Special Issue On Chemical Mechanical Planarization
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Special Issue On Chemical Mechanical Planarization
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Author : Krishna Rajan
language : en
Publisher:
Release Date : 1996
Special Issue On Chemical Mechanical Planarization written by Krishna Rajan and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1996 with categories.
Special Section On Chemical Mechanical Planarization
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Author :
language : en
Publisher:
Release Date : 1998
Special Section On Chemical Mechanical Planarization written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1998 with categories.
Focus Issue On Chemical Mechanical Planarization Advanced Material And Consumable Challenges
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Author : Suryadevara V. Babu
language : en
Publisher:
Release Date : 2015
Focus Issue On Chemical Mechanical Planarization Advanced Material And Consumable Challenges written by Suryadevara V. Babu and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2015 with categories.
Chemical Mechanical Planarization Iv
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Author : R. L. Opila
language : en
Publisher: The Electrochemical Society
Release Date : 2001
Chemical Mechanical Planarization Iv written by R. L. Opila and has been published by The Electrochemical Society this book supported file pdf, txt, epub, kindle and other format this book has been release on 2001 with Technology & Engineering categories.
Proceedings Of The First International Symposium On Chemical Mechanical Planarization
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Author : Iqbal Ali
language : en
Publisher: The Electrochemical Society
Release Date : 1997
Proceedings Of The First International Symposium On Chemical Mechanical Planarization written by Iqbal Ali and has been published by The Electrochemical Society this book supported file pdf, txt, epub, kindle and other format this book has been release on 1997 with Science categories.
Chemical Mechanical Planarization Vi
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Author : Sudipta Seal
language : en
Publisher: The Electrochemical Society
Release Date : 2003
Chemical Mechanical Planarization Vi written by Sudipta Seal and has been published by The Electrochemical Society this book supported file pdf, txt, epub, kindle and other format this book has been release on 2003 with Technology & Engineering categories.
Chemical Mechanical Planarization
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Author : Krishna Rajan
language : en
Publisher:
Release Date : 1996
Chemical Mechanical Planarization written by Krishna Rajan and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1996 with categories.
Chemical Mechanical Planarization
DOWNLOAD
Author :
language : en
Publisher:
Release Date : 1996
Chemical Mechanical Planarization written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1996 with categories.
Chemical Mechanical Planarization Of Microelectronic Materials
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Author : Joseph M. Steigerwald
language : en
Publisher: John Wiley & Sons
Release Date : 2008-09-26
Chemical Mechanical Planarization Of Microelectronic Materials written by Joseph M. Steigerwald and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2008-09-26 with Science categories.
Chemical Mechanical Planarization (CMP) plays an important role in today's microelectronics industry. With its ability to achieve global planarization, its universality (material insensitivity), its applicability to multimaterial surfaces, and its relative cost-effectiveness, CMP is the ideal planarizing medium for the interlayered dielectrics and metal films used in silicon integrated circuit fabrication. But although the past decade has seen unprecedented research and development into CMP, there has been no single-source reference to this rapidly emerging technology-until now. Chemical Mechanical Planarization of Microelectronic Materials provides engineers and scientists working in the microelectronics industry with unified coverage of both the fundamental mechanisms and engineering applications of CMP. Authors Steigerwald, Murarka, and Gutmann-all leading CMP pioneers-provide a historical overview of CMP, explain the various chemical and mechanical concepts involved, describe CMP materials and processes, review the latest scientific data on CMP worldwide, and offer examples of its uses in the microelectronics industry. They provide detailed coverage of the CMP of various materials used in the making of microcircuitry: tungsten, aluminum, copper, polysilicon, and various dielectric materials, including polymers. The concluding chapter describes post-CMP cleaning techniques, and most chapters feature problem sets to assist readers in developing a more practical understanding of CMP. The only comprehensive reference to one of the fastest growing integrated circuit manufacturing technologies, Chemical Mechanical Planarization of Microelectronic Materials is an important resource for research scientists and engineers working in the microelectronics industry. An indispensable resource for scientists and engineers working in the microelectronics industry Chemical Mechanical Planarization of Microelectronic Materials is the only comprehensive single-source reference to one of the fastest growing integrated circuit manufacturing technologies. It provides engineers and scientists who work in the microelectronics industry with unified coverage of both the fundamental mechanisms and engineering applications of CMP, including: * The history of CMP * Chemical and mechanical underpinnings of CMP * CMP materials and processes * Applications of CMP in the microelectronics industry * The CMP of tungsten, aluminum, copper, polysilicon, and various dielectrics, including polymers used in integrated circuit fabrication * Post-CMP cleaning techniques * Chapter-end problem sets are also included to assist readers in developing a practical understanding of CMP.
Chemical Mechanical Polishing Of Low Dielectric Constant Polymers And Organosilicate Glasses
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Author : Christopher Lyle Borst
language : en
Publisher: Springer Science & Business Media
Release Date : 2013-11-27
Chemical Mechanical Polishing Of Low Dielectric Constant Polymers And Organosilicate Glasses written by Christopher Lyle Borst and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-11-27 with Technology & Engineering categories.
As semiconductor manufacturers implement copper conductors in advanced interconnect schemes, research and development efforts shift toward the selection of an insulator that can take maximum advantage of the lower power and faster signal propagation allowed by copper interconnects. One of the main challenges to integrating a low-dielectric constant (low-kappa) insulator as a replacement for silicon dioxide is the behavior of such materials during the chemical-mechanical planarization (CMP) process used in Damascene patterning. Low-kappa dielectrics tend to be softer and less chemically reactive than silicon dioxide, providing significant challenges to successful removal and planarization of such materials. The focus of this book is to merge the complex CMP models and mechanisms that have evolved in the past decade with recent experimental results with copper and low-kappa CMP to develop a comprehensive mechanism for low- and high-removal-rate processes. The result is a more in-depth look into the fundamental reaction kinetics that alter, selectively consume, and ultimately planarize a multi-material structure during Damascene patterning.