Ulsi Process Integration Iii
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Ulsi Process Integration Iii
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Author : Electrochemical Society. Meeting
language : en
Publisher: The Electrochemical Society
Release Date : 2003
Ulsi Process Integration Iii written by Electrochemical Society. Meeting and has been published by The Electrochemical Society this book supported file pdf, txt, epub, kindle and other format this book has been release on 2003 with Technology & Engineering categories.
Ulsi Process Integration Ii
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Author : Cor L. Claeys
language : en
Publisher: The Electrochemical Society
Release Date : 2001
Ulsi Process Integration Ii written by Cor L. Claeys and has been published by The Electrochemical Society this book supported file pdf, txt, epub, kindle and other format this book has been release on 2001 with Technology & Engineering categories.
Advanced Interconnects For Ulsi Technology
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Author : Mikhail Baklanov
language : en
Publisher: John Wiley & Sons
Release Date : 2012-04-02
Advanced Interconnects For Ulsi Technology written by Mikhail Baklanov and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-04-02 with Technology & Engineering categories.
Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects, and discusses: Interconnect functions, characterisations, electrical properties and wiring requirements Low-k materials: fundamentals, advances and mechanical properties Conductive layers and barriers Integration and reliability including mechanical reliability, electromigration and electrical breakdown New approaches including 3D, optical, wireless interchip, and carbon-based interconnects Intended for postgraduate students and researchers, in academia and industry, this book provides a critical overview of the enabling technology at the heart of the future development of computer chips.
Ulsi Semiconductor Technology Atlas
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Author : Chih-Hang Tung
language : en
Publisher: John Wiley & Sons
Release Date : 2003-10-06
Ulsi Semiconductor Technology Atlas written by Chih-Hang Tung and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2003-10-06 with Technology & Engineering categories.
More than 1,100 TEM images illustrate the science of ULSI The natural outgrowth of VLSI (Very Large Scale Integration), Ultra Large Scale Integration (ULSI) refers to semiconductor chips with more than 10 million devices per chip. Written by three renowned pioneers in their field, ULSI Semiconductor Technology Atlas uses examples and TEM (Transmission Electron Microscopy) micrographs to explain and illustrate ULSI process technologies and their associated problems. The first book available on the subject to be illustrated using TEM images, ULSI Semiconductor Technology Atlas is logically divided into four parts: * Part I includes basic introductions to the ULSI process, device construction analysis, and TEM sample preparation * Part II focuses on key ULSI modules--ion implantation and defects, dielectrics and isolation structures, silicides/salicides, and metallization * Part III examines integrated devices, including complete planar DRAM, stacked cell DRAM, and trench cell DRAM, as well as SRAM as examples for process integration and development * Part IV emphasizes special applications, including TEM in advanced failure analysis, TEM in advanced packaging development and UBM (Under Bump Metallization) studies, and high-resolution TEM in microelectronics This innovative guide also provides engineers and managers in the microelectronics industry, as well as graduate students, with: * More than 1,100 TEM images to illustrate the science of ULSI * A historical introduction to the technology as well as coverage of the evolution of basic ULSI process problems and issues * Discussion of TEM in other advanced microelectronics devices and materials, such as flash memories, SOI, SiGe devices, MEMS, and CD-ROMs
Advanced Nanoscale Ulsi Interconnects Fundamentals And Applications
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Author : Yosi Shacham-Diamand
language : en
Publisher: Springer Science & Business Media
Release Date : 2009-09-19
Advanced Nanoscale Ulsi Interconnects Fundamentals And Applications written by Yosi Shacham-Diamand and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2009-09-19 with Science categories.
In Advanced ULSI interconnects – fundamentals and applications we bring a comprehensive description of copper-based interconnect technology for ultra-lar- scale integration (ULSI) technology for integrated circuit (IC) application. In- grated circuit technology is the base for all modern electronics systems. You can ?nd electronics systems today everywhere: from toys and home appliances to a- planes and space shuttles. Electronics systems form the hardware that together with software are the bases of the modern information society. The rapid growth and vast exploitation of modern electronics system create a strong demand for new and improved electronic circuits as demonstrated by the amazing progress in the ?eld of ULSI technology. This progress is well described by the famous “Moore’s law” which states, in its most general form, that all the metrics that describe integrated circuit performance (e. g. , speed, number of devices, chip area) improve expon- tially as a function of time. For example, the number of components per chip d- bles every 18 months and the critical dimension on a chip has shrunk by 50% every 2 years on average in the last 30 years. This rapid growth in integrated circuits te- nology results in highly complex integrated circuits with an increasing number of interconnects on chips and between the chip and its package. The complexity of the interconnect network on chips involves an increasing number of metal lines per interconnect level, more interconnect levels, and at the same time a reduction in the interconnect line critical dimensions.
Introduction To Microfabrication
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Author : Sami Franssila
language : en
Publisher: John Wiley & Sons
Release Date : 2005-01-28
Introduction To Microfabrication written by Sami Franssila and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2005-01-28 with Technology & Engineering categories.
Microfabrication is the key technology behind integrated circuits,microsensors, photonic crystals, ink jet printers, solar cells andflat panel displays. Microsystems can be complex, but the basicmicrostructures and processes of microfabrication are fairlysimple. Introduction to Microfabrication shows how the commonmicrofabrication concepts can be applied over and over again tocreate devices with a wide variety of structures andfunctions. Featuring: * A comprehensive presentation of basic fabrication processes * An emphasis on materials and microstructures, rather than devicephysics * In-depth discussion on process integration showing how processes,materials and devices interact * A wealth of examples of both conceptual and real devices Introduction to Microfabrication includes 250 homework problems forstudents to familiarise themselves with micro-scale materials,dimensions, measurements, costs and scaling trends. Both researchand manufacturing topics are covered, with an emphasis on silicon,which is the workhorse of microfabrication. This book will serve as an excellent first text for electricalengineers, chemists, physicists and materials scientists who wishto learn about microstructures and microfabrication techniques,whether in MEMS, microelectronics or emerging applications.
Microelectronics Microsystems And Nanotechnology
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Author : Androula G. Nassiopoulou
language : en
Publisher: World Scientific
Release Date : 2001
Microelectronics Microsystems And Nanotechnology written by Androula G. Nassiopoulou and has been published by World Scientific this book supported file pdf, txt, epub, kindle and other format this book has been release on 2001 with Technology & Engineering categories.
This volume contains papers on the following: CMOS devices and devices based on compound semiconductors; processing; silicon integrated technology and integrated circuit design; quantum physics; nanotechnology; nanodevices, sensors and microsystems. The latest news and future challenges in these fields are presented in invited papers.
Wafer Scale Integration Iii
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Author : Mariagiovanna Sami
language : en
Publisher: North Holland
Release Date : 1990
Wafer Scale Integration Iii written by Mariagiovanna Sami and has been published by North Holland this book supported file pdf, txt, epub, kindle and other format this book has been release on 1990 with Technology & Engineering categories.
The purpose of this book is to give an up-to-date presentation of architectures and technologies for wafer-scale integration. As such, it is an overview of the work of the leading research centers active in this area, and an outline of expected evolution and progress in the subject. New technological solutions are envisioned; while the use of optical technologies for interconnections promises to overcome one of the main restrictions to architectures on a wafer, the extension of quick-prototyping solutions to the wafer dimension allows the introduction of wafer-scale systems in educational environments as well as in applications where a quick result and limited production would make traditional silicon solutions unacceptable. Regarding architectures and their applications, three different lines of approach can be identified. Evolutive solutions are proposed, mainly concerning array architectures and restructuring techniques. Innovative architectures are presented, several papers dealing with neural nets. There are also architectures designed not just for experimental reasons but for industrial production. Overall, non-numerical applications predominate.
Rapid Thermal And Other Short Time Processing Technologies Iii
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Author : Paul J. Timans
language : en
Publisher: The Electrochemical Society
Release Date : 2002
Rapid Thermal And Other Short Time Processing Technologies Iii written by Paul J. Timans and has been published by The Electrochemical Society this book supported file pdf, txt, epub, kindle and other format this book has been release on 2002 with Technology & Engineering categories.
Microelectronics Microsystems And Nanotechnology Papers Presented Of At Mmn 2000
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Author : Androula G Nassiopoulou
language : en
Publisher: World Scientific
Release Date : 2001-10-19
Microelectronics Microsystems And Nanotechnology Papers Presented Of At Mmn 2000 written by Androula G Nassiopoulou and has been published by World Scientific this book supported file pdf, txt, epub, kindle and other format this book has been release on 2001-10-19 with Technology & Engineering categories.
This volume contains papers on the following: CMOS devices and devices based on compound semiconductors; processing; silicon integrated technology and integrated circuit design; quantum physics; nanotechnology; nanodevices, sensors and microsystems. The latest news and future challenges in these fields are presented in invited papers.