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Advanced Liquid Metal Cooling For Chip Device And System

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Advanced Liquid Metal Cooling For Chip Device And System

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Author : Jing Liu
language : en
Publisher: World Scientific
Release Date : 2022-04-08

Advanced Liquid Metal Cooling For Chip Device And System written by Jing Liu and has been published by World Scientific this book supported file pdf, txt, epub, kindle and other format this book has been release on 2022-04-08 with Technology & Engineering categories.

This compendium summarizes the core principles and practical applications of a brand-new advanced chip cooling category — liquid metal cooling. It illustrates the science and art of room temperature liquid metal enabled cooling for chip, device and system. The concise volume features unique scientific and practical merits, and clarified intriguing liquid metal coolant or medium behaviors in making new generation powerful cooling system.With both uniquely important fundamental and practical values, this useful reference text benefits researchers to set up their foundation and then find new ways of making advanced cooling system to fulfil the increasingly urgent needs in modern highly integrated chip industry.

Liquid Metals

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Author : Lei Fu
language : en
Publisher: John Wiley & Sons
Release Date : 2022-03-15

Liquid Metals written by Lei Fu and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2022-03-15 with Technology & Engineering categories.

An up-to-date exploration of the properties and most recent applications of liquid metals In Liquid Metal: Properties, Mechanisms, and Applications, a pair of distinguished researchers delivers a comprehensive exploration of liquid metals with a strong focus on their structure and physicochemical properties, preparation methods, and tuning strategies. The book also illustrates the applications of liquid metals in fields as varied as mediated synthesis, 3D printing, flexible electronics, biomedicine, energy storage, and energy conversion. The authors include coverage of reactive mediums for synthesizing and assembling nanomaterials and direct-writing electronics, and the book offers access to supplementary video materials to highlight the concepts discussed within. Recent advancements in the field of liquid metals are also discussed, as are new opportunities for research and development in this rapidly developing area. The book also includes: A thorough introduction to the fundamentals of liquid metal, including a history of its discovery, its structure and physical properties, and its preparation Comprehensive explorations of the external field tuning of liquid metal, including electrical, magnetic, and chemical tuning Practical discussions of liquid metal as a new reaction medium, including nanomaterial synthesis and alloy preparation In-depth examinations of constructing techniques of liquid metal-based architectures, including injection, imprinting, and mask-assisted depositing Perfect for materials scientists, electrochemists, and catalytic chemists, Liquid Metal: Properties, Mechanisms, and Applications also belongs in the libraries of inorganic chemists, electronics engineers, and biochemists.

Qpedia Thermal Management Electronics Cooling Book Volume 2

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Author : Advanced Thermal Solutions
language : en
Publisher: Advanced Thermal Solutions
Release Date : 2008

Qpedia Thermal Management Electronics Cooling Book Volume 2 written by Advanced Thermal Solutions and has been published by Advanced Thermal Solutions this book supported file pdf, txt, epub, kindle and other format this book has been release on 2008 with Science categories.

The complete editorial contents of Qpedia Thermal eMagazine, Volume 2, Issues 1 - 12 features in-depth, technical articles on the most critical topics in the thermal management of electronics.

Advances In Heat Transfer

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Author : Ephraim M. Sparrow
language : en
Publisher: Academic Press
Release Date : 2018-11-07

Advances In Heat Transfer written by Ephraim M. Sparrow and has been published by Academic Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-11-07 with Science categories.

Advances in Heat Transfer, Volume 50, provides in-depth review articles from a broader scope than in traditional journals or texts, with this comprehensive release covering chapters on Heat Transfer in Rotating Channels, Advances in Liquid Metal Science and Technology in Chip Cooling and Thermal Management, Heat Transfer in Rotating Cooling Channel, Anomalous Heat Transfer: Examples, Fundamentals, and Fractional Calculus Models, and much more. Fills the information gap between regularly scheduled journals and university-level textbooks by providing in-depth review articles over a broader scope than in traditional journals or texts Essential reading for all mechanical, chemical and industrial engineers working in the field of heat transfer, or in graduate schools or industry

Liquid Metal Soft Machines

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Author : Jing Liu
language : en
Publisher: Springer
Release Date : 2018-09-19

Liquid Metal Soft Machines written by Jing Liu and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-09-19 with Technology & Engineering categories.

This book discusses the core principles and practical applications of a brand new machine category: liquid-metal soft machines and motors. After a brief introduction on the conventional soft robot and its allied materials, it presents the new conceptual liquid-metal machine, which revolutionizes existing rigid robots, both large and small. It outlines the typical features of the soft liquid-metal materials and describes the various transformation capabilities, mergence of separate metal droplets, self-rotation and planar locomotion of liquid-metal objects under external or internal mechanism. Further, it introduces a series of unusual phenomena discovered while developing the shape changeable smart soft machine and interprets the related mechanisms regarding the effects of the shape, size, voltage, orientation and geometries of the external fields to control the liquid-metal transformers. Moreover, the book illustrates typical strategies to construct a group of different advanced functional liquid-metal soft machines, since such machines or robots are hard to fabricate using rigid-metal or conventional materials. With highly significant fundamental and practical findings, this book is intended for researchers interested in establishing a general method for making future smart soft machine and accompanying robots.

Advanced Materials For Thermal Management Of Electronic Packaging

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Author : Xingcun Colin Tong
language : en
Publisher: Springer Science & Business Media
Release Date : 2011-01-05

Advanced Materials For Thermal Management Of Electronic Packaging written by Xingcun Colin Tong and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011-01-05 with Technology & Engineering categories.

The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials and technologies for active and passive cooling that promise integrable and cost-effective thermal management solutions. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing technology, balance between cost and performance, and application niches. The final chapter presents a roadmap and future perspective on developments in advanced thermal management materials for electronic packaging.