Advances In Cmp Polishing Technologies
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Advances In Cmp Polishing Technologies
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Author : Toshiro Doi
language : en
Publisher: William Andrew
Release Date : 2011-12-06
Advances In Cmp Polishing Technologies written by Toshiro Doi and has been published by William Andrew this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011-12-06 with Science categories.
CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. Advances in CMP/Polishing Technologies for Manufacture of Electronic Devices presents the latest developments and technological innovations in the field - making cutting-edge R&D accessible to the wider engineering community. Most of the applications of these processes are kept as confidential as possible (proprietary information), and specific details are not seen in professional or technical journals and magazines. This book makes these processes and applications accessible to a wider industrial and academic audience. Building on the fundamentals of tribology - the science of friction, wear and lubrication - the authors explore the practical applications of CMP and polishing across various market sectors. Due to the high pace of development of the electronics and semiconductors industry, many of the presented processes and applications come from these industries. Demystifies scientific developments and technological innovations, opening them up for new applications and process improvements in the semiconductor industry and other areas of precision engineering Explores stock removal mechanisms in CMP and polishing, and the challenges involved in predicting the outcomes of abrasive processes in high-precision environments The authors bring together the latest innovations and research from the USA and Japan
Advances In Abrasive Based Machining And Finishing Processes
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Author : S. Das
language : en
Publisher: Springer Nature
Release Date : 2020-05-10
Advances In Abrasive Based Machining And Finishing Processes written by S. Das and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2020-05-10 with Technology & Engineering categories.
This book presents the advances in abrasive based machining and finishing in broad sense. Specifically, the book covers the novel machining and finishing strategies implemented in various advanced machining processes for improving machining accuracy and overall quality of the product. This book presents the capability of advanced machining processes using abrasive grain. It also covers ways for enhancing the production rate as well as quality. It fulfills the gap between the production of any complicated components and successful machining with abrasive particles.
Chemical Mechanical Planarization Of Microelectronic Materials
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Author : Joseph M. Steigerwald
language : en
Publisher: John Wiley & Sons
Release Date : 1997
Chemical Mechanical Planarization Of Microelectronic Materials written by Joseph M. Steigerwald and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 1997 with Science categories.
The concluding chapter describes post-CMP cleaning techniques, and most chapters feature problem sets to assist readers in developing a more practical understanding of CMP. The only comprehensive reference to one of the fastest growing integrated circuit manufacturing technologies, Chemical Mechanical Planarization of Microelectronic Materials is an important resource for research scientists and engineers working in the microelectronics industry.
Handbook Of Manufacturing Engineering And Technology
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Author : Andrew Y. C. Nee
language : en
Publisher: Springer
Release Date : 2014-10-31
Handbook Of Manufacturing Engineering And Technology written by Andrew Y. C. Nee and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-10-31 with Technology & Engineering categories.
The Springer Reference Work Handbook of Manufacturing Engineering and Technology provides overviews and in-depth and authoritative analyses on the basic and cutting-edge manufacturing technologies and sciences across a broad spectrum of areas. These topics are commonly encountered in industries as well as in academia. Manufacturing engineering curricula across universities are now essential topics covered in major universities worldwide.
Semiconductor Manufacturing Technology
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Author : Chue San Yoo
language : en
Publisher: World Scientific
Release Date : 2008
Semiconductor Manufacturing Technology written by Chue San Yoo and has been published by World Scientific this book supported file pdf, txt, epub, kindle and other format this book has been release on 2008 with Technology & Engineering categories.
This textbook contains all the materials that an engineer needs to know to start a career in the semiconductor industry. It also provides readers with essential background information for semiconductor research. It is written by a professional who has been working in the field for over two decades and teaching the material to university students for the past 15 years. It includes process knowledge from raw material preparation to the passivation of chips in a modular format.
Advances In Chemical Mechanical Planarization Cmp
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Author : Babu Suryadevara
language : en
Publisher: Woodhead Publishing
Release Date : 2021-09-10
Advances In Chemical Mechanical Planarization Cmp written by Babu Suryadevara and has been published by Woodhead Publishing this book supported file pdf, txt, epub, kindle and other format this book has been release on 2021-09-10 with Technology & Engineering categories.
Advances in Chemical Mechanical Planarization (CMP), Second Edition provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The second edition includes the recent advances of CMP and its emerging materials, methods, and applications, including coverage of post-CMP cleaning challenges and tribology of CMP. This important book offers a systematic review of fundamentals and advances in the area. Part one covers CMP of dielectric and metal films, with chapters focusing on the use of current and emerging techniques and processes and on CMP of various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. New content addressed includes CMP challenges with tungsten, cobalt, and ruthenium as interconnect and barrier films, consumables for ultralow topography and CMP for memory devices. Part two addresses consumables and process control for improved CMP and includes chapters on CMP pads, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes and approaches for defection characterization, mitigation, and reduction. Advances in Chemical Mechanical Planarization (CMP), Second Edition is an invaluable resource and key reference for materials scientists and engineers in academia and R&D. - Reviews the most relevant techniques and processes for CMP of dielectric and metal films - Includes chapters devoted to CMP for current and emerging materials - Addresses consumables and process control for improved CMP, including post-CMP
Heterogeneous Integrations
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Author : John H. Lau
language : en
Publisher: Springer
Release Date : 2019-04-03
Heterogeneous Integrations written by John H. Lau and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-04-03 with Technology & Engineering categories.
Heterogeneous integration uses packaging technology to integrate dissimilar chips, LED, MEMS, VCSEL, etc. from different fabless houses and with different functions and wafer sizes into a single system or subsystem. How are these dissimilar chips and optical components supposed to talk to each other? The answer is redistribution layers (RDLs). This book addresses the fabrication of RDLs for heterogeneous integrations, and especially focuses on RDLs on: A) organic substrates, B) silicon substrates (through-silicon via (TSV)-interposers), C) silicon substrates (bridges), D) fan-out substrates, and E) ASIC, memory, LED, MEMS, and VCSEL systems. The book offers a valuable asset for researchers, engineers, and graduate students in the fields of semiconductor packaging, materials sciences, mechanical engineering, electronic engineering, telecommunications, networking, etc.
Microelectronic Applications Of Chemical Mechanical Planarization
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Author : Yuzhuo Li
language : en
Publisher: John Wiley & Sons
Release Date : 2007-10-19
Microelectronic Applications Of Chemical Mechanical Planarization written by Yuzhuo Li and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007-10-19 with Technology & Engineering categories.
An authoritative, systematic, and comprehensive description of current CMP technology Chemical Mechanical Planarization (CMP) provides the greatest degree of planarization of any known technique. The current standard for integrated circuit (IC) planarization, CMP is playing an increasingly important role in other related applications such as microelectromechanical systems (MEMS) and computer hard drive manufacturing. This reference focuses on the chemical aspects of the technology and includes contributions from the foremost experts on specific applications. After a detailed overview of the fundamentals and basic science of CMP, Microelectronic Applications of Chemical Mechanical Planarization: * Provides in-depth coverage of a wide range of state-of-the-art technologies and applications * Presents information on new designs, capabilities, and emerging technologies, including topics like CMP with nanomaterials and 3D chips * Discusses different types of CMP tools, pads for IC CMP, modeling, and the applicability of tribometrology to various aspects of CMP * Covers nanotopography, CMP performance and defect profiles, CMP waste treatment, and the chemistry and colloidal properties of the slurries used in CMP * Provides a perspective on the opportunities and challenges of the next fifteen years Complete with case studies, this is a valuable, hands-on resource for professionals, including process engineers, equipment engineers, formulation chemists, IC manufacturers, and others. With systematic organization and questions at the end of each chapter to facilitate learning, it is an ideal introduction to CMP and an excellent text for students in advanced graduate courses that cover CMP or related semiconductor manufacturing processes.
Tribocorrosion Of Passive Metals And Coatings
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Author : D Landolt
language : en
Publisher: Elsevier
Release Date : 2011-10-12
Tribocorrosion Of Passive Metals And Coatings written by D Landolt and has been published by Elsevier this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011-10-12 with Technology & Engineering categories.
Tribocorrosion causes the degradation or alteration of materials through the combined action of corrosion and wear. It limits the performance and life-time of installations, machines and devices with moving parts, and controls certain manufacturing processes such as chemical–mechanical polishing. The effects of tribocorrosion are most pronounced on passive metals which owe their corrosion resistance to a thin protecting oxide film. Most corrosion-resistant engineering alloys belong to this category.This book provides an introduction to the developing field of tribocorrosion and an overview of the latest research. Part one reviews basic notions of corrosion and tribology, before presenting the most recent results on the growth and structure of passive oxide films. Tribocorrosion mechanisms under fretting, sliding and erosion conditions, respectively, are then discussed. Part two focuses on methods for measuring and preventing tribocorrosion. It includes chapters on electrochemical techniques, the design of tribocorrosion test equipment, data evaluation and the optimisation of materials' properties for tribocorrosion systems. Part three presents a selection of tribocorrosion problems in engineering and medicine. Three chapters address the tribocorrosion of medical implants including test methods and clinical implications. Other chapters examine tribocorrosion issues in nuclear power plants, marine environments, automotive cooling circuits, elevated-temperature metal working and chemical–mechanical polishing.With its distinguished editors and international team of expert contributors Tribocorrosion of passive metals and coatings is an invaluable reference tool for engineers and researchers in industry and academia confronted with tribocorrosion problems. - Comprehensively reviews current research on the tribocorrosion of passive metals and coatings, with particular reference to the design of tribocorrosion test equipment, data evaluation and the optimisation of materials' properties for tribocorrosion systems - Chapters discuss tribocorrosion mechanisms under fretting, sliding and erosion conditions before focussing on methods for measuring and preventing tribocorrosion - Includes a comprehensive selection of tribocorrosion problems in engineering and medicine, such as the tribocorrosion of medical implants, and tribocorrosion issues in nuclear power plants, marine environments, automotive cooling circuits and elevated-temperature metal working
Design For Advanced Manufacturing Technologies And Processes
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Author : LaRoux K. Gillespie
language : en
Publisher: McGraw Hill Professional
Release Date : 2017-05-12
Design For Advanced Manufacturing Technologies And Processes written by LaRoux K. Gillespie and has been published by McGraw Hill Professional this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-05-12 with Technology & Engineering categories.
Cutting-edge coverage of the new processes, materials, and technologies that are revolutionizing the manufacturing industry Expertly edited by a past president of the Society of Manufacturing Engineers, this state-of-the-art resource picks up where the bestselling Design for Manufacturability Handbook left off. Within its pages, readers will find detailed, clearly written coverage of the materials, technologies, and processes that have been developed and adopted in the manufacturing industry over the past sixteen years. More than this, the book also includes hard-to-find technical guidance and application information that can be used on the job to actually apply these cutting-edge processes and technologies in a real-world setting. Essential for manufacturing engineers and designers, Design for Advanced Manufacturing is enhanced by a host of international contributors, making the book a true global resource. • Information on the latest technologies and processes such as 3-D printing, nanotechnology, laser cutting, prototyping, additive manufacturing, and CAD/CAM software tools • Coverage of new materials including nano, smart, and shape-memory alloys, in steels, glass, plastics, and composites