Chemical Mechanical Planarization Vi

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Chemical Mechanical Planarization Vi

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Author : Sudipta Seal
language : en
Publisher: The Electrochemical Society
Release Date : 2003

Chemical Mechanical Planarization Vi written by Sudipta Seal and has been published by The Electrochemical Society this book supported file pdf, txt, epub, kindle and other format this book has been release on 2003 with Technology & Engineering categories.

Yield Improvement Of Chemical Mechanical Planarization Processes

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Author : Sutee Eamkajornsiri
language : en
Publisher:
Release Date : 2005

Yield Improvement Of Chemical Mechanical Planarization Processes written by Sutee Eamkajornsiri and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2005 with categories.

Chemical mechanical polishing (CMP) is a planarization process that produces high quality surfaces both locally and globally. It is one of the key process steps during fabrication of very large scale integrated (VLSI) chips in integrated circuit (IC) manufacturing. High and reliable wafer yield is critical in the CMP process; it is dependent upon uniformity of material removal rate across the entire wafer. The focus on this research is the development of control algorithm for CMP process. Wafer-scale and die-scale models are the two scales used in this study. To achieve improvement in wafer yield, three control strategies are formulated with greedy algorithm, method heuristic and non-linear programming in this wafer-scale. The simulation results show that average wafer yield from genetic algorithm is improved, compared to greedy algorithm. Moreover, average wafer yield from non-linear programming is also improved, compared to greedy algorithm. At die-scale, a comprehensive control algorithm is developed based on the MRR equations with interface pressure as a control parameter. The interface pressure is varied spatially and/or temporally across the die. In this concept, three control strategies are developed and studied. The strategies are included spatial pressure control, spatial and temporal pressure control, and look-ahead scheduled pressure control. The simulation results of these three strategies show improvement in the upper surface uniformity; however, look-ahead scheduled pressure control seems to be the promising algorithm.

Chemical Mechanical Planarization

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Author : Krishna Rajan
language : en
Publisher:
Release Date : 1998

Chemical Mechanical Planarization written by Krishna Rajan and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1998 with categories.

Colloidal Aspects Of Chemical Mechanical Planarization Cmp

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Author : Tanuja Danie Gopal
language : en
Publisher:
Release Date : 2004

Colloidal Aspects Of Chemical Mechanical Planarization Cmp written by Tanuja Danie Gopal and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2004 with categories.

Advances In Chemical Mechanical Planarization

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Author : Rajiv K. Singh
language : en
Publisher:
Release Date : 2002

Advances In Chemical Mechanical Planarization written by Rajiv K. Singh and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2002 with categories.

Chemical Mechanical Planarization

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Author :
language : en
Publisher:
Release Date : 1996

Chemical Mechanical Planarization written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1996 with categories.

Processing Reliability And Integration Issues In Chemical Mechanical Planarization

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Author : Parshuram B. Zantye
language : en
Publisher:
Release Date : 2005

Processing Reliability And Integration Issues In Chemical Mechanical Planarization written by Parshuram B. Zantye and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2005 with Chemical mechanical planarization categories.

ABSTRACT: Global planarization is one of the major demands of the semiconductor industry. Chemical mechanical polishing (CMP) is the planarization method of choice use to achieve the required stringent tolerances essential for successful fabrication of next generation Integrated Circuits (IC). The predominant reason for CMP defects is the shear and normal stresses during polishing to which the material is subjected. Understanding the process of CMP and factor that contribute to overall stress addition during polishing requires an approach that encompasses all the four major categories of variables, namely: a) machine parameters, b) material properties, c) polishing pad characteristics, and d) polishing slurry performance.

Sixth International Chemical Mechanical Planarization For Ulsi Multilevel Interconnection Conference Cmp Mic

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Author : Institute of Microelectronics Inter-Connection
language : en
Publisher:
Release Date : 2001

Sixth International Chemical Mechanical Planarization For Ulsi Multilevel Interconnection Conference Cmp Mic written by Institute of Microelectronics Inter-Connection and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2001 with categories.

Focus Issue On Chemical Mechanical Planarization Advanced Material And Consumable Challenges

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Author : Suryadevara V. Babu
language : en
Publisher:
Release Date : 2015

Focus Issue On Chemical Mechanical Planarization Advanced Material And Consumable Challenges written by Suryadevara V. Babu and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2015 with categories.

Special Issue On Chemical Mechanical Planarization

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Author : Krishna Rajan
language : en
Publisher:
Release Date : 1996

Special Issue On Chemical Mechanical Planarization written by Krishna Rajan and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1996 with categories.