Chemical Mechanical Polishing 2001 Advances And Future Challenges
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Chemical Mechanical Polishing 2001 Advances And Future Challenges Volume 671
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Author : Materials Research Society. Meeting
language : en
Publisher:
Release Date : 2001-12-14
Chemical Mechanical Polishing 2001 Advances And Future Challenges Volume 671 written by Materials Research Society. Meeting and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2001-12-14 with Science categories.
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. This volume was first published in 2001.
Chemical Mechanical Polishing 2001 Advances And Future Challenges
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Author : Suryadevara V. Babu
language : en
Publisher: Cambridge University Press
Release Date : 2014-06-05
Chemical Mechanical Polishing 2001 Advances And Future Challenges written by Suryadevara V. Babu and has been published by Cambridge University Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-06-05 with Technology & Engineering categories.
With copper and barrier-layer integration firmly in place, several other exciting developments are occurring in the practice of chemical-mechanical polishing (CMP), and many advances are described in this book, first published in 2001. Discussions on CMP for shallow-trench isolation, abrasive-free slurries, improvements in pad and tool configurations including fixed abrasive pads, 'engineered' particles, effects of nanotopography, end-point studies, defect characterization and novel post-CMP cleaning methods are highlighted. Considerable progress has also been reported in modeling the complicated interactions that occur between the wafer surface and the pad and the slurry, whether containing abrasives or abrasive-free, and their influence on dishing and erosion and nonuniformity. These studies offer valuable insights for process improvements and yet many challenges remain and will provide a high level of interest for future books. Topics include: recent developments - pads and related issues; CMP abrasives; copper CMP/STI and planarization; STI and planarization - wear-rate models; low-k and integration issues - particle and process effects in CMP and issues in CMP cleaning.
Chemical Mechanical Planarization Of Semiconductor Materials
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Author : M.R. Oliver
language : en
Publisher: Springer Science & Business Media
Release Date : 2013-03-14
Chemical Mechanical Planarization Of Semiconductor Materials written by M.R. Oliver and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-03-14 with Technology & Engineering categories.
This book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, one of the most exciting areas in the field of semiconductor technology. It contains detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.
Chemical Mechanical Polishing Fundamentals And Challenges Volume 566
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Author : S. V. Babu
language : en
Publisher:
Release Date : 2000-02-10
Chemical Mechanical Polishing Fundamentals And Challenges Volume 566 written by S. V. Babu and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2000-02-10 with Technology & Engineering categories.
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Advances In Cmp Polishing Technologies
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Author : Toshiro Doi
language : en
Publisher: William Andrew
Release Date : 2011-11-30
Advances In Cmp Polishing Technologies written by Toshiro Doi and has been published by William Andrew this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011-11-30 with Technology & Engineering categories.
CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. Advances in CMP/Polishing Technologies for Manufacture of Electronic Devices presents the latest developments and technological innovations in the field – making cutting-edge R&D accessible to the wider engineering community. Most of the applications of these processes are kept as confidential as possible (proprietary information), and specific details are not seen in professional or technical journals and magazines. This book makes these processes and applications accessible to a wider industrial and academic audience. Building on the fundamentals of tribology – the science of friction, wear and lubrication – the authors explore the practical applications of CMP and polishing across various market sectors. Due to the high pace of development of the electronics and semiconductors industry, many of the presented processes and applications come from these industries. Demystifies scientific developments and technological innovations, opening them up for new applications and process improvements in the semiconductor industry and other areas of precision engineering Explores stock removal mechanisms in CMP and polishing, and the challenges involved in predicting the outcomes of abrasive processes in high-precision environments The authors bring together the latest innovations and research from the USA and Japan
Advances In Chemical Mechanical Polishing Volume 816
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Author : Materials Research Society. Meeting
language : en
Publisher:
Release Date : 2004-09
Advances In Chemical Mechanical Polishing Volume 816 written by Materials Research Society. Meeting and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2004-09 with Science categories.
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. This book, first published in 2004, presents advances in fundamental understanding, development, and applications of chemical-mechanical polishing (CMP).
Chemical Mechanical Polishing 2000 Fundamentals And Materials Issues
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Author : Rajiv K. Singh
language : en
Publisher: Cambridge University Press
Release Date : 2014-06-05
Chemical Mechanical Polishing 2000 Fundamentals And Materials Issues written by Rajiv K. Singh and has been published by Cambridge University Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-06-05 with Technology & Engineering categories.
Chemical-mechanical polishing (CMP) is a critical technology in the planarization of multilevel metallization systems and shallow-trench isolation in semiconductor manufacturing. Other emerging applications for this technology include flat-panel displays, magnetic data storage and microelectromechanical systems. The rapid emergence of copper as the conducting material for integrated circuits has further pushed CMP technology to the forefront of semiconductor manufacturing. However, a basic understanding of the CMP process, which is necessary to enable further advances, is inadequate. This book, first published in 2001, provides an insight into the fundamental processes in CMP. Presentations from academia, government institutions and industry are featured. Topics include: CMP mechanisms; dielectric and metal CMP; process integration and manufacturability; and CMP consumables.
Chemical Mechanical Planarization Volume 867
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Author : A. Kumar
language : en
Publisher:
Release Date : 2005-07-19
Chemical Mechanical Planarization Volume 867 written by A. Kumar and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2005-07-19 with Technology & Engineering categories.
Technology requirements associated with the progressive scaling of devices for future technology nodes, coupled with the aggressive introduction of new materials, places tremendous demands on chemical-mechanical polishing. The goal of this 2005 book, which is part of a popular series from MRS, is to bring together experts from a broad spectrum of research and technology groups currently working on CMP, to review advances made, and to offer a comprehensive discussion of future challenges that must be overcome. The book shows trends in the development of consumables, process modules, tool designs, process integration, modeling, defect characterization, and metrology. Topics include: planarization processes and applications; consumables -CMP pads and slurries; CMP equipment and metrology; and CMP modeling and simulation.
Advances In Chemical Mechanical Planarization Cmp
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Author : Babu Suryadevara
language : en
Publisher: Woodhead Publishing
Release Date : 2021-09-10
Advances In Chemical Mechanical Planarization Cmp written by Babu Suryadevara and has been published by Woodhead Publishing this book supported file pdf, txt, epub, kindle and other format this book has been release on 2021-09-10 with Technology & Engineering categories.
Advances in Chemical Mechanical Planarization (CMP), Second Edition provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The second edition includes the recent advances of CMP and its emerging materials, methods, and applications, including coverage of post-CMP cleaning challenges and tribology of CMP. This important book offers a systematic review of fundamentals and advances in the area. Part one covers CMP of dielectric and metal films, with chapters focusing on the use of current and emerging techniques and processes and on CMP of various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. New content addressed includes CMP challenges with tungsten, cobalt, and ruthenium as interconnect and barrier films, consumables for ultralow topography and CMP for memory devices. Part two addresses consumables and process control for improved CMP and includes chapters on CMP pads, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes and approaches for defection characterization, mitigation, and reduction. Advances in Chemical Mechanical Planarization (CMP), Second Edition is an invaluable resource and key reference for materials scientists and engineers in academia and R&D. Reviews the most relevant techniques and processes for CMP of dielectric and metal films Includes chapters devoted to CMP for current and emerging materials Addresses consumables and process control for improved CMP, including post-CMP
Role Of Chemical Engineering In Processing Of Minerals And Materials
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Author :
language : en
Publisher: Allied Publishers
Release Date : 2003
Role Of Chemical Engineering In Processing Of Minerals And Materials written by and has been published by Allied Publishers this book supported file pdf, txt, epub, kindle and other format this book has been release on 2003 with Chemical engineering categories.