemes for VLSI have the potential for enabling the development of new high-performance architectures for applications such as focal plane sensors. Due to the high costs involved in 3-D VLSI fabrication and the fabrication complexity of 3-D integration, analysis of the design and process tradeoffs for a particular application is essential. An architectural and topological design tool is presented that enables the high-level analysis and optimization of sensor architectures targeted to a variety of 3-D VLSI process options. This design tool is based on an inference chain evaluation framework, and allows for a high-level structural representation of a circuit architecture to be considered in conjunction with low-level process models. Approximation strategies for projecting circuit area and performance are incorporated into the inference chain relations.
Three Dimensional Vlsi Placement And Routing
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Author : James David Vaughn
language : en
Publisher:
Release Date : 1994
Three Dimensional Vlsi Placement And Routing written by James David Vaughn and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1994 with Integrated circuits categories.