Chemical Mechanical Planarization Of Microelectronic Materials
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Chemical Mechanical Planarization Of Microelectronic Materials
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Author : Joseph M. Steigerwald
language : en
Publisher: John Wiley & Sons
Release Date : 1997
Chemical Mechanical Planarization Of Microelectronic Materials written by Joseph M. Steigerwald and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 1997 with Science categories.
The concluding chapter describes post-CMP cleaning techniques, and most chapters feature problem sets to assist readers in developing a more practical understanding of CMP. The only comprehensive reference to one of the fastest growing integrated circuit manufacturing technologies, Chemical Mechanical Planarization of Microelectronic Materials is an important resource for research scientists and engineers working in the microelectronics industry.
Chemical Mechanical Planarization Of Microelectronic Materials
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Author : Joseph M. Steigerwald
language : en
Publisher:
Release Date : 2004
Chemical Mechanical Planarization Of Microelectronic Materials written by Joseph M. Steigerwald and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2004 with Chemical mechanical planarization categories.
Microelectronic Applications Of Chemical Mechanical Planarization
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Author : Yuzhuo Li
language : en
Publisher: John Wiley & Sons
Release Date : 2007-10-19
Microelectronic Applications Of Chemical Mechanical Planarization written by Yuzhuo Li and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007-10-19 with Technology & Engineering categories.
An authoritative, systematic, and comprehensive description of current CMP technology Chemical Mechanical Planarization (CMP) provides the greatest degree of planarization of any known technique. The current standard for integrated circuit (IC) planarization, CMP is playing an increasingly important role in other related applications such as microelectromechanical systems (MEMS) and computer hard drive manufacturing. This reference focuses on the chemical aspects of the technology and includes contributions from the foremost experts on specific applications. After a detailed overview of the fundamentals and basic science of CMP, Microelectronic Applications of Chemical Mechanical Planarization: * Provides in-depth coverage of a wide range of state-of-the-art technologies and applications * Presents information on new designs, capabilities, and emerging technologies, including topics like CMP with nanomaterials and 3D chips * Discusses different types of CMP tools, pads for IC CMP, modeling, and the applicability of tribometrology to various aspects of CMP * Covers nanotopography, CMP performance and defect profiles, CMP waste treatment, and the chemistry and colloidal properties of the slurries used in CMP * Provides a perspective on the opportunities and challenges of the next fifteen years Complete with case studies, this is a valuable, hands-on resource for professionals, including process engineers, equipment engineers, formulation chemists, IC manufacturers, and others. With systematic organization and questions at the end of each chapter to facilitate learning, it is an ideal introduction to CMP and an excellent text for students in advanced graduate courses that cover CMP or related semiconductor manufacturing processes.
Microelectronic Applications Of Chemical Mechanical Planarization
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Author : Yuzhuo Li
language : en
Publisher: John Wiley & Sons
Release Date : 2007-12-04
Microelectronic Applications Of Chemical Mechanical Planarization written by Yuzhuo Li and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007-12-04 with Technology & Engineering categories.
An authoritative, systematic, and comprehensive description of current CMP technology Chemical Mechanical Planarization (CMP) provides the greatest degree of planarization of any known technique. The current standard for integrated circuit (IC) planarization, CMP is playing an increasingly important role in other related applications such as microelectromechanical systems (MEMS) and computer hard drive manufacturing. This reference focuses on the chemical aspects of the technology and includes contributions from the foremost experts on specific applications. After a detailed overview of the fundamentals and basic science of CMP, Microelectronic Applications of Chemical Mechanical Planarization: * Provides in-depth coverage of a wide range of state-of-the-art technologies and applications * Presents information on new designs, capabilities, and emerging technologies, including topics like CMP with nanomaterials and 3D chips * Discusses different types of CMP tools, pads for IC CMP, modeling, and the applicability of tribometrology to various aspects of CMP * Covers nanotopography, CMP performance and defect profiles, CMP waste treatment, and the chemistry and colloidal properties of the slurries used in CMP * Provides a perspective on the opportunities and challenges of the next fifteen years Complete with case studies, this is a valuable, hands-on resource for professionals, including process engineers, equipment engineers, formulation chemists, IC manufacturers, and others. With systematic organization and questions at the end of each chapter to facilitate learning, it is an ideal introduction to CMP and an excellent text for students in advanced graduate courses that cover CMP or related semiconductor manufacturing processes.
Chemical Mechanical Planarization Of Semiconductor Materials
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Author : M.R. Oliver
language : en
Publisher: Springer Science & Business Media
Release Date : 2013-03-14
Chemical Mechanical Planarization Of Semiconductor Materials written by M.R. Oliver and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-03-14 with Technology & Engineering categories.
Chemical Mechanical Planarization (CMP) has emerged in the last two decades and grown rapidly as a basic technology widely used in semiconduc tor device fabrication. As a semiconductor processing step, it was developed at IBM in the mid 1980s. From this beginning the technology has been widely adopted throughout the semiconductor industry. As basic CMP technology has been understood and accepted throughout the semiconductor industry, its uses in different parts of the semiconductor process have multiplied. This includes special steps for some special process ing flows, such as for DRAM technology. In addition, the availability of CMP technology has enabled the implementation of new technologies, with the best example being copper interconnect technology. Copper could not be practi cally implemented into semiconductor process flows until the advent of CMP. Unfortunately, the rapid acceptance and implementation of CMP technol ogy in wafer fabrication has occurred without a corresponding rate of advance in the underlying science. Progress is being made in understanding the un derlying CMP mechanisms, but, in general, it is slow and uneven. The most noteworthy exception to this trend is the science of metal CMP reactions, where the scientific understanding is actually driving much of the advance of the technology. There has been no corresponding progress in other CMP areas however.
Microelectronic Packaging
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Author : M. Datta
language : en
Publisher: CRC Press
Release Date : 2004-12-20
Microelectronic Packaging written by M. Datta and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2004-12-20 with Technology & Engineering categories.
Microelectronic Packaging analyzes the massive impact of electrochemical technologies on various levels of microelectronic packaging. Traditionally, interconnections within a chip were considered outside the realm of packaging technologies, but this book emphasizes the importance of chip wiring as a key aspect of microelectronic packaging, and focuses on electrochemical processing as an enabler of advanced chip metallization. Divided into five parts, the book begins by outlining the basics of electrochemical processing, defining the microelectronic packaging hierarchy, and emphasizing the impact of electrochemical technology on packaging. The second part discusses chip metallization topics including the development of robust barrier layers and alternative metallization materials. Part III explores key aspects of chip-package interconnect technologies, followed by Part IV's analysis of packages, boards, and connectors which covers materials development, technology trends in ceramic packages and multi-chip modules, and electroplated contact materials. Illustrating the importance of processing tools in enabling technology development, the book concludes with chapters on chemical mechanical planarization, electroplating, and wet etching/cleaning tools. Experts from industry, universities, and national laboratories submitted reviews on each of these subjects, capturing the technological advances made in each area. A detailed examination of how packaging responds to the challenges of Moore's law, this book serves as a timely and valuable reference for microelectronic packaging and processing professionals and other industrial technologists.
Introduction To Microfabrication
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Author : Sami Franssila
language : en
Publisher: Wiley
Release Date : 2004-06-14
Introduction To Microfabrication written by Sami Franssila and has been published by Wiley this book supported file pdf, txt, epub, kindle and other format this book has been release on 2004-06-14 with Technology & Engineering categories.
Microfabrication is the key technology behind integrated circuits, microsensors, photonic crystals, ink jet printers, solar cells and flat panel displays. Microsystems can be complex, but the basic microstructures and processes of microfabrication are fairly simple. Introduction to Microfabrication shows how the common microfabrication concepts can be applied over and over again to create devices with a wide variety of structures and functions. Featuring: * A comprehensive presentation of basic fabrication processes * An emphasis on materials and microstructures, rather than device physics * In-depth discussion on process integration showing how processes, materials and devices interact * A wealth of examples of both conceptual and real devices Introduction to Microfabrication includes 250 homework problems for students to familiarise themselves with micro-scale materials, dimensions, measurements, costs and scaling trends. Both research and manufacturing topics are covered, with an emphasis on silicon, which is the workhorse of microfabrication. This book will serve as an excellent first text for electrical engineers, chemists, physicists and materials scientists who wish to learn about microstructures and microfabrication techniques, whether in MEMS, microelectronics or emerging applications.
Chemical Mechanical Planarization Of Microelectronic Materials
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Author : J.M. Steigerwald
language : it
Publisher:
Release Date :
Chemical Mechanical Planarization Of Microelectronic Materials written by J.M. Steigerwald and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on with categories.
Chemical Mechanical Planarization Vi
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Author : Sudipta Seal
language : en
Publisher: The Electrochemical Society
Release Date : 2003
Chemical Mechanical Planarization Vi written by Sudipta Seal and has been published by The Electrochemical Society this book supported file pdf, txt, epub, kindle and other format this book has been release on 2003 with Technology & Engineering categories.
Atomic Layer Deposition For Semiconductors
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Author : Cheol Seong Hwang
language : en
Publisher: Springer Science & Business Media
Release Date : 2013-10-18
Atomic Layer Deposition For Semiconductors written by Cheol Seong Hwang and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-10-18 with Science categories.
Offering thorough coverage of atomic layer deposition (ALD), this book moves from basic chemistry of ALD and modeling of processes to examine ALD in memory, logic devices and machines. Reviews history, operating principles and ALD processes for each device.