Chemical Mechanical Polishing 14

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Chemical Mechanical Polishing 14

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Author : R. Rhoades
language : en
Publisher: The Electrochemical Society
Release Date : 2016-09-21

Chemical Mechanical Polishing 14 written by R. Rhoades and has been published by The Electrochemical Society this book supported file pdf, txt, epub, kindle and other format this book has been release on 2016-09-21 with Science categories.

Chemical Mechanical Polishing Fundamentals And Challenges Volume 566

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Author : S. V. Babu
language : en
Publisher:
Release Date : 2000-02-10

Chemical Mechanical Polishing Fundamentals And Challenges Volume 566 written by S. V. Babu and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2000-02-10 with Technology & Engineering categories.

The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.

Chemical Mechanical Polishing 2001 Advances And Future Challenges Volume 671

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Author : Materials Research Society. Meeting
language : en
Publisher:
Release Date : 2001-12-14

Chemical Mechanical Polishing 2001 Advances And Future Challenges Volume 671 written by Materials Research Society. Meeting and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2001-12-14 with Science categories.

The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. This volume was first published in 2001.

Chemical Mechanical Polishing 10

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Author : G. Banerjee
language : en
Publisher: The Electrochemical Society
Release Date : 2009-05

Chemical Mechanical Polishing 10 written by G. Banerjee and has been published by The Electrochemical Society this book supported file pdf, txt, epub, kindle and other format this book has been release on 2009-05 with Science categories.

The papers included in this issue of ECS Transactions were originally presented in the symposium ¿Chemical Mechanical Polishing 10¿, held during the 215th meeting of The Electrochemical Society, in San Francisco, California from May 24 to 29, 2009.

Chemical Mechanical Polishing

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Author :
language : en
Publisher:
Release Date : 2001

Chemical Mechanical Polishing written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2001 with Electrolytic polishing categories.

Advances In Chemical Mechanical Polishing Volume 816

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Author : Materials Research Society. Meeting
language : en
Publisher:
Release Date : 2004-09

Advances In Chemical Mechanical Polishing Volume 816 written by Materials Research Society. Meeting and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2004-09 with Science categories.

The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. This book, first published in 2004, presents advances in fundamental understanding, development, and applications of chemical-mechanical polishing (CMP).

Chemical Mechanical Polishing Confernece

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Author : Chemical Mechanical Polishing Conference
language : en
Publisher:
Release Date : 1999

Chemical Mechanical Polishing Confernece written by Chemical Mechanical Polishing Conference and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1999 with categories.

Advances In Chemical Mechanical Planarization Cmp

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Author : Babu Suryadevara
language : en
Publisher: Woodhead Publishing
Release Date : 2021-09-10

Advances In Chemical Mechanical Planarization Cmp written by Babu Suryadevara and has been published by Woodhead Publishing this book supported file pdf, txt, epub, kindle and other format this book has been release on 2021-09-10 with Technology & Engineering categories.

Advances in Chemical Mechanical Planarization (CMP), Second Edition provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The second edition includes the recent advances of CMP and its emerging materials, methods, and applications, including coverage of post-CMP cleaning challenges and tribology of CMP. This important book offers a systematic review of fundamentals and advances in the area. Part one covers CMP of dielectric and metal films, with chapters focusing on the use of current and emerging techniques and processes and on CMP of various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. New content addressed includes CMP challenges with tungsten, cobalt, and ruthenium as interconnect and barrier films, consumables for ultralow topography and CMP for memory devices. Part two addresses consumables and process control for improved CMP and includes chapters on CMP pads, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes and approaches for defection characterization, mitigation, and reduction. Advances in Chemical Mechanical Planarization (CMP), Second Edition is an invaluable resource and key reference for materials scientists and engineers in academia and R&D. Reviews the most relevant techniques and processes for CMP of dielectric and metal films Includes chapters devoted to CMP for current and emerging materials Addresses consumables and process control for improved CMP, including post-CMP

Advances In Cmp Polishing Technologies

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Author : Toshiro Doi
language : en
Publisher: William Andrew
Release Date : 2011-12-06

Advances In Cmp Polishing Technologies written by Toshiro Doi and has been published by William Andrew this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011-12-06 with Science categories.

CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. Advances in CMP/Polishing Technologies for Manufacture of Electronic Devices presents the latest developments and technological innovations in the field - making cutting-edge R&D accessible to the wider engineering community. Most of the applications of these processes are kept as confidential as possible (proprietary information), and specific details are not seen in professional or technical journals and magazines. This book makes these processes and applications accessible to a wider industrial and academic audience. Building on the fundamentals of tribology - the science of friction, wear and lubrication - the authors explore the practical applications of CMP and polishing across various market sectors. Due to the high pace of development of the electronics and semiconductors industry, many of the presented processes and applications come from these industries. Demystifies scientific developments and technological innovations, opening them up for new applications and process improvements in the semiconductor industry and other areas of precision engineering Explores stock removal mechanisms in CMP and polishing, and the challenges involved in predicting the outcomes of abrasive processes in high-precision environments The authors bring together the latest innovations and research from the USA and Japan

Chemical Mechanical Planarization Of Microelectronic Materials

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Author : Joseph M. Steigerwald
language : en
Publisher: John Wiley & Sons
Release Date : 2008-09-26

Chemical Mechanical Planarization Of Microelectronic Materials written by Joseph M. Steigerwald and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2008-09-26 with Science categories.

Chemical Mechanical Planarization (CMP) plays an important role in today's microelectronics industry. With its ability to achieve global planarization, its universality (material insensitivity), its applicability to multimaterial surfaces, and its relative cost-effectiveness, CMP is the ideal planarizing medium for the interlayered dielectrics and metal films used in silicon integrated circuit fabrication. But although the past decade has seen unprecedented research and development into CMP, there has been no single-source reference to this rapidly emerging technology-until now. Chemical Mechanical Planarization of Microelectronic Materials provides engineers and scientists working in the microelectronics industry with unified coverage of both the fundamental mechanisms and engineering applications of CMP. Authors Steigerwald, Murarka, and Gutmann-all leading CMP pioneers-provide a historical overview of CMP, explain the various chemical and mechanical concepts involved, describe CMP materials and processes, review the latest scientific data on CMP worldwide, and offer examples of its uses in the microelectronics industry. They provide detailed coverage of the CMP of various materials used in the making of microcircuitry: tungsten, aluminum, copper, polysilicon, and various dielectric materials, including polymers. The concluding chapter describes post-CMP cleaning techniques, and most chapters feature problem sets to assist readers in developing a more practical understanding of CMP. The only comprehensive reference to one of the fastest growing integrated circuit manufacturing technologies, Chemical Mechanical Planarization of Microelectronic Materials is an important resource for research scientists and engineers working in the microelectronics industry. An indispensable resource for scientists and engineers working in the microelectronics industry Chemical Mechanical Planarization of Microelectronic Materials is the only comprehensive single-source reference to one of the fastest growing integrated circuit manufacturing technologies. It provides engineers and scientists who work in the microelectronics industry with unified coverage of both the fundamental mechanisms and engineering applications of CMP, including: * The history of CMP * Chemical and mechanical underpinnings of CMP * CMP materials and processes * Applications of CMP in the microelectronics industry * The CMP of tungsten, aluminum, copper, polysilicon, and various dielectrics, including polymers used in integrated circuit fabrication * Post-CMP cleaning techniques * Chapter-end problem sets are also included to assist readers in developing a practical understanding of CMP.