Advanced Metallization For Devices And Circuits Science Technology And Manufacturability

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Ulsi Process Integration 6
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Author : C. Claeys
language : en
Publisher: The Electrochemical Society
Release Date : 2009-09
Ulsi Process Integration 6 written by C. Claeys and has been published by The Electrochemical Society this book supported file pdf, txt, epub, kindle and other format this book has been release on 2009-09 with Science categories.
ULSI Process Integration 6 covers all aspects of process integration. Sections are devoted to 1) Device Technologies, 2) Front-end-of-line integration (gate stacks, shallow junctions, dry etching, etc.), 3) Back-end-of-line integration (CMP, low-k, Cu interconnect, air-gaps, 3D packaging, etc.), 4) Alternative channel technologies (Ge, III-V, hybrid integration), and 5) Emerging technologies (CNT, graphene, polymer electronics, nanotubes).
Chemical Mechanical Planarization In Ic Device Manufacturing Iii
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Author : Robert Leon Opila
language : en
Publisher: The Electrochemical Society
Release Date : 2000
Chemical Mechanical Planarization In Ic Device Manufacturing Iii written by Robert Leon Opila and has been published by The Electrochemical Society this book supported file pdf, txt, epub, kindle and other format this book has been release on 2000 with Technology & Engineering categories.
This volume contains the proceedings of the third international symposium on Chemical Mechanical Planarization integrated circuit device manufacturing held at the 196th Meeting of the Electrochemical Society in Honolulu, Hawaii. ( October 20 -22 1999).
Tribology In Chemical Mechanical Planarization
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Author : Hong Liang
language : en
Publisher: CRC Press
Release Date : 2005-03-01
Tribology In Chemical Mechanical Planarization written by Hong Liang and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2005-03-01 with Technology & Engineering categories.
Illustrating their intersecting role in manufacturing and technological development, this book examines tribological principles and their applications in CMP, including integrated circuits, basic concepts in surfaces of contacts, and common defects as well as friction, lubrication fundamentals, and the basics of wear. The book concludes its focus with mechanical aspects of CMP, pad materials, elastic modulus, and cell buckling. As the first source to integrate CMP and tribology, Tribology in Chemical-Mechanical Planarization provides applied scientists and engineers in the fields of semiconductors and microelectronics with clear foresight to the future of this technology.
Chemical Mechanical Planarization Iv
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Author : R. L. Opila
language : en
Publisher: The Electrochemical Society
Release Date : 2001
Chemical Mechanical Planarization Iv written by R. L. Opila and has been published by The Electrochemical Society this book supported file pdf, txt, epub, kindle and other format this book has been release on 2001 with Technology & Engineering categories.
Electrical Electronics Abstracts
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Author :
language : en
Publisher:
Release Date : 1997
Electrical Electronics Abstracts written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1997 with Electrical engineering categories.
New Developments In Nanotechnology Research
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Author : Eugene V. Dirote
language : en
Publisher: Nova Publishers
Release Date : 2007
New Developments In Nanotechnology Research written by Eugene V. Dirote and has been published by Nova Publishers this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007 with Medical categories.
Nanotechnology is a "catch-all" description of activities at the level of atoms and molecules that have applications in the real world. A nanometer is a billionth of a metre, about 1/80,000 of the diameter of a human hair, or 10 times the diameter of a hydrogen atom. Nanotechnology is now used in precision engineering, new materials development as well as in electronics; electromechanical systems as well as mainstream biomedical applications in areas such as gene therapy, drug delivery and novel drug discovery techniques. This book presents the latest research in this frontier field.
Chemical Mechanical Planarization Vi
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Author : Sudipta Seal
language : en
Publisher: The Electrochemical Society
Release Date : 2003
Chemical Mechanical Planarization Vi written by Sudipta Seal and has been published by The Electrochemical Society this book supported file pdf, txt, epub, kindle and other format this book has been release on 2003 with Technology & Engineering categories.
Processing Of Wide Band Gap Semiconductors
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Author : S. J. Pearton
language : en
Publisher: Cambridge University Press
Release Date : 2013-01-15
Processing Of Wide Band Gap Semiconductors written by S. J. Pearton and has been published by Cambridge University Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-01-15 with Technology & Engineering categories.
Wide bandgap semiconductors, made from such materials as GaN, SiC, diamond, and ZnSe, are undergoing a strong resurgence in recent years, principally because of their direct bandgaps, which give them a huge advantage over the indirect gap Sic As an example, more than 10 million blue LEDs using this technology are sold each month, and new, high brightness (15 lumens per watt), long-life white LEDs are under development with the potential to replace incandescent bulbs in many situations. This book provides readers with a broad overview of this rapidly expanding technology, bringing them up to speed on new discoveries and commercial applications. It provides specific technical applications of key processes such as laser diodes, LEDs, and very high temperature electronic controls on engines, focusing on doping, etching, oxidation passivation, growth techniques and more.
Semiconductor Manufacturing Handbook
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Author : Hwaiyu Geng
language : en
Publisher: McGraw Hill Professional
Release Date : 2005-05-18
Semiconductor Manufacturing Handbook written by Hwaiyu Geng and has been published by McGraw Hill Professional this book supported file pdf, txt, epub, kindle and other format this book has been release on 2005-05-18 with Technology & Engineering categories.
This handbook will provide engineers with the principles, applications, and solutions needed to design and manage semiconductor manufacturing operations. Consolidating the many complex fields of semiconductor fundamentals and manufacturing into one volume by deploying a team of world class specialists, it allows the quick look up of specific manufacturing reference data across many subdisciplines.
Dielectric Material Integration For Microelectronics
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Author : William D. Brown
language : en
Publisher: The Electrochemical Society
Release Date : 1998
Dielectric Material Integration For Microelectronics written by William D. Brown and has been published by The Electrochemical Society this book supported file pdf, txt, epub, kindle and other format this book has been release on 1998 with Technology & Engineering categories.