Adaptive Hot Spot Cooling Of Integrated Circuits Using Digital Microfluidics
DOWNLOAD
Download Adaptive Hot Spot Cooling Of Integrated Circuits Using Digital Microfluidics PDF/ePub or read online books in Mobi eBooks. Click Download or Read Online button to get Adaptive Hot Spot Cooling Of Integrated Circuits Using Digital Microfluidics book now. This website allows unlimited access to, at the time of writing, more than 1.5 million titles, including hundreds of thousands of titles in various foreign languages. If the content not found or just blank you must refresh this page
Adaptive Hot Spot Cooling Of Integrated Circuits Using Digital Microfluidics
DOWNLOAD
Author : Philip Y. Paik
language : en
Publisher:
Release Date : 2006
Adaptive Hot Spot Cooling Of Integrated Circuits Using Digital Microfluidics written by Philip Y. Paik and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2006 with Integrated circuits categories.
Adaptive Cooling Of Integrated Circuits Using Digital Microfluidics
DOWNLOAD
Author : Philip Y. Paik
language : en
Publisher: Artech House Publishers
Release Date : 2007
Adaptive Cooling Of Integrated Circuits Using Digital Microfluidics written by Philip Y. Paik and has been published by Artech House Publishers this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007 with Science categories.
Thanks to increasing power consumption and component density, localized hot spots are becoming a serious challenge in IC (integrated circuit) chip design - so serious, in fact, that Intel recently had to yank a circuit because it was literally burning. For IC engineers grappling with high power dissipation and thermal issues, new droplet-based cooling techniques using digital microfluidics technology could provide the solution. This definitive guide paves the way, with design and implementation methodologies and prototypes for utilizing this groundbreaking technology. After reviewing cooling principles and current bulk cooling methods, the book brings engineers up to speed on emerging droplet-based architectures. Amply illustrated, this milestone work will prove invaluable in tackling IC heat issues that existing methods can no longer address.
Heat Transfer
DOWNLOAD
Author : Hafiz Muhammad Ali
language : en
Publisher: BoD – Books on Demand
Release Date : 2024-02-14
Heat Transfer written by Hafiz Muhammad Ali and has been published by BoD – Books on Demand this book supported file pdf, txt, epub, kindle and other format this book has been release on 2024-02-14 with Science categories.
Heat Transfer - Advances in Fundamentals and Applications explores new knowledge in the domain of fundamental and applied advances in heat transfer. This book specifically emphasizes advanced topics of heat transfer. Professionals, researchers, and academics working in various areas of heat transfer will find this a useful reference for finding new solutions to heat transfer problems. The book is organized into two sections on the fundamental advances in heat transfer and advances in applications of heat transfer. Chapters address inverse conduction problems, heat transfer enhancement during internal flows, shell-and-tube heat exchangers, heat transfer mechanisms in petroleum and geothermal wellbores, and other topics in the field.
Mechanical Engineering For Sustainable Development
DOWNLOAD
Author : Amit Pal
language : en
Publisher: Materials Research Forum LLC
Release Date : 2025-03-25
Mechanical Engineering For Sustainable Development written by Amit Pal and has been published by Materials Research Forum LLC this book supported file pdf, txt, epub, kindle and other format this book has been release on 2025-03-25 with Technology & Engineering categories.
The book covers four research areas: (1) Thermal and Energy Engineering, (2) Industrial Engineering and Management, (3) Computational Design and Simulations and (4) Materials and Manufacturing. Topics covered include robotics, micro-electro-mechanical systems, cryogenics, composites, and cellular and molecular biomechanics. Keywords: Green Hydrogen Economy, Renewable Energy Systems, Additive Manufacturing, Lithium-Ion Batteries, Air Pollution Control, Photothermal Material, Electric Vehicle, Cloud Computing, Wastegate Turbocharger, Machine Intelligence, Shear Deformation, Friction Stir Welding, Biogas Production, Green Combustion.
Droplet And Spray Transport Paradigms And Applications
DOWNLOAD
Author : Saptarshi Basu
language : en
Publisher: Springer
Release Date : 2017-12-12
Droplet And Spray Transport Paradigms And Applications written by Saptarshi Basu and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-12-12 with Technology & Engineering categories.
This book focuses on droplets and sprays and their applications. It discusses how droplet level transport is central to a multitude of applications and how droplet level manipulation and control can enhance the efficiency and design of multiphase systems. Droplets and sprays are ubiquitous in a variety of multiphase and multiscale applications in surface patterning, oil recovery, combustion, atomization, spray drying, thermal barrier coating, renewable energy, and electronic cooling, to name but a few. This book provides two levels of details pertaining to such applications. Each chapter delves into a specific application and provides not only an overview but also detailed physical insights into the application mechanism from the point of view of droplets and sprays. All chapters provide a mix of cutting-edge applications, new diagnostic techniques and modern computational methodologies, as well as the fundamental physical mechanism involved in each application. Taken together, the chapters provide a translational perspective on these applications, from basic transport processes to optimization, and from design to implementation using droplets or sprays as fundamental building blocks. Given its breadth of coverage, the book will be of interest to students, researchers, and industry professionals alike.
Dissertation Abstracts International
DOWNLOAD
Author :
language : en
Publisher:
Release Date : 2008
Dissertation Abstracts International written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2008 with Dissertations, Academic categories.
Mems Packaging
DOWNLOAD
Author : Yung-cheng Lee
language : en
Publisher: World Scientific
Release Date : 2018-01-03
Mems Packaging written by Yung-cheng Lee and has been published by World Scientific this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-01-03 with Technology & Engineering categories.
MEMS sensors and actuators are enabling components for smartphones, AR/VR, and wearable electronics. MEMS packaging is recognized as one of the most critical activities to design and manufacture reliable MEMS. A unique challenge to MEMS packaging is how to protect moving MEMS devices during manufacturing and operation. With the introduction of wafer level capping and encapsulation processes, this barrier is removed successfully. In addition, MEMS devices should be integrated with their electronic chips with the smallest footprint possible. As a result, 3D packaging is applied to connect the devices vertically for the most effective integration. Such 3D packaging also paves the way for further heterogenous integration of MEMS devices, electronics, and other functional devices.This book consists of chapters written by leaders developing products in a MEMS industrial setting and faculty members conducting research in an academic setting. After an introduction chapter, the practical issues are covered: through-silicon vias (TSVs), vertical interconnects, wafer level packaging, motion sensor-to-CMOS bonding, and use of printed circuit board technology to fabricate MEMS. These chapters are written by leaders developing MEMS products. Then, fundamental issues are discussed, topics including encapsulation of MEMS, heterogenous integration, microfluidics, solder bonding, localized sealing, microsprings, and reliability.
Microwave Journal
DOWNLOAD
Author :
language : en
Publisher:
Release Date : 2007
Microwave Journal written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007 with Microwaves categories.
3d Microelectronic Packaging
DOWNLOAD
Author : Yan Li
language : en
Publisher: Springer
Release Date : 2017-01-20
3d Microelectronic Packaging written by Yan Li and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-01-20 with Technology & Engineering categories.
This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights into key areas for future research and development.
Green And Sustainable Computing Part Ii
DOWNLOAD
Author :
language : en
Publisher: Academic Press
Release Date : 2013-02-27
Green And Sustainable Computing Part Ii written by and has been published by Academic Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-02-27 with Computers categories.
Since its first volume in 1960, Advances in Computers has presented detailed coverage of innovations in computer hardware, software, theory, design, and applications. It has also provided contributors with a medium in which they can explore their subjects in greater depth and breadth than journal articles usually allow. As a result, many articles have become standard references that continue to be of sugnificant, lasting value in this rapidly expanding field. - In-depth surveys and tutorials on new computer technology - Well-known authors and researchers in the field - Extensive bibliographies with most chapters - Many of the volumes are devoted to single themes or subfields of computer science