Chiplet Design And Heterogeneous Integration Packaging
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Chiplet Design And Heterogeneous Integration Packaging
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Author : John H. Lau
language : en
Publisher: Springer Nature
Release Date : 2023-03-27
Chiplet Design And Heterogeneous Integration Packaging written by John H. Lau and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2023-03-27 with Technology & Engineering categories.
The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as chip partitioning, chip splitting, multiple system and heterogeneous integration with TSV-interposers, multiple system and heterogeneous integration with TSV-less interposers, chiplets lateral communication, system-in-package, fan-out wafer/panel-level packaging, and various Cu-Cu hybrid bonding. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.
Flip Chip Hybrid Bonding Fan In And Fan Out Technology
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Author : John H. Lau
language : en
Publisher: Springer
Release Date : 2024-08-18
Flip Chip Hybrid Bonding Fan In And Fan Out Technology written by John H. Lau and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2024-08-18 with Technology & Engineering categories.
This book focuses on the design, materials, process, fabrication, and reliability of flip chip, hybrid bonding, fan-in, and fan-out technology. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as wafer bumping, flip chip assembly, underfill and reliability, chip-to-wafer, wafer-to-wafer, Cu-Cu hybrid bonding, WLCSP, 6-side molded WLCSP, FOWLP such as hybrid substrates with PID, ABF, and ultra-large organic interposer, the communications between chiplets and heterogeneous integration packaging, and on-board optics, near-package optics, and co-packaged optics. The book benefits researchers, engineers, and graduate students in the fields of electrical engineering, mechanical engineering, materials sciences, industry engineering, etc.
Flip Chip Hybrid Bonding Fan In And Fan Out Technology
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Author : John H. Lau
language : en
Publisher: Springer Nature
Release Date :
Flip Chip Hybrid Bonding Fan In And Fan Out Technology written by John H. Lau and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on with categories.
Semiconductor Advanced Packaging
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Author : John H. Lau
language : en
Publisher: Springer Nature
Release Date : 2021-05-17
Semiconductor Advanced Packaging written by John H. Lau and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2021-05-17 with Technology & Engineering categories.
The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.
Heterogeneous Integrations
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Author : John H. Lau
language : en
Publisher: Springer
Release Date : 2019-04-03
Heterogeneous Integrations written by John H. Lau and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-04-03 with Technology & Engineering categories.
Heterogeneous integration uses packaging technology to integrate dissimilar chips, LED, MEMS, VCSEL, etc. from different fabless houses and with different functions and wafer sizes into a single system or subsystem. How are these dissimilar chips and optical components supposed to talk to each other? The answer is redistribution layers (RDLs). This book addresses the fabrication of RDLs for heterogeneous integrations, and especially focuses on RDLs on: A) organic substrates, B) silicon substrates (through-silicon via (TSV)-interposers), C) silicon substrates (bridges), D) fan-out substrates, and E) ASIC, memory, LED, MEMS, and VCSEL systems. The book offers a valuable asset for researchers, engineers, and graduate students in the fields of semiconductor packaging, materials sciences, mechanical engineering, electronic engineering, telecommunications, networking, etc.
Foundations Of Heterogeneous Integration
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Author : Farhang Yazdani
language : en
Publisher:
Release Date : 2018
Foundations Of Heterogeneous Integration written by Farhang Yazdani and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018 with Heterogeneous distributed computing systems categories.
This book provides a practical, hands-on approach to teach the foundation of 2.5D/3D heterogeneous design. Based on the author's extensive, industrial experience, this book enables integrated circuit design techniques that provide more memory to the logic chip, also allowing for mixing chips and intellectual property blocks from any vendor to build a more complex chip, more efficiently and cost effectively. Various practical examples and industrial projects are presented throughout the book, including questions and term projects at the end of each chapter. This book is a great resource for practicing engineers and can be used at universities to teach a course at the senior undergraduate and graduate level. Provides knowledge and skills necessary to design wirebond, flip chip and system in package (SIP) products; Provides practical solutions for 2.5D/3D memory and logic integration, explaining a complex, multidisciplinary topic in straightforward terms; Demonstrates a unique co-design methodology for optimizing cross domain heterogeneous integration, including examples, pathfinding, packaging strategy, interposer structure, etc.; Includes real, industry-based examples to give readers hands-on practical design experience.
3d Ic Integration And Packaging
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Author : John H. Lau
language : en
Publisher: McGraw Hill Professional
Release Date : 2015-07-06
3d Ic Integration And Packaging written by John H. Lau and has been published by McGraw Hill Professional this book supported file pdf, txt, epub, kindle and other format this book has been release on 2015-07-06 with Technology & Engineering categories.
A comprehensive guide to 3D IC integration and packaging technology 3D IC Integration and Packaging fully explains the latest microelectronics techniques for increasing chip density and maximizing performance while reducing power consumption. Based on a course developed by its author, this practical guide offers real-world problem-solving methods and teaches the trade-offs inherent in making system-level decisions. Explore key enabling technologies such as TSV, thin-wafer strength measurement and handling, microsolder bumping, redistribution layers, interposers, wafer-to-wafer bonding, chip-to-wafer bonding, 3D IC and MEMS, LED, and complementary metal-oxide semiconductor image sensors integration. Assembly, thermal management, and reliability are covered in complete detail. 3D IC Integration and Packaging covers: • 3D integration for semiconductor IC packaging• Through-silicon vias modeling and testing• Stress sensors for thin-wafer handling and strength measurement• Package substrate technologies• Microbump fabrication, assembly, and reliability• 3D Si integration• 2.5D/3D IC integration• 3D IC integration with passive interposer• Thermal management of 2.5D/3D IC integration• Embedded 3D hybrid integration• 3D LED and IC integration• 3D MEMS and IC integration• 3D CMOS image sensors and IC integration• PoP, chip-to-chip interconnects, and embedded fan-out WLP
Packaging For Sustainability
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Author : Karli Verghese
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-03-18
Packaging For Sustainability written by Karli Verghese and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-03-18 with Technology & Engineering categories.
The packaging industry is under pressure from regulators, customers and other stakeholders to improve packaging’s sustainability by reducing its environmental and societal impacts. This is a considerable challenge because of the complex interactions between products and their packaging, and the many roles that packaging plays in the supply chain. Packaging for Sustainability is a concise and readable handbook for practitioners who are trying to implement sustainability strategies for packaging. Industry case studies are used throughout the book to illustrate possible applications and scenarios. Packaging for Sustainability draws on the expertise of researchers and industry practitioners to provide information on business benefits, environmental issues and priorities, environmental evaluation tools, design for environment, marketing strategies, and challenges for the future.
Interconnect Technologies For Integrated Circuits And Flexible Electronics
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Author : Yash Agrawal
language : en
Publisher: Springer Nature
Release Date : 2023-10-17
Interconnect Technologies For Integrated Circuits And Flexible Electronics written by Yash Agrawal and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2023-10-17 with Technology & Engineering categories.
This contributed book provides a thorough understanding of the basics along with detailed state-of-the-art emerging interconnect technologies for integrated circuit design and flexible electronics. It focuses on the investigation of advanced on-chip interconnects which match the current as well as future technology requirements. The contents focus on different aspects of interconnects such as material, physical characteristics, parasitic extraction, design, structure, modeling, machine learning, and neural network-based models for interconnects, signaling schemes, varying signal integrity performance analysis, variability, reliability aspects, associated electronic design automation tools. The book also explores interconnect technologies for flexible electronic systems. It also highlights the integration of sensors with stretchable interconnects to demonstrate the concept of a stretchable sensing network for wearable and flexible applications. This book is a useful guide for those working in academia and industry to understand the fundamentals and application of interconnect technologies.
Scaling Issues And Design Of Mems
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Author : Salvatore Baglio
language : en
Publisher: John Wiley & Sons
Release Date : 2008-07-31
Scaling Issues And Design Of Mems written by Salvatore Baglio and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2008-07-31 with Technology & Engineering categories.
This accessible volume delivers a complete design methodology for microelectromechanical systems (MEMS). Focusing on the scaling of an autonomous micro-system, it explains the real-world problems and theoretical concepts of several different aspects inherent to the miniaturization of sensors and actuators. It reports on the analysis of dimensional scaling, the modelling, design and experimental characterization of a wide range of specific devices and applications, including: temperature microsensors based on an integrated complementary metal-oxide-semiconductor (CMOS) thermocouple; mechanical sensors; inductive microsensors for the detection of magnetic particles; electrostatic, thermal and magnetic actuators. With an original approach, this informative text encompasses the entire range of themes currently at the forefront of MEMS, including an analysis of the importantissue of energy sources in MEMS. In addition, the book explores contemporary research into the design of complete MEMS with a case study on colonies of microbots. Scaling Issues and Design of MEMS aims to improve the reader’s basic knowledge on modelling issues of complex micro devices, and to encourage new thinking about scaling effects. It will provide support for practising engineers working within the defence industry and will also be of welcome interest to graduate students and researchers with a background in electronic engineering, physics, chemistry, biology and materials science.