Advances In Chemical Mechanical Polishing Volume 816
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Advances In Chemical Mechanical Polishing Volume 816
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Author : Materials Research Society. Meeting
language : en
Publisher:
Release Date : 2004-09
Advances In Chemical Mechanical Polishing Volume 816 written by Materials Research Society. Meeting and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2004-09 with Science categories.
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. This book, first published in 2004, presents advances in fundamental understanding, development, and applications of chemical-mechanical polishing (CMP).
Advances In Chemical Mechanical Polishing
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Author : Duane S. Boning
language : en
Publisher: Cambridge University Press
Release Date : 2014-06-05
Advances In Chemical Mechanical Polishing written by Duane S. Boning and has been published by Cambridge University Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-06-05 with Technology & Engineering categories.
While now in widespread use in integrated circuit fabrication, chemical-mechanical polishing (CMP) is also starting to appear in a surprisingly wide range of applications, with a growing variety of processes and technologies. This book, first published in 2004, presents advances in fundamental understanding, development, and applications of CMP. CMP of both conventional and nonconventional materials are discussed. Conventional materials polished using CMP include silicon, oxides and nitrides, polysilicon, and other insulating films, as well as copper, tungsten, barrier films, and other metal films. Nonconventional materials include those of increasing importance in advanced semiconductor, MEMS, and nanotechnologies, such as low-k dielectrics and polymer, nickel, and ruthenium films. CMP in IC fabrication continues to pose substantial problems - for virgin silicon wafer preparation, shallow-trench isolation (STI) structures, and poly or other deep-trench structure formation, as well as copper and low-k metal interconnect. New developments in CMP pads and slurries are presented. Novel polishing methods and are described. Advances in CMP process understanding and modeling are also highlighted.
Chemical Mechanical Polishing 2001 Advances And Future Challenges Volume 671
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Author : Materials Research Society. Meeting
language : en
Publisher:
Release Date : 2001-12-14
Chemical Mechanical Polishing 2001 Advances And Future Challenges Volume 671 written by Materials Research Society. Meeting and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2001-12-14 with Science categories.
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. This volume was first published in 2001.
Chemical Mechanical Planarization Volume 867
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Author : A. Kumar
language : en
Publisher:
Release Date : 2005-07-19
Chemical Mechanical Planarization Volume 867 written by A. Kumar and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2005-07-19 with Technology & Engineering categories.
Technology requirements associated with the progressive scaling of devices for future technology nodes, coupled with the aggressive introduction of new materials, places tremendous demands on chemical-mechanical polishing. The goal of this 2005 book, which is part of a popular series from MRS, is to bring together experts from a broad spectrum of research and technology groups currently working on CMP, to review advances made, and to offer a comprehensive discussion of future challenges that must be overcome. The book shows trends in the development of consumables, process modules, tool designs, process integration, modeling, defect characterization, and metrology. Topics include: planarization processes and applications; consumables -CMP pads and slurries; CMP equipment and metrology; and CMP modeling and simulation.
Electron Microscopy Of Molecular And Atom Scale Mechanical Behavior Chemistry And Structure Volume 839
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Author : Materials Research Society. Meeting
language : en
Publisher:
Release Date : 2005-06-15
Electron Microscopy Of Molecular And Atom Scale Mechanical Behavior Chemistry And Structure Volume 839 written by Materials Research Society. Meeting and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2005-06-15 with Science categories.
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. This book, first published in 2005, showcases how electron microscopy is applied to materials problems and to encourage ideas from both the solid-state and biological communities.
Advances In Cmp Polishing Technologies
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Author : Toshiro Doi
language : en
Publisher: William Andrew
Release Date : 2011-12-06
Advances In Cmp Polishing Technologies written by Toshiro Doi and has been published by William Andrew this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011-12-06 with Science categories.
CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. Advances in CMP/Polishing Technologies for Manufacture of Electronic Devices presents the latest developments and technological innovations in the field - making cutting-edge R&D accessible to the wider engineering community. Most of the applications of these processes are kept as confidential as possible (proprietary information), and specific details are not seen in professional or technical journals and magazines. This book makes these processes and applications accessible to a wider industrial and academic audience. Building on the fundamentals of tribology - the science of friction, wear and lubrication - the authors explore the practical applications of CMP and polishing across various market sectors. Due to the high pace of development of the electronics and semiconductors industry, many of the presented processes and applications come from these industries. Demystifies scientific developments and technological innovations, opening them up for new applications and process improvements in the semiconductor industry and other areas of precision engineering Explores stock removal mechanisms in CMP and polishing, and the challenges involved in predicting the outcomes of abrasive processes in high-precision environments The authors bring together the latest innovations and research from the USA and Japan
Chemical Mechanical Polishing 2001 Advances And Future Challenges
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Author : Suryadevara V. Babu
language : en
Publisher: Cambridge University Press
Release Date : 2014-06-05
Chemical Mechanical Polishing 2001 Advances And Future Challenges written by Suryadevara V. Babu and has been published by Cambridge University Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-06-05 with Technology & Engineering categories.
With copper and barrier-layer integration firmly in place, several other exciting developments are occurring in the practice of chemical-mechanical polishing (CMP), and many advances are described in this book, first published in 2001. Discussions on CMP for shallow-trench isolation, abrasive-free slurries, improvements in pad and tool configurations including fixed abrasive pads, 'engineered' particles, effects of nanotopography, end-point studies, defect characterization and novel post-CMP cleaning methods are highlighted. Considerable progress has also been reported in modeling the complicated interactions that occur between the wafer surface and the pad and the slurry, whether containing abrasives or abrasive-free, and their influence on dishing and erosion and nonuniformity. These studies offer valuable insights for process improvements and yet many challenges remain and will provide a high level of interest for future books. Topics include: recent developments - pads and related issues; CMP abrasives; copper CMP/STI and planarization; STI and planarization - wear-rate models; low-k and integration issues - particle and process effects in CMP and issues in CMP cleaning.
Solid State Chemistry Of Inorganic Materials V Volume 848
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Author : Materials Research Society. Meeting
language : en
Publisher:
Release Date : 2005-07-18
Solid State Chemistry Of Inorganic Materials V Volume 848 written by Materials Research Society. Meeting and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2005-07-18 with Science categories.
Solid-state chemistry continues to span and to spawn multiple materials research areas, attracting investigators from chemistry, condensed-matter physics, materials science and engineering, ceramics, chemical engineering, and mineralogy/geology, to name a few. The common challenge is to understand and to predict structures and properties of new materials. As with earlier volumes in this series from the Materials Research Society, the presentations here represent interdisciplinary research from around the world and explore not only recent advances in the solid-state chemistry of inorganic materials, but also their impact on commercial applications. The book covers a broad range of topics, including synthesis and characterization of novel functional materials; design and fabrication of nanostructures and nanomaterials; crystal and structural chemistry; catalysis; gas separation and storage; and magnetic and optical applications. Both theoretical and computational studies of solid-state inorganic materials are featured. Joint presentations with solid-state ionics are also particularly fruitful.
Progress In Compound Semiconductor Materials Iv Electronic And Optoelectronic Applications Volume 829
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Author : Materials Research Society. Meeting
language : en
Publisher:
Release Date : 2005-04-13
Progress In Compound Semiconductor Materials Iv Electronic And Optoelectronic Applications Volume 829 written by Materials Research Society. Meeting and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2005-04-13 with Technology & Engineering categories.
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Chemical Mechanical Polishing Fundamentals And Challenges Volume 566
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Author : S. V. Babu
language : en
Publisher:
Release Date : 2000-02-10
Chemical Mechanical Polishing Fundamentals And Challenges Volume 566 written by S. V. Babu and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2000-02-10 with Technology & Engineering categories.
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.