Chiplet Design And Heterogeneous Integration Packaging

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Chiplet Design And Heterogeneous Integration Packaging

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Author : John H. Lau
language : en
Publisher: Springer Nature
Release Date : 2023-03-27

Chiplet Design And Heterogeneous Integration Packaging written by John H. Lau and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2023-03-27 with Technology & Engineering categories.

The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as chip partitioning, chip splitting, multiple system and heterogeneous integration with TSV-interposers, multiple system and heterogeneous integration with TSV-less interposers, chiplets lateral communication, system-in-package, fan-out wafer/panel-level packaging, and various Cu-Cu hybrid bonding. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.

Hybrid Bonding Advanced Substrates Failure Mechanisms And Thermal Management For Chiplets And Heterogeneous Integration

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Author : John Lau
language : en
Publisher: Springer Nature
Release Date : 2025-05-18

Hybrid Bonding Advanced Substrates Failure Mechanisms And Thermal Management For Chiplets And Heterogeneous Integration written by John Lau and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2025-05-18 with Technology & Engineering categories.

The book focuses on the design, materials, process, fabrication, failure mechanism, reliability, modeling, and thermal management of chiplets and heterogeneous integration. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as hybrid bonding, advanced substrates, failure mechanisms, and modeling due to thermal stresses, moisture absorption, impact loading such as drop as well as electric current driven electromigration, and the fundamentals of thermal management. Each topic is treated with in-depth analysis to bridge foundational principles with real-world engineering challenges. This book is an essential resource for researchers, engineers, and students in electrical engineering, mechanical engineering, materials science, and industrial engineering, equipping them with the knowledge to advance innovation in semiconductor packaging and integration.

Flip Chip Hybrid Bonding Fan In And Fan Out Technology

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Author : John H. Lau
language : en
Publisher: Springer Nature
Release Date : 2024-05-23

Flip Chip Hybrid Bonding Fan In And Fan Out Technology written by John H. Lau and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2024-05-23 with Technology & Engineering categories.

This book focuses on the design, materials, process, fabrication, and reliability of flip chip, hybrid bonding, fan-in, and fan-out technology. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as wafer bumping, flip chip assembly, underfill and reliability, chip-to-wafer, wafer-to-wafer, Cu-Cu hybrid bonding, WLCSP, 6-side molded WLCSP, FOWLP such as hybrid substrates with PID, ABF, and ultra-large organic interposer, the communications between chiplets and heterogeneous integration packaging, and on-board optics, near-package optics, and co-packaged optics. The book benefits researchers, engineers, and graduate students in the fields of electrical engineering, mechanical engineering, materials sciences, industry engineering, etc.

Semiconductor Advanced Packaging

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Author : John H. Lau
language : en
Publisher: Springer Nature
Release Date : 2021-05-17

Semiconductor Advanced Packaging written by John H. Lau and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2021-05-17 with Technology & Engineering categories.

The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.

Hardware Security

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Author : Mark Tehranipoor
language : en
Publisher: Springer Nature
Release Date : 2024-06-11

Hardware Security written by Mark Tehranipoor and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2024-06-11 with Technology & Engineering categories.

This book provides a look into the future of hardware and microelectronics security, with an emphasis on potential directions in security-aware design, security verification and validation, building trusted execution environments, and physical assurance. The book emphasizes some critical questions that must be answered in the domain of hardware and microelectronics security in the next 5-10 years: (i) The notion of security must be migrated from IP-level to system-level; (ii) What would be the future of IP and IC protection against emerging threats; (iii) How security solutions could be migrated/expanded from SoC-level to SiP-level; (iv) the advances in power side-channel analysis with emphasis on post-quantum cryptography algorithms; (v) how to enable digital twin for secure semiconductor lifecycle management; and (vi) how physical assurance will look like with considerations of emerging technologies. The main aim of this book is to serve as a comprehensive and concise roadmap for new learners and educators navigating the evolving research directions in the domain of hardware and microelectronic securities. Overall, throughout 11 chapters, the book provides numerous frameworks, countermeasures, security evaluations, and roadmaps for the future of hardware security.

Heterogeneous Integrations

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Author : John H. Lau
language : en
Publisher: Springer
Release Date : 2019-04-03

Heterogeneous Integrations written by John H. Lau and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-04-03 with Technology & Engineering categories.

Heterogeneous integration uses packaging technology to integrate dissimilar chips, LED, MEMS, VCSEL, etc. from different fabless houses and with different functions and wafer sizes into a single system or subsystem. How are these dissimilar chips and optical components supposed to talk to each other? The answer is redistribution layers (RDLs). This book addresses the fabrication of RDLs for heterogeneous integrations, and especially focuses on RDLs on: A) organic substrates, B) silicon substrates (through-silicon via (TSV)-interposers), C) silicon substrates (bridges), D) fan-out substrates, and E) ASIC, memory, LED, MEMS, and VCSEL systems. The book offers a valuable asset for researchers, engineers, and graduate students in the fields of semiconductor packaging, materials sciences, mechanical engineering, electronic engineering, telecommunications, networking, etc.

Interconnect Technologies For Integrated Circuits And Flexible Electronics

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Author : Yash Agrawal
language : en
Publisher: Springer Nature
Release Date : 2023-09-21

Interconnect Technologies For Integrated Circuits And Flexible Electronics written by Yash Agrawal and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2023-09-21 with Technology & Engineering categories.

This contributed book provides a thorough understanding of the basics along with detailed state-of-the-art emerging interconnect technologies for integrated circuit design and flexible electronics. It focuses on the investigation of advanced on-chip interconnects which match the current as well as future technology requirements. The contents focus on different aspects of interconnects such as material, physical characteristics, parasitic extraction, design, structure, modeling, machine learning, and neural network-based models for interconnects, signaling schemes, varying signal integrity performance analysis, variability, reliability aspects, associated electronic design automation tools. The book also explores interconnect technologies for flexible electronic systems. It also highlights the integration of sensors with stretchable interconnects to demonstrate the concept of a stretchable sensing network for wearable and flexible applications. This book is a useful guide for those working in academia and industry to understand the fundamentals and application of interconnect technologies.

The History Of The Gpu Eras And Environment

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Author : Jon Peddie
language : en
Publisher: Springer Nature
Release Date : 2023-01-01

The History Of The Gpu Eras And Environment written by Jon Peddie and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2023-01-01 with Computers categories.

This is the second book in a three-part series that traces the development of the GPU, which is defined as a single chip with an integrated transform and lighting (T&L) capability. This feature previously was found in workstations as a stand-alone chip that only performed geometry functions. Enabled by Moore’s law, the first era of GPUs began in the late 1990s. Silicon Graphics (SGI) introduced T&L first in 1996 with the Nintendo 64 chipset with integrated T&L but didn’t follow through. ArtX developed a chipset with integrated T&L but didn’t bring it to market until November 1999. The need to integrate the transform and lighting functions in the graphics controller was well understood and strongly desired by dozens of companies. Nvidia was the first to produce a PC consumer level single chip with T&L in October 1999. All in all, fifteen companies came close, they had designs and experience, but one thing or another got in their way to prevent them succeeding. All the forces and technology were converging; the GPU was ready to emerge. Several of the companies involved did produce an integrated GPU, but not until early 2000. This is the account of those companies, the GPU and the environment needed to support it. The GPU has become ubiquitous and can be found in every platform that involves a computer and a user interface.

More Than Moore

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Author : Guo Qi Zhang
language : en
Publisher: Springer Science & Business Media
Release Date : 2010-01-23

More Than Moore written by Guo Qi Zhang and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2010-01-23 with Technology & Engineering categories.

In the past decades, the mainstream of microelectronics progression was mainly powered by Moore's law focusing on IC miniaturization down to nano scale. However, there is a fast increasing need for "More than Moore" (MtM) products and technology that are based upon or derived from silicon technologies, but do not simply scale with Moore’s law. This book provides new vision, strategy and guidance for the future technology and business development of micro/nanoelectronics.

Design And Application Of Intelligent Thermally Conductive Materials

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Author : Wei Feng
language : en
Publisher: Elsevier
Release Date : 2025-03-14

Design And Application Of Intelligent Thermally Conductive Materials written by Wei Feng and has been published by Elsevier this book supported file pdf, txt, epub, kindle and other format this book has been release on 2025-03-14 with Technology & Engineering categories.

Design and Application of Intelligent Thermally Conductive Materials is a current, comprehensive, reference resource, providing information on the structure, design, and application of these newly developed materials in various contexts, together with an analysis of future trends and applications. The author presents a detailed description of the application of these intelligent materials to a wide range of uses, and also of their particular importance in the development and application of advanced chips. It provides postgraduates and senior undergraduates with an essential overview of thermal conductivity, from which to appreciate the descriptions of intelligent thermal conductivity.For all readers, including researchers, industry professionals, and technicians in the field, chapters on the structure, design, development and performance of intelligent thermal conductive materials provide essential information. While the potential future demand for these materials is enormous, the author indicates where developmental, technical, and production bottlenecks may occur. The possible use of intelligent thermal conductive materials in a wide range of contexts is discussed, together with their potential for energy saving and resource conservation. - Focuses on the newly evolving field of intelligent thermal conductive materials: a new type of functional materials designed for rapid heat diversion and management that enables autonomous response to the thermal environment using intelligent thermal conductivity control - Covers a broad range of topics relating to these newly-developed materials: from the structure of the basic materials to the design and application of intelligent materials - Discusses the application capacity for this type of intelligent or smart material - Provides updates on potential bottlenecks to the development, design, related technology, and production of these materials