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Microelectronic Applications Of Chemical Mechanical Planarization

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Microelectronic Applications Of Chemical Mechanical Planarization

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Author : Yuzhuo Li
language : en
Publisher: John Wiley & Sons
Release Date : 2007-10-19

Microelectronic Applications Of Chemical Mechanical Planarization written by Yuzhuo Li and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007-10-19 with Technology & Engineering categories.

An authoritative, systematic, and comprehensive description of current CMP technology Chemical Mechanical Planarization (CMP) provides the greatest degree of planarization of any known technique. The current standard for integrated circuit (IC) planarization, CMP is playing an increasingly important role in other related applications such as microelectromechanical systems (MEMS) and computer hard drive manufacturing. This reference focuses on the chemical aspects of the technology and includes contributions from the foremost experts on specific applications. After a detailed overview of the fundamentals and basic science of CMP, Microelectronic Applications of Chemical Mechanical Planarization: * Provides in-depth coverage of a wide range of state-of-the-art technologies and applications * Presents information on new designs, capabilities, and emerging technologies, including topics like CMP with nanomaterials and 3D chips * Discusses different types of CMP tools, pads for IC CMP, modeling, and the applicability of tribometrology to various aspects of CMP * Covers nanotopography, CMP performance and defect profiles, CMP waste treatment, and the chemistry and colloidal properties of the slurries used in CMP * Provides a perspective on the opportunities and challenges of the next fifteen years Complete with case studies, this is a valuable, hands-on resource for professionals, including process engineers, equipment engineers, formulation chemists, IC manufacturers, and others. With systematic organization and questions at the end of each chapter to facilitate learning, it is an ideal introduction to CMP and an excellent text for students in advanced graduate courses that cover CMP or related semiconductor manufacturing processes.

Chemical Mechanical Planarization Of Microelectronic Materials

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Author : Joseph M. Steigerwald
language : en
Publisher: John Wiley & Sons
Release Date : 1997

Chemical Mechanical Planarization Of Microelectronic Materials written by Joseph M. Steigerwald and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 1997 with Science categories.

The concluding chapter describes post-CMP cleaning techniques, and most chapters feature problem sets to assist readers in developing a more practical understanding of CMP. The only comprehensive reference to one of the fastest growing integrated circuit manufacturing technologies, Chemical Mechanical Planarization of Microelectronic Materials is an important resource for research scientists and engineers working in the microelectronics industry.

Microelectronic Applications Of Chemical Mechanical Planarization

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Author : Yuzhuo Li
language : en
Publisher: John Wiley & Sons
Release Date : 2007-12-04

Introduction To Microfabrication

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Author : Sami Franssila
language : en
Publisher: Wiley
Release Date : 2004-06-14

Introduction To Microfabrication written by Sami Franssila and has been published by Wiley this book supported file pdf, txt, epub, kindle and other format this book has been release on 2004-06-14 with Technology & Engineering categories.

Microfabrication is the key technology behind integrated circuits, microsensors, photonic crystals, ink jet printers, solar cells and flat panel displays. Microsystems can be complex, but the basic microstructures and processes of microfabrication are fairly simple. Introduction to Microfabrication shows how the common microfabrication concepts can be applied over and over again to create devices with a wide variety of structures and functions. Featuring: * A comprehensive presentation of basic fabrication processes * An emphasis on materials and microstructures, rather than device physics * In-depth discussion on process integration showing how processes, materials and devices interact * A wealth of examples of both conceptual and real devices Introduction to Microfabrication includes 250 homework problems for students to familiarise themselves with micro-scale materials, dimensions, measurements, costs and scaling trends. Both research and manufacturing topics are covered, with an emphasis on silicon, which is the workhorse of microfabrication. This book will serve as an excellent first text for electrical engineers, chemists, physicists and materials scientists who wish to learn about microstructures and microfabrication techniques, whether in MEMS, microelectronics or emerging applications.

Advances In Chemical Mechanical Planarization Cmp

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Author : Babu Suryadevara
language : en
Publisher: Woodhead Publishing
Release Date : 2021-09-10

Advances In Chemical Mechanical Planarization Cmp written by Babu Suryadevara and has been published by Woodhead Publishing this book supported file pdf, txt, epub, kindle and other format this book has been release on 2021-09-10 with Technology & Engineering categories.

Advances in Chemical Mechanical Planarization (CMP), Second Edition provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The second edition includes the recent advances of CMP and its emerging materials, methods, and applications, including coverage of post-CMP cleaning challenges and tribology of CMP. This important book offers a systematic review of fundamentals and advances in the area. Part one covers CMP of dielectric and metal films, with chapters focusing on the use of current and emerging techniques and processes and on CMP of various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. New content addressed includes CMP challenges with tungsten, cobalt, and ruthenium as interconnect and barrier films, consumables for ultralow topography and CMP for memory devices. Part two addresses consumables and process control for improved CMP and includes chapters on CMP pads, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes and approaches for defection characterization, mitigation, and reduction. Advances in Chemical Mechanical Planarization (CMP), Second Edition is an invaluable resource and key reference for materials scientists and engineers in academia and R&D. - Reviews the most relevant techniques and processes for CMP of dielectric and metal films - Includes chapters devoted to CMP for current and emerging materials - Addresses consumables and process control for improved CMP, including post-CMP

Microelectronic Packaging

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Author : M. Datta
language : en
Publisher: CRC Press
Release Date : 2004-12-20

Microelectronic Packaging written by M. Datta and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2004-12-20 with Technology & Engineering categories.

Microelectronic Packaging analyzes the massive impact of electrochemical technologies on various levels of microelectronic packaging. Traditionally, interconnections within a chip were considered outside the realm of packaging technologies, but this book emphasizes the importance of chip wiring as a key aspect of microelectronic packaging, and focuses on electrochemical processing as an enabler of advanced chip metallization. Divided into five parts, the book begins by outlining the basics of electrochemical processing, defining the microelectronic packaging hierarchy, and emphasizing the impact of electrochemical technology on packaging. The second part discusses chip metallization topics including the development of robust barrier layers and alternative metallization materials. Part III explores key aspects of chip-package interconnect technologies, followed by Part IV's analysis of packages, boards, and connectors which covers materials development, technology trends in ceramic packages and multi-chip modules, and electroplated contact materials. Illustrating the importance of processing tools in enabling technology development, the book concludes with chapters on chemical mechanical planarization, electroplating, and wet etching/cleaning tools. Experts from industry, universities, and national laboratories submitted reviews on each of these subjects, capturing the technological advances made in each area. A detailed examination of how packaging responds to the challenges of Moore's law, this book serves as a timely and valuable reference for microelectronic packaging and processing professionals and other industrial technologists.

Chemical Mechanical Polishing 9

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Author : G. Banerjee
language : en
Publisher: The Electrochemical Society
Release Date : 2008-05

Chemical Mechanical Polishing 9 written by G. Banerjee and has been published by The Electrochemical Society this book supported file pdf, txt, epub, kindle and other format this book has been release on 2008-05 with Science categories.

The papers included in this issue of ECS Transactions were originally presented in the symposium ¿Chemical Mechanical Polishing 9¿, held during the 213th meeting of The Electrochemical Society, in Phoenix, Arizona from May 18-23, 2008.

Micromanufacturing Processes

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Author : V.K. Jain
language : en
Publisher: CRC Press
Release Date : 2016-04-19

Micromanufacturing Processes written by V.K. Jain and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2016-04-19 with Technology & Engineering categories.

Increased demand for and developments in micromanufacturing have created a need for a resource that covers both the science and technology of this rapidly growing area. With contributions from eminent professors and researchers actively engaged in teaching, research, and development, Micromanufacturing Processes details the basic principles, tools,

Chemical Mechanical Polishing 14

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Author : R. Rhoades
language : en
Publisher: The Electrochemical Society
Release Date : 2016-09-21

Chemical Mechanical Polishing 14 written by R. Rhoades and has been published by The Electrochemical Society this book supported file pdf, txt, epub, kindle and other format this book has been release on 2016-09-21 with Science categories.

Microelectronic Applications Of Chemical Mechanical Planarization

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