Advanced Packaging
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Advanced Packaging
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Author :
language : en
Publisher:
Release Date : 2009-01
Advanced Packaging written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2009-01 with categories.
Advanced Packaging serves the semiconductor packaging, assembly and test industry. Strategically focused on emerging and leading-edge methods for manufacturing and use of advanced packages.
Semiconductor Advanced Packaging
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Author : John H. Lau
language : en
Publisher: Springer Nature
Release Date : 2021-05-17
Semiconductor Advanced Packaging written by John H. Lau and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2021-05-17 with Technology & Engineering categories.
The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.
Materials For Advanced Packaging
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Author : Daniel Lu
language : en
Publisher: Springer
Release Date : 2016-11-18
Materials For Advanced Packaging written by Daniel Lu and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2016-11-18 with Technology & Engineering categories.
Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.
Advanced Packaging
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Author :
language : en
Publisher:
Release Date : 2007-08
Advanced Packaging written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007-08 with categories.
Advanced Packaging serves the semiconductor packaging, assembly and test industry. Strategically focused on emerging and leading-edge methods for manufacturing and use of advanced packages.
Advanced Packaging
DOWNLOAD
Author :
language : en
Publisher:
Release Date : 2008-05
Advanced Packaging written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2008-05 with categories.
Advanced Packaging serves the semiconductor packaging, assembly and test industry. Strategically focused on emerging and leading-edge methods for manufacturing and use of advanced packages.
Advanced Packaging
DOWNLOAD
Author :
language : en
Publisher:
Release Date : 2008-08
Advanced Packaging written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2008-08 with categories.
Advanced Packaging serves the semiconductor packaging, assembly and test industry. Strategically focused on emerging and leading-edge methods for manufacturing and use of advanced packages.
Advanced Packaging
DOWNLOAD
Author :
language : en
Publisher:
Release Date : 2009-01
Advanced Packaging written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2009-01 with categories.
Advanced Packaging serves the semiconductor packaging, assembly and test industry. Strategically focused on emerging and leading-edge methods for manufacturing and use of advanced packages.
Advanced Packaging
DOWNLOAD
Author :
language : en
Publisher:
Release Date : 2009-01
Advanced Packaging written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2009-01 with categories.
Advanced Packaging serves the semiconductor packaging, assembly and test industry. Strategically focused on emerging and leading-edge methods for manufacturing and use of advanced packages.