A Systematic Approach To Modeling Yield For Integrated Circuits
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A Systematic Approach To Modeling Yield For Integrated Circuits
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Author : Aparna Srinivasan
language : en
Publisher:
Release Date : 1995
A Systematic Approach To Modeling Yield For Integrated Circuits written by Aparna Srinivasan and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1995 with categories.
Integrated Circuit Manufacturability
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Author : José Pineda de Gyvez
language : en
Publisher: John Wiley & Sons
Release Date : 1998-10-30
Integrated Circuit Manufacturability written by José Pineda de Gyvez and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 1998-10-30 with Technology & Engineering categories.
"INTEGRATED CIRCUIT MANUFACTURABILITY provides comprehensive coverage of the process and design variables that determine the ease and feasibility of fabrication (or manufacturability) of contemporary VLSI systems and circuits. This book progresses from semiconductor processing to electrical design to system architecture. The material provides a theoretical background as well as case studies, examining the entire design for the manufacturing path from circuit to silicon. Each chapter includes tutorial and practical applications coverage. INTEGRATED CIRCUIT MANUFACTURABILITY illustrates the implications of manufacturability at every level of abstraction, including the effects of defects on the layout, their mapping to electrical faults, and the corresponding approaches to detect such faults. The reader will be introduced to key practical issues normally applied in industry and usually required by quality, product, and design engineering departments in today's design practices: * Yield management strategies * Effects of spot defects * Inductive fault analysis and testing * Fault-tolerant architectures and MCM testing strategies. This book will serve design and product engineers both from academia and industry. It can also be used as a reference or textbook for introductory graduate-level courses on manufacturing."
Computer Aided Design Of Analog Integrated Circuits And Systems
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Author : Rob A. Rutenbar
language : en
Publisher: John Wiley & Sons
Release Date : 2002-05-06
Computer Aided Design Of Analog Integrated Circuits And Systems written by Rob A. Rutenbar and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2002-05-06 with Technology & Engineering categories.
The tools and techniques you need to break the analog design bottleneck! Ten years ago, analog seemed to be a dead-end technology. Today, System-on-Chip (SoC) designs are increasingly mixed-signal designs. With the advent of application-specific integrated circuits (ASIC) technologies that can integrate both analog and digital functions on a single chip, analog has become more crucial than ever to the design process. Today, designers are moving beyond hand-crafted, one-transistor-at-a-time methods. They are using new circuit and physical synthesis tools to design practical analog circuits; new modeling and analysis tools to allow rapid exploration of system level alternatives; and new simulation tools to provide accurate answers for analog circuit behaviors and interactions that were considered impossible to handle only a few years ago. To give circuit designers and CAD professionals a better understanding of the history and the current state of the art in the field, this volume collects in one place the essential set of analog CAD papers that form the foundation of today's new analog design automation tools. Areas covered are: * Analog synthesis * Symbolic analysis * Analog layout * Analog modeling and analysis * Specialized analog simulation * Circuit centering and yield optimization * Circuit testing Computer-Aided Design of Analog Integrated Circuits and Systems is the cutting-edge reference that will be an invaluable resource for every semiconductor circuit designer and CAD professional who hopes to break the analog design bottleneck.
Reliability Yield And Stress Burn In
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Author : Way Kuo
language : en
Publisher: Springer Science & Business Media
Release Date : 2013-11-27
Reliability Yield And Stress Burn In written by Way Kuo and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-11-27 with Technology & Engineering categories.
The international market is very competitive for high-tech manufacturers to day. Achieving competitive quality and reliability for products requires leader ship from the top, good management practices, effective and efficient operation and maintenance systems, and use of appropriate up-to-date engineering de sign tools and methods. Furthermore, manufacturing yield and reliability are interrelated. Manufacturing yield depends on the number of defects found dur ing both the manufacturing process and the warranty period, which in turn determines the reliability. the production of microelectronics has evolved into Since the early 1970's, one of the world's largest manufacturing industries. As a result, an important agenda is the study of reliability issues in fabricating microelectronic products and consequently the systems that employ these products, particularly, the new generation of microelectronics. Such an agenda should include: • the economic impact of employing the microelectronics fabricated by in dustry, • a study of the relationship between reliability and yield, • the progression toward miniaturization and higher reliability, and • the correctness and complexity of new system designs, which include a very significant portion of software.
Yield And Variability Optimization Of Integrated Circuits
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Author : Jian Cheng Zhang
language : en
Publisher: Springer Science & Business Media
Release Date : 2013-03-09
Yield And Variability Optimization Of Integrated Circuits written by Jian Cheng Zhang and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-03-09 with Technology & Engineering categories.
Traditionally, Computer Aided Design (CAD) tools have been used to create the nominal design of an integrated circuit (IC), such that the circuit nominal response meets the desired performance specifications. In reality, however, due to the disturbances ofthe IC manufacturing process, the actual performancesof the mass produced chips are different than those for the nominal design. Even if the manufacturing process were tightly controlled, so that there were little variations across the chips manufactured, the environmentalchanges (e. g. those oftemperature, supply voltages, etc. ) would alsomakethe circuit performances vary during the circuit life span. Process-related performance variations may lead to low manufacturing yield, and unacceptable product quality. For these reasons, statistical circuit design techniques are required to design the circuit parameters, taking the statistical process variations into account. This book deals with some theoretical and practical aspects of IC statistical design, and emphasizes how they differ from those for discrete circuits. It de scribes a spectrum of different statistical design problems, such as parametric yield optimization, generalized on-target design, variability minimization, per formance tunning, and worst-case design. The main emphasis of the presen tation is placed on the principles and practical solutions for performance vari ability minimization. It is hoped that the book may serve as an introductory reference material for various groups of IC designers, and the methodologies described will help them enhance the circuit quality and manufacturability. The book containsseven chapters.
Design For Manufacturability And Statistical Design
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Author : Michael Orshansky
language : en
Publisher: Springer Science & Business Media
Release Date : 2007-10-28
Design For Manufacturability And Statistical Design written by Michael Orshansky and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007-10-28 with Technology & Engineering categories.
Design for Manufacturability and Statistical Design: A Comprehensive Approach presents a comprehensive overview of methods that need to be mastered in understanding state-of-the-art design for manufacturability and statistical design methodologies. Broadly, design for manufacturability is a set of techniques that attempt to fix the systematic sources of variability, such as those due to photolithography and CMP. Statistical design, on the other hand, deals with the random sources of variability. Both paradigms operate within a common framework, and their joint comprehensive treatment is one of the objectives of this book and an important differentation.
Predictive Modeling Of Integrated Circuit Manufacturing Variation
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Author : Swamy V. Muddu
language : en
Publisher:
Release Date : 2007
Predictive Modeling Of Integrated Circuit Manufacturing Variation written by Swamy V. Muddu and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007 with categories.
Continuous scaling of feature sizes in CMOS integrated circuits (IC) pushes the design performance envelope as well as design complexity higher with each successive technology node. Advancements in materials and optics of the manufacturing process enable the scaling and manufacturability of devices in ICs. As device feature dimensions approach the physical limits of lithography and the manufacturing process, the smallest geometric and material variations manifest as design-level performance and power variability. One of the main pathological effects of IC scaling is the increase in design variability as a fraction of performance with each technology node. This design variability directly affects IC parametric (i.e., performance-limited) and catastrophic (i.e., defect-limited) yield, and consequently, IC cost. To address the increase in manufacturing variability in deep-submicron (DSM) technologies and to improve IC yield, a new design for manufacturability (DFM) paradigm has emerged in the recent past. The DFM paradigm encompasses a set of design methodologies that address manufacturing and process non-idealities at the design level to make ICs more robust to variations. DFM is also interpreted as a set of post-layout design fixing techniques that enhance and ease manufacturability. In general, the objective of DFM is to improve IC yield and cost by increasing manufacturing-awareness in the design phase, as well as design-awareness in the manufacturing phase. To achieve this dual objective of DFM, design must be driven by models of variation in the manufacturing process and the manufacturing process, must be made aware of the design intent. Variations in the IC manufacturing process are manifested as (1) deviation from the intended shapes of IC geometries, and (2) variations in impurity (i.e., dopant) concentrations. These variations are composed of systematic and random components. The systematic component of variation can be attributed to specific sources in the manufacturing process, while the random component is usually a result of confounding of several sources of variation and cannot be attributed to specific sources. A significant fraction of the total variation in shapes of IC geometries is systematic in sources such as focus, exposure dose, lens aberrations, etc. The objective of this thesis is to model the impact of the raw sources of variation at the mask making and wafer pattern transfer phases in manufacturing. The primary goal in the associated research is to develop models that can drive systematic variation-aware design. We propose techniques to model the impact of mask-level and wafer-level sources of variation on IC geometries. At the mask-level, proximity effects and resist heating caused by electron-beam writing are the two main sources of mask critical dimension (CD) errors. We propose a novel methodology to model resist heating caused by electron-beam writing on the mask resist. We use the resist heating model to drive temperature-aware mask writing schedules that minimize resist temperature, and consequently minimize mask CD error. Sub-wavelength optical lithography in sub-100nm technology nodes is enabled by resolution enhancement techniques (RETs) that allow patterning of layout features on silicon wafers. Optical proximity correction (OPC) is the most prominent RET used to compensate a design layout for optical and process effects prior to mask making and lithography. OPC modifies the shapes of layout features, and consequently increases mask complexity and cost. We develop a model of post-OPC mask cost of design features, to drive design-aware mask cost optimization. Despite advanced RETs and illumination techniques, several sources of variation in the pattern transfer process result in variations in chip-level performance and power. At 45nm and below, accurate design-level performance and power analyses must consider litho-simulated non-idealities in patterning. However, the simulation of exposure, resist and etch processing steps in lithography is computationally expensive to perform at chip-scale, and essentially infeasible during iterative design optimization. In this thesis, We develop a predictive model of post-OPC linewidth of devices in standard cells across the process window. The predictive model is fast, accurate and highly scalable, enabling its use in the design phase at full-chip scale without actually performing OPC and litho simulation. Last, we demonstrate the use of predictive linewidth models in fast and accurate leakage estimation and optimization. First, We discuss the use of through-focus systematic linewidth models to achieve accurate leakage estimation. We then discuss a novel detailed placement perturbation approach that leverages systematic pitch and focus interactions to improve leakage in light of systematic linewidth variation. These two methods demonstrate the use of predictive models of variation in driving variation-aware design analysis and optimization.
Fundamentals Of Semiconductor Manufacturing And Process Control
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Author : Gary S. May
language : en
Publisher: John Wiley & Sons
Release Date : 2006-05-26
Fundamentals Of Semiconductor Manufacturing And Process Control written by Gary S. May and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2006-05-26 with Technology & Engineering categories.
A practical guide to semiconductor manufacturing from processcontrol to yield modeling and experimental design Fundamentals of Semiconductor Manufacturing and Process Controlcovers all issues involved in manufacturing microelectronic devicesand circuits, including fabrication sequences, process control,experimental design, process modeling, yield modeling, and CIM/CAMsystems. Readers are introduced to both the theory and practice ofall basic manufacturing concepts. Following an overview of manufacturing and technology, the textexplores process monitoring methods, including those that focus onproduct wafers and those that focus on the equipment used toproduce wafers. Next, the text sets forth some fundamentals ofstatistics and yield modeling, which set the foundation for adetailed discussion of how statistical process control is used toanalyze quality and improve yields. The discussion of statistical experimental design offers readers apowerful approach for systematically varying controllable processconditions and determining their impact on output parameters thatmeasure quality. The authors introduce process modeling concepts,including several advanced process control topics such asrun-by-run, supervisory control, and process and equipmentdiagnosis. Critical coverage includes the following: * Combines process control and semiconductor manufacturing * Unique treatment of system and software technology and managementof overall manufacturing systems * Chapters include case studies, sample problems, and suggestedexercises * Instructor support includes electronic copies of the figures andan instructor's manual Graduate-level students and industrial practitioners will benefitfrom the detailed exami?nation of how electronic materials andsupplies are converted into finished integrated circuits andelectronic products in a high-volume manufacturingenvironment. An Instructor's Manual presenting detailed solutions to all theproblems in the book is available from the Wiley editorialdepartment. An Instructor Support FTP site is also available.
Integrated Circuit And System Design Power And Timing Modeling Optimization And Simulation
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Author : José L. Ayala
language : en
Publisher: Springer
Release Date : 2013-01-03
Integrated Circuit And System Design Power And Timing Modeling Optimization And Simulation written by José L. Ayala and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-01-03 with Computers categories.
This book constitutes the refereed proceedings of the 22nd International Conference on Integrated Circuit and System Design, PATMOS 2012, held in Newcastle, UK Spain, in September 2012. The 25 revised full papers presented were carefully reviewed and selected from numerous submissions. The paper feature emerging challenges in methodologies and tools for the design of upcoming generations of integrated circuits and systems, including reconfigurable hardware such as FPGAs. The technical program focus on timing, performance and power consumption as well as architectural aspects with particular emphasis on modeling, design, characterization, analysis and optimization.
Introduction To Semiconductor Device Yield Modeling
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Author : Albert V. Ferris-Prabhu
language : en
Publisher: Artech House Materials Science
Release Date : 1992
Introduction To Semiconductor Device Yield Modeling written by Albert V. Ferris-Prabhu and has been published by Artech House Materials Science this book supported file pdf, txt, epub, kindle and other format this book has been release on 1992 with Technology & Engineering categories.
This text, the first of its kind, delivers a systematically organized introduction to the theory and practice of yield prediction. The book addresses the economic need for accurate yield prediction, and clarifies the important role it plays in the semiconductor industry.