Ulsi Process Integration 9

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Ulsi Process Integration 9

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Author : C. Claeys
language : en
Publisher: The Electrochemical Society
Release Date : 2015

Ulsi Process Integration 9 written by C. Claeys and has been published by The Electrochemical Society this book supported file pdf, txt, epub, kindle and other format this book has been release on 2015 with categories.

Ulsi Process Integration

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Author : Cor L. Claeys
language : en
Publisher: The Electrochemical Society
Release Date : 1999

Ulsi Process Integration written by Cor L. Claeys and has been published by The Electrochemical Society this book supported file pdf, txt, epub, kindle and other format this book has been release on 1999 with Computers categories.

Ulsi Process Integration 6

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Author : C. Claeys
language : en
Publisher: The Electrochemical Society
Release Date : 2009-09

Ulsi Process Integration 6 written by C. Claeys and has been published by The Electrochemical Society this book supported file pdf, txt, epub, kindle and other format this book has been release on 2009-09 with Science categories.

ULSI Process Integration 6 covers all aspects of process integration. Sections are devoted to 1) Device Technologies, 2) Front-end-of-line integration (gate stacks, shallow junctions, dry etching, etc.), 3) Back-end-of-line integration (CMP, low-k, Cu interconnect, air-gaps, 3D packaging, etc.), 4) Alternative channel technologies (Ge, III-V, hybrid integration), and 5) Emerging technologies (CNT, graphene, polymer electronics, nanotubes).

Ulsi Process Integration 5

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Author : Cor L. Claeys
language : en
Publisher: The Electrochemical Society
Release Date : 2007

Ulsi Process Integration 5 written by Cor L. Claeys and has been published by The Electrochemical Society this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007 with Technology & Engineering categories.

The symposium provided a forum for reviewing and discussing all aspects of process integration, with special focus on nanoscaled technologies, 65 nm and beyond on DRAM, SRAM, flash memory, high density logic-low power, RF, mixed analog-digital, process integration yield, CMP chemistries, low-k processes, gate stacks, metal gates, rapid thermal processing, silicides, copper interconnects, carbon nanotubes, novel materials, high mobility substrates (SOI, sSi, SiGe, GeOI), strain engineering, and hybrid integration.

Ulsi Process Integration 7

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Author : C. Claeys
language : en
Publisher: The Electrochemical Society
Release Date : 2011

Ulsi Process Integration 7 written by C. Claeys and has been published by The Electrochemical Society this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011 with categories.

Ulsi Process Integration Iii

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Author : Electrochemical Society. Meeting
language : en
Publisher: The Electrochemical Society
Release Date : 2003

Ulsi Process Integration Iii written by Electrochemical Society. Meeting and has been published by The Electrochemical Society this book supported file pdf, txt, epub, kindle and other format this book has been release on 2003 with Technology & Engineering categories.

Advanced Interconnects For Ulsi Technology

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Author : Mikhail Baklanov
language : en
Publisher: John Wiley & Sons
Release Date : 2012-04-02

Advanced Interconnects For Ulsi Technology written by Mikhail Baklanov and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-04-02 with Technology & Engineering categories.

Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects, and discusses: Interconnect functions, characterisations, electrical properties and wiring requirements Low-k materials: fundamentals, advances and mechanical properties Conductive layers and barriers Integration and reliability including mechanical reliability, electromigration and electrical breakdown New approaches including 3D, optical, wireless interchip, and carbon-based interconnects Intended for postgraduate students and researchers, in academia and industry, this book provides a critical overview of the enabling technology at the heart of the future development of computer chips.

Semiconductor Process Integration 10

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Author : J. Murota
language : en
Publisher: The Electrochemical Society
Release Date :

Semiconductor Process Integration 10 written by J. Murota and has been published by The Electrochemical Society this book supported file pdf, txt, epub, kindle and other format this book has been release on with categories.

Sige Ge And Related Compounds Materials Processing And Devices 8

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Author : Q. Liu
language : en
Publisher: The Electrochemical Society
Release Date : 2018-09-21

Sige Ge And Related Compounds Materials Processing And Devices 8 written by Q. Liu and has been published by The Electrochemical Society this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-09-21 with Science categories.

Ulsi Process Integration 9

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Author : C. Claeys
language : en
Publisher:
Release Date : 2015

Ulsi Process Integration 9 written by C. Claeys and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2015 with categories.