Heterogeneous Integrations
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Heterogeneous Integrations
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Author : John H. Lau
language : en
Publisher: Springer
Release Date : 2019-04-03
Heterogeneous Integrations written by John H. Lau and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-04-03 with Technology & Engineering categories.
Heterogeneous integration uses packaging technology to integrate dissimilar chips, LED, MEMS, VCSEL, etc. from different fabless houses and with different functions and wafer sizes into a single system or subsystem. How are these dissimilar chips and optical components supposed to talk to each other? The answer is redistribution layers (RDLs). This book addresses the fabrication of RDLs for heterogeneous integrations, and especially focuses on RDLs on: A) organic substrates, B) silicon substrates (through-silicon via (TSV)-interposers), C) silicon substrates (bridges), D) fan-out substrates, and E) ASIC, memory, LED, MEMS, and VCSEL systems. The book offers a valuable asset for researchers, engineers, and graduate students in the fields of semiconductor packaging, materials sciences, mechanical engineering, electronic engineering, telecommunications, networking, etc.
Foundations Of Heterogeneous Integration
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Author : Farhang Yazdani
language : en
Publisher:
Release Date : 2018
Foundations Of Heterogeneous Integration written by Farhang Yazdani and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018 with Heterogeneous distributed computing systems categories.
This book provides a practical, hands-on approach to teach the foundation of 2.5D/3D heterogeneous design. Based on the author's extensive, industrial experience, this book enables integrated circuit design techniques that provide more memory to the logic chip, also allowing for mixing chips and intellectual property blocks from any vendor to build a more complex chip, more efficiently and cost effectively. Various practical examples and industrial projects are presented throughout the book, including questions and term projects at the end of each chapter. This book is a great resource for practicing engineers and can be used at universities to teach a course at the senior undergraduate and graduate level. Provides knowledge and skills necessary to design wirebond, flip chip and system in package (SIP) products; Provides practical solutions for 2.5D/3D memory and logic integration, explaining a complex, multidisciplinary topic in straightforward terms; Demonstrates a unique co-design methodology for optimizing cross domain heterogeneous integration, including examples, pathfinding, packaging strategy, interposer structure, etc.; Includes real, industry-based examples to give readers hands-on practical design experience.
Chiplet Design And Heterogeneous Integration Packaging
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Author : John H. Lau
language : en
Publisher: Springer Nature
Release Date : 2023-03-27
Chiplet Design And Heterogeneous Integration Packaging written by John H. Lau and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2023-03-27 with Technology & Engineering categories.
The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as chip partitioning, chip splitting, multiple system and heterogeneous integration with TSV-interposers, multiple system and heterogeneous integration with TSV-less interposers, chiplets lateral communication, system-in-package, fan-out wafer/panel-level packaging, and various Cu-Cu hybrid bonding. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.
Smart Electronic Systems
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Author : Li-Rong Zheng
language : en
Publisher: John Wiley & Sons
Release Date : 2019-01-04
Smart Electronic Systems written by Li-Rong Zheng and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-01-04 with Technology & Engineering categories.
Unique in focusing on both organic and inorganic materials from a system point of view, this text offers a complete overview of printed electronics integrated with classical silicon electronics. Following an introduction to the topic, the book discusses the materials and processes required for printed electronics, covering conducting, semiconducting and insulating materials, as well as various substrates, such as paper and plastics. Subsequent chapters describe the various building blocks for printed electronics, while the final part describes the resulting novel applications and technologies, including wearable electronics, RFID tags and flexible circuit boards. Suitable for a broad target group, both industrial and academic, ranging from mechanical engineers to ink developers, and from chemists to engineers.
Heterogeneous Integration
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Author : Anis Husain
language : en
Publisher: SPIE-International Society for Optical Engineering
Release Date : 1998
Heterogeneous Integration written by Anis Husain and has been published by SPIE-International Society for Optical Engineering this book supported file pdf, txt, epub, kindle and other format this book has been release on 1998 with Technology & Engineering categories.
Proceedings of SPIE present the original research papers presented at SPIE conferences and other high-quality conferences in the broad-ranging fields of optics and photonics. These books provide prompt access to the latest innovations in research and technology in their respective fields. Proceedings of SPIE are among the most cited references in patent literature.
Self Organized 3d Integrated Optical Interconnects
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Author : Tetsuzo Yoshimura
language : en
Publisher: CRC Press
Release Date : 2021-03-09
Self Organized 3d Integrated Optical Interconnects written by Tetsuzo Yoshimura and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2021-03-09 with Science categories.
Currently, light waves are ready to come into boxes of computers in high-performance computing systems like data centers and super computers to realize intra-box optical interconnects. For inter-box optical interconnects, light waves have successfully been introduced by OE modules, in which discrete bulk-chip OE/electronic devices are assembled using the flip-chip-bonding-based packaging technology. OE modules, however, are not applicable to intra-box optical interconnects, because intra-box interconnects involve “short line distances of the cm–mm order” and “large line counts of hundreds-thousands.” This causes optics excess, namely, excess components, materials, spaces, fabrication efforts for packaging, and design efforts. The optics excess raises sizes and costs of intra-box optical interconnects enormously when they are built using conventional OE modules. This book proposes the concept of self-organized 3D integrated optical interconnects and the strategy to reduce optics excess in intra-box optical interconnects.
Heterogeneous Optoelectronics Integration
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Author : Elias Towe
language : en
Publisher: SPIE Press
Release Date : 2000
Heterogeneous Optoelectronics Integration written by Elias Towe and has been published by SPIE Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2000 with Computers categories.
Numerous efforts are directed at investigating the use of optics at short distances--for example, at the chip-to-chip and board-to-board levels of the interconnection hierarchy. This book provides an overview of the state of the art in heterogeneous integration of electronics, optoelectronics, and micro-optics for short-distance optical interconnections.
Semantic Integration Of Heterogeneous Software Specifications
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Author : Martin Große-Rhode
language : en
Publisher: Springer Science & Business Media
Release Date : 2013-03-09
Semantic Integration Of Heterogeneous Software Specifications written by Martin Große-Rhode and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-03-09 with Computers categories.
The first book to integrate various model-based software specification approaches. The integration approach is based on a common semantic domain of abstract systems, their composition and development. Its applicability is shown through semantic interpretations and compositional comparisons of different specification approaches. These range from formal specification techniques like process calculi, Petri nets and rule-based formalisms to semiformal software modeling languages like those in the UML family.
Efficient Integration Of 5g And Beyond Heterogeneous Networks
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Author : Zi-Yang Wu
language : en
Publisher: Springer Nature
Release Date : 2020-08-26
Efficient Integration Of 5g And Beyond Heterogeneous Networks written by Zi-Yang Wu and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2020-08-26 with Computers categories.
This book discusses the smooth integration of optical and RF networks in 5G and beyond (5G+) heterogeneous networks (HetNets), covering both planning and operational aspects. The integration of high-frequency air interfaces into 5G+ wireless networks can relieve the congested radio frequency (RF) bands. Visible light communication (VLC) is now emerging as a promising candidate for future generations of HetNets. Heterogeneous RF-optical networks combine the high throughput of visible light and the high reliability of RF. However, when implementing these HetNets in mobile scenarios, several challenges arise from both planning and operational perspectives. Since the mmWave, terahertz, and visible light bands share similar wave propagation characteristics, the concepts presented here can be broadly applied in all such bands. To facilitate the planning of RF-optical HetNets, the authors present an algorithm that specifies the joint optimal densities of the base stations by drawing on stochastic geometry in order to satisfy the users’ quality-of-service (QoS) demands with minimum network power consumption. From an operational perspective, the book explores vertical handovers and multi-homing using a cooperative framework. For vertical handovers, it employs a data-driven approach based on deep neural networks to predict abrupt optical outages; and, on the basis of this prediction, proposes a reinforcement learning strategy that ensures minimal network latency during handovers. In terms of multi-homing support, the authors examine the aggregation of the resources from both optical and RF networks, adopting a two-timescale multi-agent reinforcement learning strategy for optimal power allocation. Presenting comprehensive planning and operational strategies, the book allows readers to gain an in-depth grasp of how to integrate future coexisting networks at high-frequency bands in a cooperative manner, yielding reliable and high-speed 5G+ HetNets.
Rapid Melt Growth Of Silicon Germanium For Heterogeneous Integration On Silicon
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Author : Hwei Yin Serene Koh
language : en
Publisher: Stanford University
Release Date : 2011
Rapid Melt Growth Of Silicon Germanium For Heterogeneous Integration On Silicon written by Hwei Yin Serene Koh and has been published by Stanford University this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011 with categories.
Silicon has made modern integrated circuit technology possible. As MOSFET gate lengths are scaled to 22nm and beyond, it has become apparent that new materials must be introduced to the silicon-based CMOS process for improved performance and functionality. This dissertation begins with a review of the MOSFET leakage current problem and presents one potential solution: Band-to-Band Tunneling (BTBT) transistors, which have the potential for steeper subthreshold slopes because they do not have the fundamental 'kT/q' limit in the rate at which conventional MOSFETs can be turned on or off. It is clear that these devices must be fabricated in materials with smaller bandgaps for improved performance. Silicon Germanium (SiGe) is one possible material system that could be used to fabricate enhanced BTBT transistors. Rapid Melt Growth (RMG) is a technique that has been used to recrystallize materials on Si substrates. RMG, however, has not previously been applied to SiGe, a binary alloy with large separation in the liquidus-solidus curve in its phase diagram. The development of process and experimental results for obtaining SiGe-on-insulator (SGOI) from bulk Si substrates through RMG are presented. The theory of RMG is analyzed and compositional profiles obtained during RMG of SiGe are modeled to understand why we were able to obtain high quality lateral compositionally graded SGOI substrates. The success of RMG SiGe suggests that the RMG technique can also be applied to III-V ternary and quaternary compounds with similar pseudo-binary phase diagrams. This opens up a wide range of material possibilities with the potential for novel applications in heterogeneous integration and 3-D device technology.